JP2014077124A - 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 - Google Patents
異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 Download PDFInfo
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- JP2014077124A JP2014077124A JP2013190904A JP2013190904A JP2014077124A JP 2014077124 A JP2014077124 A JP 2014077124A JP 2013190904 A JP2013190904 A JP 2013190904A JP 2013190904 A JP2013190904 A JP 2013190904A JP 2014077124 A JP2014077124 A JP 2014077124A
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- adhesive layer
- insulating adhesive
- conductive film
- anisotropic conductive
- conductive
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Images
Classifications
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Abstract
【解決手段】第1の絶縁性接着剤層30と、第2の絶縁性接着剤層31と、第1の絶縁性
接着剤層30及び第2の絶縁性接着剤層31に挟持され、導電性粒子32が絶縁性接着剤
33に含有された導電性粒子含有層34とを有し、導電性粒子含有層34と第1の絶縁性
接着剤層30との間に気泡41が含有され、導電性粒子含有層34は、第2の絶縁性接着
剤層31と接する導電性粒子32の下部の硬化度が他の部位の硬化度よりも低い。
【選択図】図2
Description
本発明に係る異方性導電フィルムの一実施形態を用いて製造された接続体である液晶表示装置は、いわゆるCOG(chip on glass)実装によって液晶駆動用ICが直接液晶表示パネルの基板上に実装され、また、いわゆるFOG(film on glass)実装によって液晶駆動回路が形成されたフレキシブル基板が直接液晶表示パネルの基板上に実装される。
次いで、異方性導電フィルム23について説明する。異方性導電フィルム23は、図2に示すように、第1の絶縁性接着剤層30と、第2の絶縁性接着剤層31と、第1の絶縁性接着剤層30及び第2の絶縁性接着剤層31に挟持され、導電性粒子32が絶縁性接着剤33に含有された導電性粒子含有層34とを有する。
第1、第2の絶縁性接着剤層30,31は、いずれも熱硬化性の接着剤であり、膜形成樹脂と、熱硬化性樹脂と、硬化剤とを含有する有機樹脂バインダーが剥離基材35,36に支持されてなる。また、第1、第2の絶縁性接着剤層30,31は、熱硬化性と光硬化性を共に含む接着剤でもよく、光硬化性の接着剤のみでもよい。この場合でも、膜形成樹脂等は公知の材料を使用できる。剥離基材35,36についても同様である。
第1の絶縁性接着剤層30及び第2の絶縁性接着剤層31は、導電性粒子含有層34を挟持する。導電性粒子含有層34は、紫外線硬化型の接着剤であり、膜形成樹脂と、熱硬化性樹脂と、硬化剤と、導電性粒子32とを含有する。
また、導電性粒子含有層34は、後述するように、導電性粒子32が転着された後、一面34aに予め紫外線が照射され、その後に第1の絶縁性接着剤層30がラミネートされる。したがって、導電性粒子含有層34は、一面34a側の硬化反応が進行している。また、導電性粒子含有層34は、紫外光が遮られる導電性粒子32の下部、すなわち、導電性粒子32より第2の絶縁性接着剤層31と接する他面34b側の硬化度は、他の部位の硬化度よりも低い。
導電性粒子含有層34は、第1の絶縁性接着剤層30との間に気泡41が含有されている。気泡41は、異方性導電フィルム23を用いた電子部品18の接続後に、異方性導電フィルム23における内部応力を緩和させ、これにより透明基板12の反りを防止するものである。すなわち、異方性導電フィルム23は、各層30,31,34の接着剤成分の硬化収縮に伴い応力が発生するが、導電性粒子含有層34と第1の絶縁性接着剤層30との間に含有された気泡41による応力緩和作用によって透明基板12の反りを抑制することができる。
次いで、本発明の一実施形態に係る異方性導電フィルム23の製造方法について説明する。先ず、導電性粒子を配列するための型を用意する。型は、図4に示すように、例えば導電性粒子が充填される開口51が規則的に形成された金型50が用いられる。金型50は、スキージなどを用いて導電性粒子32が充填される。これにより、導電性粒子32は、金型50の表面に、開口51のパターンに応じたパターンに配列される。
次いで、本発明の一実施形態に係る異方性導電フィルム23を用いた接続工程について説明する。異方性導電フィルム23を介して電子部品18を端子部17aへ接続する場合は、先ず、剥離基材35を剥離し、露出した第1の絶縁性接着剤層30を透明電極17の端子部17a上に載置し、剥離基材36上から異方性導電フィルム23を図示しない仮圧着手段によって仮圧着する。
導電性粒子含有層は、下記表1及び表2に示す配合組成からなる有機樹脂バインダー(固形分50%)をPETフィルムにバーコーターで塗布し、70℃5分で熱風乾燥し、厚みが5μmの接着層フィルムを作成した。
