KR101980921B1 - 선택적 스펙트럼 모니터링을 이용한 종료점 지정 - Google Patents

선택적 스펙트럼 모니터링을 이용한 종료점 지정 Download PDF

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KR101980921B1
KR101980921B1 KR1020130126070A KR20130126070A KR101980921B1 KR 101980921 B1 KR101980921 B1 KR 101980921B1 KR 1020130126070 A KR1020130126070 A KR 1020130126070A KR 20130126070 A KR20130126070 A KR 20130126070A KR 101980921 B1 KR101980921 B1 KR 101980921B1
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sequence
spectrum
measured
spectra
measured spectrum
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KR20140051798A (ko
Inventor
준 치안
시바쿠마르 단다파니
벤자민 체리안
토마스 에이치. 오스터헬드
제프리 드류 데이비드
그레고리 이. 멘크
보구슬로 에이. 스웨덱
도일 이. 베네트
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020130126070A 2012-10-23 2013-10-22 선택적 스펙트럼 모니터링을 이용한 종료점 지정 Active KR101980921B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/658,737 US9221147B2 (en) 2012-10-23 2012-10-23 Endpointing with selective spectral monitoring
US13/658,737 2012-10-23

Publications (2)

Publication Number Publication Date
KR20140051798A KR20140051798A (ko) 2014-05-02
KR101980921B1 true KR101980921B1 (ko) 2019-05-21

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KR1020130126070A Active KR101980921B1 (ko) 2012-10-23 2013-10-22 선택적 스펙트럼 모니터링을 이용한 종료점 지정

Country Status (4)

Country Link
US (1) US9221147B2 (enExample)
JP (1) JP6292819B2 (enExample)
KR (1) KR101980921B1 (enExample)
TW (1) TWI643701B (enExample)

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US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
KR20170092522A (ko) 2014-09-08 2017-08-11 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 금속 격자 및 이의 측정 방법
CN107097154B (zh) * 2017-04-28 2023-06-13 昆明理工大学 一种简易抛光液流量控制供给装置及其控制方法
US10964609B2 (en) * 2018-11-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for detecting end point
CN119486839A (zh) * 2022-06-22 2025-02-18 应用材料公司 用于控制抛光处理的窗口逻辑

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US20110081829A1 (en) 2009-10-06 2011-04-07 Shinrou Ohta Polishing endpoint detection method and polishing endpoint detection apparatus
US20120124589A1 (en) 2010-11-12 2012-05-17 Jeff Rupley Matrix algorithm for scheduling operations

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US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
TW398036B (en) 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
US6358327B1 (en) 1999-06-29 2002-03-19 Applied Materials, Inc. Method for endpoint detection using throttle valve position
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6618130B2 (en) 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US6806948B2 (en) 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US8260446B2 (en) 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
US7998358B2 (en) * 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
WO2010062497A2 (en) * 2008-10-27 2010-06-03 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US8751033B2 (en) 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
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US20110282477A1 (en) * 2010-05-17 2011-11-17 Applied Materials, Inc. Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
TWI478259B (zh) * 2010-07-23 2015-03-21 Applied Materials Inc 用於終點偵測之二維光譜特徵追蹤
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US8694144B2 (en) * 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US20120100781A1 (en) * 2010-10-20 2012-04-26 Jimin Zhang Multiple matching reference spectra for in-situ optical monitoring
US20120278028A1 (en) 2011-04-28 2012-11-01 Jeffrey Drue David Generating model based spectra library for polishing
KR101892914B1 (ko) 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
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JP2010519771A (ja) 2007-02-23 2010-06-03 アプライド マテリアルズ インコーポレイテッド スペクトルを使用した研磨終了点の決定
US20110081829A1 (en) 2009-10-06 2011-04-07 Shinrou Ohta Polishing endpoint detection method and polishing endpoint detection apparatus
JP2011082286A (ja) 2009-10-06 2011-04-21 Ebara Corp 研磨終点検知方法および研磨終点検知装置
US20120124589A1 (en) 2010-11-12 2012-05-17 Jeff Rupley Matrix algorithm for scheduling operations

Also Published As

Publication number Publication date
TWI643701B (zh) 2018-12-11
JP2014086733A (ja) 2014-05-12
JP6292819B2 (ja) 2018-03-14
US20140113524A1 (en) 2014-04-24
KR20140051798A (ko) 2014-05-02
US9221147B2 (en) 2015-12-29
TW201422368A (zh) 2014-06-16

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