JP2014086514A - 撮像装置、その製造方法及びカメラ - Google Patents

撮像装置、その製造方法及びカメラ Download PDF

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Publication number
JP2014086514A
JP2014086514A JP2012233300A JP2012233300A JP2014086514A JP 2014086514 A JP2014086514 A JP 2014086514A JP 2012233300 A JP2012233300 A JP 2012233300A JP 2012233300 A JP2012233300 A JP 2012233300A JP 2014086514 A JP2014086514 A JP 2014086514A
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Japan
Prior art keywords
opening
insulating layer
interlayer insulating
manufacturing
etching
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Pending
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JP2012233300A
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English (en)
Japanese (ja)
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JP2014086514A5 (enExample
Inventor
Hideomi Kumano
秀臣 熊野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012233300A priority Critical patent/JP2014086514A/ja
Priority to US14/049,409 priority patent/US9659991B2/en
Priority to CN201310496053.2A priority patent/CN103779369B/zh
Publication of JP2014086514A publication Critical patent/JP2014086514A/ja
Publication of JP2014086514A5 publication Critical patent/JP2014086514A5/ja
Priority to US15/442,940 priority patent/US10361231B2/en
Pending legal-status Critical Current

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  • Solid State Image Pick-Up Elements (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2012233300A 2012-10-22 2012-10-22 撮像装置、その製造方法及びカメラ Pending JP2014086514A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2012233300A JP2014086514A (ja) 2012-10-22 2012-10-22 撮像装置、その製造方法及びカメラ
US14/049,409 US9659991B2 (en) 2012-10-22 2013-10-09 Image capturing apparatus, manufacturing method thereof, and camera
CN201310496053.2A CN103779369B (zh) 2012-10-22 2013-10-22 摄像装置、其制造方法和照相机
US15/442,940 US10361231B2 (en) 2012-10-22 2017-02-27 Image capturing apparatus, manufacturing method thereof, and camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012233300A JP2014086514A (ja) 2012-10-22 2012-10-22 撮像装置、その製造方法及びカメラ

Publications (2)

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JP2014086514A true JP2014086514A (ja) 2014-05-12
JP2014086514A5 JP2014086514A5 (enExample) 2015-12-03

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JP2012233300A Pending JP2014086514A (ja) 2012-10-22 2012-10-22 撮像装置、その製造方法及びカメラ

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JP (1) JP2014086514A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183661A (ja) * 2016-03-31 2017-10-05 キヤノン株式会社 光電変換装置およびカメラ
JPWO2018173872A1 (ja) * 2017-03-24 2020-01-30 ソニーセミコンダクタソリューションズ株式会社 センサチップおよび電子機器
JPWO2021085172A1 (enExample) * 2019-10-30 2021-05-06

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02264473A (ja) * 1989-04-04 1990-10-29 Mitsubishi Electric Corp 固体撮像素子
JPH03257868A (ja) * 1990-03-07 1991-11-18 Mitsubishi Electric Corp 赤外線イメージセンサ
JPH0766178A (ja) * 1993-08-27 1995-03-10 Fujitsu Ltd 半導体装置の製造方法
US6989602B1 (en) * 2000-09-21 2006-01-24 Agere Systems Inc. Dual damascene process with no passing metal features
US20060145219A1 (en) * 2004-12-30 2006-07-06 Lim Keun H CMOS image sensor and method for fabricating the same
US20070040102A1 (en) * 2005-08-22 2007-02-22 Micron Technology, Inc. Method and apparatus providing an optical guide for an imager pixel having a ring of air-filled spaced slots around a photosensor
JP2008147333A (ja) * 2006-12-08 2008-06-26 Sony Corp 固体撮像装置、その製造方法および撮像装置
JP2008235689A (ja) * 2007-03-22 2008-10-02 Sharp Corp 固体撮像素子およびその製造方法、電子情報機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02264473A (ja) * 1989-04-04 1990-10-29 Mitsubishi Electric Corp 固体撮像素子
JPH03257868A (ja) * 1990-03-07 1991-11-18 Mitsubishi Electric Corp 赤外線イメージセンサ
JPH0766178A (ja) * 1993-08-27 1995-03-10 Fujitsu Ltd 半導体装置の製造方法
US6989602B1 (en) * 2000-09-21 2006-01-24 Agere Systems Inc. Dual damascene process with no passing metal features
US20060145219A1 (en) * 2004-12-30 2006-07-06 Lim Keun H CMOS image sensor and method for fabricating the same
US20070040102A1 (en) * 2005-08-22 2007-02-22 Micron Technology, Inc. Method and apparatus providing an optical guide for an imager pixel having a ring of air-filled spaced slots around a photosensor
JP2008147333A (ja) * 2006-12-08 2008-06-26 Sony Corp 固体撮像装置、その製造方法および撮像装置
JP2008235689A (ja) * 2007-03-22 2008-10-02 Sharp Corp 固体撮像素子およびその製造方法、電子情報機器

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017183661A (ja) * 2016-03-31 2017-10-05 キヤノン株式会社 光電変換装置およびカメラ
JPWO2018173872A1 (ja) * 2017-03-24 2020-01-30 ソニーセミコンダクタソリューションズ株式会社 センサチップおよび電子機器
US11855112B2 (en) 2017-03-24 2023-12-26 Sony Semiconductor Solutions Corporation Sensor chip and electronic apparatus
JPWO2021085172A1 (enExample) * 2019-10-30 2021-05-06
WO2021085172A1 (ja) * 2019-10-30 2021-05-06 ソニーセミコンダクタソリューションズ株式会社 受光素子、測距モジュール、および、電子機器
JP7631213B2 (ja) 2019-10-30 2025-02-18 ソニーセミコンダクタソリューションズ株式会社 受光素子、測距モジュール、および、電子機器

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