絶縁性接着剤層は、下記表1及び表2に示す配合組成からなる有機樹脂バインダーをPETフィルムにバーコーターで塗布し、80℃3分で熱風乾燥し、厚みが5μmの接着層フィルムを作成した。
次いで、導電性粒子含有層と絶縁性接着剤層とをラミネートし異方性導電フィルムのサンプルを作製した。先ず、導電性粒子含有層の凹凸パターンが形成された一面側に第1の絶縁性接着剤層を、ロール表面温度45℃のラミネーターでラミネートした。
評価素子として、
外形;1.8mm×20mm
厚さ;0.5mm
Au−platedバンプ外形;30μm×85μm
Au−platedバンプ高さ;15μm
の評価用ICを用いた。
12a 縁部、16,17 透明電極、17a 端子部、18 電子部品、
18a 接続端子、20 COG実装部、23、123 異方性導電フィルム、
30、130 第1の絶縁性接着剤層、31、131 第2の絶縁性接着剤層、
32、132 導電性粒子、33、133 絶縁性接着剤、
34、134 導電性粒子含有層、34a、134a 一面、
34b、134b 他面、35,36、135、136 剥離基材、
40、140 凹凸パターン、40a、140a 凸部、40b、140b 凹部、
41、141 気泡、50 金型、51 開口、55 接着剤層、56 剥離基材、
142 液状組成物
Claims (18)
- 第1の絶縁性接着剤層と、
第2の絶縁性接着剤層と、
上記第1の絶縁性接着剤層及び上記第2の絶縁性接着剤層に挟持され、導電性粒子が絶縁性接着剤に含有された導電性粒子含有層とを有し、
上記導電性粒子含有層と上記第1の絶縁性接着剤層との間に気泡が含有され、
上記導電性粒子含有層は、上記第2の絶縁性接着剤層と接する、上記導電性粒子の下部の硬化度が他の部位の硬化度よりも低い異方性導電フィルム。 - 上記導電性粒子含有層は、上記導電性粒子が単層かつ規則的に配列されている請求項1記載の異方性導電フィルム。
- 上記導電性粒子含有層は、上記導電性粒子の一部が上記第1の絶縁性接着剤層との界面に露出している請求項1又は請求項2に記載の異方性導電フィルム。
- 上記導電性粒子含有層は、光硬化型の接着剤層である請求項1〜3のいずれか1項に記載の異方性導電フィルム。
- 上記第1、第2の絶縁性接着剤層の硬化系が、カチオン硬化系、アニオン硬化系又はラジカル硬化系のいずれかである請求項1〜4のいずれか1項に記載の異方性導電フィルム。
- 上記気泡のサイズが5μm未満である請求項1〜5のいずれか1項に記載の異方性導電フィルム。
- 上記導電性粒子含有層は、上記導電性粒子を含有する箇所の厚さが、上記導電性粒子間の厚さよりも厚い請求項1〜6のいずれか1項に記載の異方性導電フィルム。
- 上記気泡は、上記導電性粒子間に形成された凹部に内包されている請求項7記載の異方性導電フィルム。
- 上記第1の絶縁性接着剤層と上記導電性粒子との間、又は上記第2の絶縁性接着剤層と上記導電性粒子との間の何れかの部位に液状組成物が設けられる請求項1〜7のいずれか1項に記載の異方性導電フィルム。
- 上記気泡に前記液状組成物が含まれる請求項9記載の異方性導電フィルム。
- 開口を有する型の上記開口に導電性粒子を配列させ、上記型の上記導電性粒子が配列された面に、光硬化型の接着剤層が剥離基材に支持された接着フィルムの上記接着剤層をラミネートし、
上記剥離基材の上面から上記接着剤層を上記型に加圧し、上記接着剤層を上記開口に押し込み、
上記接着フィルムを上記型から剥離して、上記接着剤層の表面に上記導電性粒子を上記表面より一部露出させて貼着させるとともに上記型に応じた凹凸形状が成型された導電性粒子含有層を形成し、
上記導電性粒子含有層の凹凸形状が形成された表面に光を照射して、上記表面を硬化させ、
上記導電性粒子含有層の上記表面に第1の絶縁性接着剤層をラミネートし、上記導電性粒子含有層と上記第1の絶縁性接着剤層との間に気泡を含有させ、
上記導電性粒子含有層の上記表面と反対側の裏面に第2の絶縁性接着剤層をラミネートする異方性導電フィルムの製造方法。 - 上記接着剤層の表面には、上記導電性粒子が単層かつ規則的に配列されている請求項11記載の異方性導電フィルムの製造方法。
- 上記導電性粒子含有層は、上記第2の絶縁性接着剤層と接する、上記導電性粒子の下部の硬化度が他の部位の硬化度よりも低い請求項11又は請求項12に記載の異方性導電フィルムの製造方法。
- 上記型の上記導電性粒子が配列された上記面に上記接着フィルムをラミネートする前における該面、又は上記導電性粒子含有層の上記表面に第1の絶縁性接着剤層をラミネートする前における該表面に、極微量の液体組成物を塗布又は噴霧する請求項11〜13のいずれかに記載の異方性導電フィルムの製造方法。
- 請求項1〜10のいずれか1項に記載の異方性導電フィルムを用いて、第1の電子部品の端子と第2の電子部品の端子とが異方性導電接続された接続体の製造方法において、
上記第1の電子部品上に上記異方性導電フィルムの上記第1の絶縁性接着剤層を仮貼りし、
上記第2の絶縁性接着剤層上に上記第2の電子部品を仮搭載し、
上記第2の電子部品上から加熱押圧又は光照射で接合する接続体の製造方法。 - 上記導電性粒子含有層は、上記第1の絶縁性接着剤層と接する一面に凹凸形状が設けられ、
上記異方性導電フィルムは、上記導電性粒子を含有する凸部を上記第1の電子部品側に向けて仮貼りされる請求項15記載の接続体の製造方法。 - 請求項1〜10のいずれか1項に記載の異方性導電フィルムを用いて、第1の電子部品の端子と第2の電子部品の端子とを異方性導電接続する接続方法において、
