|
JPS592318A
(ja)
*
|
1982-06-28 |
1984-01-07 |
Toshiba Mach Co Ltd |
半導体気相成長装置
|
|
JPS6146023A
(ja)
*
|
1984-08-10 |
1986-03-06 |
Ushio Inc |
超高圧水銀灯による半導体ウエハ−材料の露光方法
|
|
AT389959B
(de)
|
1987-11-09 |
1990-02-26 |
Sez Semiconduct Equip Zubehoer |
Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
|
|
JPH0213958A
(ja)
*
|
1988-06-30 |
1990-01-18 |
Mitsubishi Electric Corp |
レジスト現像装置
|
|
JPH05299350A
(ja)
*
|
1992-04-20 |
1993-11-12 |
Nec Corp |
基板加熱機構
|
|
GB9412918D0
(en)
*
|
1994-06-28 |
1994-08-17 |
Baxendine Alar R |
Apparatus for uniformly heating a substrate
|
|
TW386235B
(en)
|
1995-05-23 |
2000-04-01 |
Tokyo Electron Ltd |
Method for spin rinsing
|
|
US6198074B1
(en)
*
|
1996-09-06 |
2001-03-06 |
Mattson Technology, Inc. |
System and method for rapid thermal processing with transitional heater
|
|
US5965047A
(en)
*
|
1997-10-24 |
1999-10-12 |
Steag Ast |
Rapid thermal processing (RTP) system with rotating substrate
|
|
JP2000334397A
(ja)
|
1999-05-31 |
2000-12-05 |
Kokusai Electric Co Ltd |
板状試料の流体処理装置及び板状試料の流体処理方法
|
|
US6536454B2
(en)
|
2000-07-07 |
2003-03-25 |
Sez Ag |
Device for treating a disc-shaped object
|
|
WO2003021642A2
(en)
*
|
2001-08-31 |
2003-03-13 |
Applied Materials, Inc. |
Method and apparatus for processing a wafer
|
|
JP4050505B2
(ja)
*
|
2001-12-07 |
2008-02-20 |
芝浦メカトロニクス株式会社 |
スピン処理装置及び処理方法
|
|
KR100498609B1
(ko)
*
|
2002-05-18 |
2005-07-01 |
주식회사 하이닉스반도체 |
배치형 원자층 증착 장치
|
|
EP1609172B1
(en)
|
2003-03-20 |
2009-01-14 |
Sez Ag |
Device and method for wet treatment of disc-shaped articles
|
|
US8277569B2
(en)
*
|
2004-07-01 |
2012-10-02 |
Dainippon Screen Mfg. Co., Ltd. |
Substrate treating apparatus and substrate treating method
|
|
TWI267405B
(en)
|
2004-07-20 |
2006-12-01 |
Sez Ag |
Fluid discharging device
|
|
US7509035B2
(en)
*
|
2004-09-27 |
2009-03-24 |
Applied Materials, Inc. |
Lamp array for thermal processing exhibiting improved radial uniformity
|
|
US7112763B2
(en)
*
|
2004-10-26 |
2006-09-26 |
Applied Materials, Inc. |
Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
|
|
JP4680044B2
(ja)
*
|
2005-11-24 |
2011-05-11 |
東京エレクトロン株式会社 |
液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
|
|
US7914626B2
(en)
*
|
2005-11-24 |
2011-03-29 |
Tokyo Electron Limited |
Liquid processing method and liquid processing apparatus
|
|
KR101061945B1
(ko)
*
|
2005-11-24 |
2011-09-05 |
도쿄엘렉트론가부시키가이샤 |
액 처리 방법, 액 처리 장치 및 이를 행하는 제어프로그램이 기억된 컴퓨터 판독 가능한 기억 매체
|
|
GB0621816D0
(en)
*
|
2006-11-02 |
2006-12-13 |
Westfaelische Wilhelms Uni Mun |
Imaging of cells or viruses
|
|
TWI373804B
(en)
|
2007-07-13 |
2012-10-01 |
Lam Res Ag |
Apparatus and method for wet treatment of disc-like articles
|
|
US8254767B2
(en)
*
|
2008-08-29 |
2012-08-28 |
Applied Materials, Inc. |
Method and apparatus for extended temperature pyrometry
|
|
JP5195175B2
(ja)
*
|
2008-08-29 |
2013-05-08 |
東京エレクトロン株式会社 |
成膜装置、成膜方法及び記憶媒体
|
|
US8294068B2
(en)
*
|
2008-09-10 |
2012-10-23 |
Applied Materials, Inc. |
Rapid thermal processing lamphead with improved cooling
|
|
SG176708A1
(en)
|
2009-07-16 |
2012-01-30 |
Lam Res Ag |
Method for drying a semiconductor wafer
|
|
US8596623B2
(en)
|
2009-12-18 |
2013-12-03 |
Lam Research Ag |
Device and process for liquid treatment of a wafer shaped article
|
|
CN101922042B
(zh)
*
|
2010-08-19 |
2012-05-30 |
江苏中晟半导体设备有限公司 |
一种外延片托盘支撑旋转联接装置
|
|
US20120103371A1
(en)
|
2010-10-28 |
2012-05-03 |
Lam Research Ag |
Method and apparatus for drying a semiconductor wafer
|
|
US9355883B2
(en)
*
|
2011-09-09 |
2016-05-31 |
Lam Research Ag |
Method and apparatus for liquid treatment of wafer shaped articles
|
|
US9093482B2
(en)
*
|
2012-10-12 |
2015-07-28 |
Lam Research Ag |
Method and apparatus for liquid treatment of wafer shaped articles
|