JP2014038949A5 - - Google Patents

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Publication number
JP2014038949A5
JP2014038949A5 JP2012180816A JP2012180816A JP2014038949A5 JP 2014038949 A5 JP2014038949 A5 JP 2014038949A5 JP 2012180816 A JP2012180816 A JP 2012180816A JP 2012180816 A JP2012180816 A JP 2012180816A JP 2014038949 A5 JP2014038949 A5 JP 2014038949A5
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JP
Japan
Prior art keywords
substrate
processing
gas
peripheral
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012180816A
Other languages
English (en)
Japanese (ja)
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JP2014038949A (ja
JP6046417B2 (ja
Filing date
Publication date
Priority claimed from JP2012180816A external-priority patent/JP6046417B2/ja
Priority to JP2012180816A priority Critical patent/JP6046417B2/ja
Application filed filed Critical
Priority to TW102121801A priority patent/TWI576938B/zh
Priority to KR1020130087363A priority patent/KR101586534B1/ko
Priority to US13/953,954 priority patent/US10002770B2/en
Publication of JP2014038949A publication Critical patent/JP2014038949A/ja
Publication of JP2014038949A5 publication Critical patent/JP2014038949A5/ja
Publication of JP6046417B2 publication Critical patent/JP6046417B2/ja
Application granted granted Critical
Priority to US15/974,248 priority patent/US20180254190A1/en
Priority to US16/899,472 priority patent/US11217452B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012180816A 2012-08-17 2012-08-17 基板処理装置、および基板処理方法 Active JP6046417B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2012180816A JP6046417B2 (ja) 2012-08-17 2012-08-17 基板処理装置、および基板処理方法
TW102121801A TWI576938B (zh) 2012-08-17 2013-06-19 基板處理裝置及基板處理方法
KR1020130087363A KR101586534B1 (ko) 2012-08-17 2013-07-24 기판 처리 장치 및 기판 처리 방법
US13/953,954 US10002770B2 (en) 2012-08-17 2013-07-30 Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
US15/974,248 US20180254190A1 (en) 2012-08-17 2018-05-08 Substrate processing device and substrate processing method for carrying out chemical treatment for substrate
US16/899,472 US11217452B2 (en) 2012-08-17 2020-06-11 Substrate processing device and substrate processing method for carrying out chemical treatment for substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012180816A JP6046417B2 (ja) 2012-08-17 2012-08-17 基板処理装置、および基板処理方法

Publications (3)

Publication Number Publication Date
JP2014038949A JP2014038949A (ja) 2014-02-27
JP2014038949A5 true JP2014038949A5 (enExample) 2015-10-01
JP6046417B2 JP6046417B2 (ja) 2016-12-14

Family

ID=50286850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012180816A Active JP6046417B2 (ja) 2012-08-17 2012-08-17 基板処理装置、および基板処理方法

Country Status (1)

Country Link
JP (1) JP6046417B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6389089B2 (ja) * 2014-09-18 2018-09-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI585842B (zh) * 2014-09-30 2017-06-01 Shibaura Mechatronics Corp Substrate processing device
JP2017191883A (ja) * 2016-04-14 2017-10-19 トヨタ自動車株式会社 ウエハ処理装置
JP6797622B2 (ja) * 2016-09-27 2020-12-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP6770886B2 (ja) 2016-12-28 2020-10-21 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及び基板処理方法
JP7138539B2 (ja) * 2018-10-18 2022-09-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7752023B2 (ja) * 2020-12-18 2025-10-09 東京エレクトロン株式会社 基板処理方法及び基板処理装置
KR102622986B1 (ko) * 2020-12-31 2024-01-10 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
US12085849B2 (en) * 2021-04-13 2024-09-10 Applied Materials, Inc. Baking chamber with shroud for mask clean
CN114695210B (zh) * 2022-06-02 2022-09-09 西安奕斯伟材料科技有限公司 一种用于硅片边缘刻蚀的装置和方法
CN119278501A (zh) * 2022-06-08 2025-01-07 东京毅力科创株式会社 基片处理装置、基片处理方法和计算机可读取的存储介质

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002141326A (ja) * 2000-11-01 2002-05-17 Hitachi Ltd 板状試料の流体処理方法ならびにその装置
JP2005191511A (ja) * 2003-12-02 2005-07-14 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4342343B2 (ja) * 2004-02-26 2009-10-14 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2007005711A (ja) * 2005-06-27 2007-01-11 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP4679479B2 (ja) * 2006-09-28 2011-04-27 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP2008098440A (ja) * 2006-10-12 2008-04-24 Matsushita Electric Ind Co Ltd 半導体装置の洗浄装置及び洗浄方法
JP2009170554A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置の製造方法
JP2010147262A (ja) * 2008-12-19 2010-07-01 Tokyo Electron Ltd 洗浄装置、基板処理システム、洗浄方法、プログラム及びコンピュータ記憶媒体

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