上記第1の電子部品上に上記異方性導電フィルムの上記第1の絶縁性接着剤層を仮貼りし、
上記第2の絶縁性接着剤層上に上記第2の電子部品を仮搭載し、
上記第2の電子部品上から加熱押圧又は光照射で接合する接続方法。 - 上記導電性粒子含有層は、上記第1の絶縁性接着剤層と接する一面に凹凸形状が設けられ、
上記異方性導電フィルムは、上記導電性粒子を含有する凸部を上記第1の電子部品側に向けて仮貼りされる請求項17記載の接続方法。
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JP2013190904A JP5972844B2 (ja) | 2012-09-18 | 2013-09-13 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
KR1020157009362A KR101857331B1 (ko) | 2012-09-18 | 2013-09-17 | 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법 |
US14/428,582 US9960139B2 (en) | 2012-09-18 | 2013-09-17 | Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method |
PCT/JP2013/075024 WO2014046082A1 (ja) | 2012-09-18 | 2013-09-17 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
CN201610840005.4A CN106939146B (zh) | 2012-09-18 | 2013-09-17 | 各向异性导电膜及其制法、连接体及其制法以及连接方法 |
KR1020187012713A KR101975730B1 (ko) | 2012-09-18 | 2013-09-17 | 이방성 도전 필름, 이방성 도전 필름의 제조 방법, 접속체의 제조 방법 및 접속 방법 |
CN201380048543.4A CN104619799B (zh) | 2012-09-18 | 2013-09-17 | 各向异性导电膜、各向异性导电膜的制造方法、连接体的制造方法及连接方法 |
TW102133766A TWI557208B (zh) | 2012-09-18 | 2013-09-18 | An anisotropic conductive film, an anisotropic conductive film manufacturing method, a method for manufacturing a connecting body, and a connecting method |
HK15107276.3A HK1206772A1 (en) | 2012-09-18 | 2015-07-30 | Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method |
US15/926,210 US10373926B2 (en) | 2012-09-18 | 2018-03-20 | Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method |
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JP7062389B2 (ja) * | 2017-08-23 | 2022-05-06 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN110850648B (zh) * | 2019-10-29 | 2022-05-31 | 武汉华星光电技术有限公司 | 一种显示面板及其制作方法 |
WO2023219356A1 (ko) * | 2022-05-09 | 2023-11-16 | 주식회사 마이다스에이치앤티 | 도전볼을 포함하는 연신성 이방 전도성 필름 및 이의 제조방법 |
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US10373926B2 (en) | 2019-08-06 |
CN106939146B (zh) | 2021-11-05 |
CN104619799A (zh) | 2015-05-13 |
CN106939146A (zh) | 2017-07-11 |
KR101975730B1 (ko) | 2019-08-28 |
US9960139B2 (en) | 2018-05-01 |
WO2014046082A1 (ja) | 2014-03-27 |
JP5972844B2 (ja) | 2016-08-17 |
KR20180050438A (ko) | 2018-05-14 |
US20150243626A1 (en) | 2015-08-27 |
HK1206772A1 (en) | 2016-01-15 |
TW201432017A (zh) | 2014-08-16 |
KR101857331B1 (ko) | 2018-05-11 |
US20180218994A1 (en) | 2018-08-02 |
CN104619799B (zh) | 2016-10-12 |
KR20150058312A (ko) | 2015-05-28 |
TWI557208B (zh) | 2016-11-11 |
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