JP2014086393A5 - - Google Patents

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Publication number
JP2014086393A5
JP2014086393A5 JP2012236901A JP2012236901A JP2014086393A5 JP 2014086393 A5 JP2014086393 A5 JP 2014086393A5 JP 2012236901 A JP2012236901 A JP 2012236901A JP 2012236901 A JP2012236901 A JP 2012236901A JP 2014086393 A5 JP2014086393 A5 JP 2014086393A5
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JP
Japan
Prior art keywords
charged particle
particle beam
incident angle
beam apparatus
calibrated
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JP2012236901A
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English (en)
Japanese (ja)
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JP2014086393A (ja
JP5965819B2 (ja
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Priority claimed from JP2012236901A external-priority patent/JP5965819B2/ja
Priority to JP2012236901A priority Critical patent/JP5965819B2/ja
Priority to TW102134768A priority patent/TWI498522B/zh
Priority to KR1020157009208A priority patent/KR101712298B1/ko
Priority to US14/435,203 priority patent/US9224575B2/en
Priority to PCT/JP2013/078678 priority patent/WO2014065311A1/ja
Publication of JP2014086393A publication Critical patent/JP2014086393A/ja
Publication of JP2014086393A5 publication Critical patent/JP2014086393A5/ja
Publication of JP5965819B2 publication Critical patent/JP5965819B2/ja
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JP2012236901A 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法 Active JP5965819B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012236901A JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法
TW102134768A TWI498522B (zh) 2012-10-26 2013-09-26 Measurement method of charged particle beam device and stacking misalignment
PCT/JP2013/078678 WO2014065311A1 (ja) 2012-10-26 2013-10-23 荷電粒子線装置及び重ね合わせずれ量測定方法
US14/435,203 US9224575B2 (en) 2012-10-26 2013-10-23 Charged particle beam device and overlay misalignment measurement method
KR1020157009208A KR101712298B1 (ko) 2012-10-26 2013-10-23 하전 입자선 장치 및 중첩 어긋남량 측정 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012236901A JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法

Publications (3)

Publication Number Publication Date
JP2014086393A JP2014086393A (ja) 2014-05-12
JP2014086393A5 true JP2014086393A5 (cg-RX-API-DMAC7.html) 2015-08-13
JP5965819B2 JP5965819B2 (ja) 2016-08-10

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JP2012236901A Active JP5965819B2 (ja) 2012-10-26 2012-10-26 荷電粒子線装置及び重ね合わせずれ量測定方法

Country Status (5)

Country Link
US (1) US9224575B2 (cg-RX-API-DMAC7.html)
JP (1) JP5965819B2 (cg-RX-API-DMAC7.html)
KR (1) KR101712298B1 (cg-RX-API-DMAC7.html)
TW (1) TWI498522B (cg-RX-API-DMAC7.html)
WO (1) WO2014065311A1 (cg-RX-API-DMAC7.html)

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WO2017184301A1 (en) * 2016-04-22 2017-10-26 Applied Materials, Inc. Method for pecvd overlay improvement
JP6850234B2 (ja) * 2017-09-29 2021-03-31 株式会社日立ハイテク 荷電粒子線装置
KR102313921B1 (ko) 2017-10-13 2021-10-18 주식회사 히타치하이테크 패턴 계측 장치 및 패턴 계측 방법
US10403471B2 (en) * 2017-11-29 2019-09-03 Asml Netherlands B.V. Systems and methods for charged particle beam modulation
US10473460B2 (en) * 2017-12-11 2019-11-12 Kla-Tencor Corporation Overlay measurements of overlapping target structures based on symmetry of scanning electron beam signals
JP2019164886A (ja) * 2018-03-19 2019-09-26 株式会社日立ハイテクノロジーズ ビーム照射装置
JP7093242B2 (ja) * 2018-06-27 2022-06-29 株式会社ニューフレアテクノロジー 荷電粒子ビーム画像取得装置
JP2020187876A (ja) 2019-05-13 2020-11-19 株式会社日立ハイテク 荷電粒子線装置
JP2021034163A (ja) * 2019-08-20 2021-03-01 株式会社日立ハイテク 荷電粒子ビームシステム、及び重ね合わせずれ量測定方法
CN114303039B (zh) * 2019-08-23 2024-01-09 株式会社日立高新技术 重叠测量系统以及重叠测量装置
KR102797797B1 (ko) * 2019-08-28 2025-04-22 주식회사 히타치하이테크 하전 입자빔 시스템, 및 중첩 어긋남량 측정 방법
EP3915130A4 (en) * 2019-10-30 2022-11-02 Yangtze Memory Technologies Co., Ltd. METHOD FOR CALIBRATION OF THE VERTICALITY OF A PARTICLE BEAM AND SYSTEM APPLIED TO A SEMICONDUCTOR MANUFACTURING PROCESS
US11054753B1 (en) * 2020-04-20 2021-07-06 Applied Materials Israel Ltd. Overlay monitoring
JP2022112137A (ja) 2021-01-21 2022-08-02 株式会社日立ハイテク 荷電粒子ビーム装置
TWI885216B (zh) * 2021-01-29 2025-06-01 日商日立高新技術科學股份有限公司 試料片移設裝置
US20250385070A1 (en) * 2022-09-30 2025-12-18 Asml Netherlands B.V. Scanning electron microscopy (sem) back-scattering electron (bse) focused target and method

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JP3291880B2 (ja) 1993-12-28 2002-06-17 株式会社日立製作所 走査形電子顕微鏡
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