JP2014017418A5 - - Google Patents

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Publication number
JP2014017418A5
JP2014017418A5 JP2012154975A JP2012154975A JP2014017418A5 JP 2014017418 A5 JP2014017418 A5 JP 2014017418A5 JP 2012154975 A JP2012154975 A JP 2012154975A JP 2012154975 A JP2012154975 A JP 2012154975A JP 2014017418 A5 JP2014017418 A5 JP 2014017418A5
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JP
Japan
Prior art keywords
polishing
wafer
film thickness
film
thickness
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JP2012154975A
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English (en)
Japanese (ja)
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JP6046933B2 (ja
JP2014017418A (ja
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Priority claimed from JP2012154975A external-priority patent/JP6046933B2/ja
Priority to JP2012154975A priority Critical patent/JP6046933B2/ja
Application filed filed Critical
Priority to TW102123143A priority patent/TWI567813B/zh
Priority to KR1020130078854A priority patent/KR101767291B1/ko
Priority to US13/938,018 priority patent/US8951813B2/en
Publication of JP2014017418A publication Critical patent/JP2014017418A/ja
Priority to US14/589,988 priority patent/US20150111314A1/en
Publication of JP2014017418A5 publication Critical patent/JP2014017418A5/ja
Publication of JP6046933B2 publication Critical patent/JP6046933B2/ja
Application granted granted Critical
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JP2012154975A 2012-07-10 2012-07-10 研磨方法 Active JP6046933B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012154975A JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法
TW102123143A TWI567813B (zh) 2012-07-10 2013-06-28 Grinding method
KR1020130078854A KR101767291B1 (ko) 2012-07-10 2013-07-05 연마 방법
US13/938,018 US8951813B2 (en) 2012-07-10 2013-07-09 Method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing
US14/589,988 US20150111314A1 (en) 2012-07-10 2015-01-05 A method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012154975A JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法

Publications (3)

Publication Number Publication Date
JP2014017418A JP2014017418A (ja) 2014-01-30
JP2014017418A5 true JP2014017418A5 (https=) 2015-08-20
JP6046933B2 JP6046933B2 (ja) 2016-12-21

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ID=49914311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012154975A Active JP6046933B2 (ja) 2012-07-10 2012-07-10 研磨方法

Country Status (4)

Country Link
US (2) US8951813B2 (https=)
JP (1) JP6046933B2 (https=)
KR (1) KR101767291B1 (https=)
TW (1) TWI567813B (https=)

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* Cited by examiner, † Cited by third party
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TWI675721B (zh) * 2013-07-11 2019-11-01 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
US9997420B2 (en) * 2013-12-27 2018-06-12 Taiwan Semiconductor Manufacturing Company Limited Method and/or system for chemical mechanical planarization (CMP)
JP6293519B2 (ja) * 2014-03-05 2018-03-14 株式会社荏原製作所 研磨装置および研磨方法
JP6266493B2 (ja) 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
CN111584354B (zh) 2014-04-18 2021-09-03 株式会社荏原制作所 蚀刻方法
KR102388170B1 (ko) * 2014-09-02 2022-04-19 가부시키가이샤 에바라 세이사꾸쇼 종점 검출 방법, 연마 장치 및 연마 방법
JP6321579B2 (ja) * 2015-06-01 2018-05-09 株式会社日立国際電気 半導体装置の製造方法、基板処理システム、基板処理装置及びプログラム
JP6566897B2 (ja) * 2016-03-17 2019-08-28 東京エレクトロン株式会社 制御装置、基板処理システム、基板処理方法及びプログラム
US11626315B2 (en) * 2016-11-29 2023-04-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and planarization method thereof
JP7023063B2 (ja) * 2017-08-08 2022-02-21 株式会社荏原製作所 基板研磨装置及び方法
JP6902452B2 (ja) * 2017-10-19 2021-07-14 株式会社荏原製作所 研磨装置
JP7081919B2 (ja) * 2017-12-26 2022-06-07 株式会社ディスコ 加工装置
JP7316785B2 (ja) 2018-12-26 2023-07-28 株式会社荏原製作所 光学式膜厚測定システムの洗浄方法
US11623320B2 (en) 2019-08-21 2023-04-11 Applied Materials, Inc. Polishing head with membrane position control
JP7517832B2 (ja) * 2020-01-17 2024-07-17 株式会社荏原製作所 研磨ヘッドシステムおよび研磨装置
JP7361637B2 (ja) * 2020-03-09 2023-10-16 株式会社荏原製作所 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
JP7503418B2 (ja) * 2020-05-14 2024-06-20 株式会社荏原製作所 膜厚測定装置、研磨装置及び膜厚測定方法
JP7466434B2 (ja) * 2020-11-19 2024-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
CN114000192B (zh) * 2021-10-29 2023-10-13 北京北方华创微电子装备有限公司 半导体工艺设备以及晶圆位置状态的监测方法
JP7680347B2 (ja) * 2021-12-24 2025-05-20 株式会社荏原製作所 膜厚測定方法および膜厚測定装置
JP2024155058A (ja) * 2023-04-20 2024-10-31 株式会社荏原製作所 膜厚測定装置、膜厚測定方法及び基板研磨装置
DE102024123115A1 (de) * 2024-08-13 2026-02-19 Thales Deutschland Gmbh Vorrichtung zum Schleifen von Laserdioden, Verfahren zum Schleifen von Laserdioden sowie Steuereinrichtung
CN119897756B (zh) * 2025-04-02 2025-07-11 天通控股股份有限公司 一种提高钽酸锂键合片膜厚均匀性的方法

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JPH08240413A (ja) * 1995-01-06 1996-09-17 Toshiba Corp 膜厚測定装置及びポリシング装置
IL113829A (en) 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
JP3863624B2 (ja) * 1997-03-24 2006-12-27 不二越機械工業株式会社 ウェーハの研磨装置及びウェーハの研磨方法
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