JP2014007306A - パターン形成方法 - Google Patents
パターン形成方法 Download PDFInfo
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- JP2014007306A JP2014007306A JP2012142527A JP2012142527A JP2014007306A JP 2014007306 A JP2014007306 A JP 2014007306A JP 2012142527 A JP2012142527 A JP 2012142527A JP 2012142527 A JP2012142527 A JP 2012142527A JP 2014007306 A JP2014007306 A JP 2014007306A
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- film
- mask layer
- resist film
- processed
- etching
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000007261 regionalization Effects 0.000 title claims abstract description 6
- 238000005530 etching Methods 0.000 claims abstract description 25
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 8
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011737 fluorine Substances 0.000 claims abstract description 7
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 4
- 239000007789 gas Substances 0.000 description 24
- 239000004065 semiconductor Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
- H01L21/31138—Etching organic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
Abstract
【解決手段】 実施形態のパターン形成方法では、被加工膜上にマスク層が形成される。前記マスク層上に所定のパターンを有するレジスト膜が形成される。弗素を用いないエッチングガスにより前記マスク層がエッチングされる。前記レジスト膜が除去される。前記レジスト膜を除去した後、前記マスク層をマスクとして、フルオロカーボンガスを用いて前記被加工膜がエッチングされる。
【選択図】図1
Description
第1の実施形態に係るパターン形成方法について以下説明する。
2…被加工膜
3…反射防止膜
4…レジスト膜
Claims (5)
- 被加工膜上にマスク層を形成する工程と、
前記マスク層上に所定のパターンを有するレジスト膜を形成する工程と、
弗素を用いないエッチングガスにより前記マスク層をエッチングする工程と、
前記レジスト膜を除去する工程と、
前記レジスト膜を除去した後、前記マスク層をマスクとして、フルオロカーボンガスを用いて前記被加工膜をエッチングする工程と、
を備えたパターン形成方法。 - 前記フルオロカーボンガスは、C5HF7を含むことを特徴とする請求項1に記載のパターン形成方法。
- 前記マスク層は、反射防止膜であることを特徴とする請求項1又は請求項2に記載のパターン形成方法。
- 前記反射防止膜は、ポリエステルを含むことを特徴とする請求項3に記載のパターン形成方法。
- 前記レジスト膜の除去は、シクロヘキサノンを用いたウェット処理により行うことを特徴とする請求項1乃至請求項4のいずれか1項に記載のパターン形成方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012142527A JP2014007306A (ja) | 2012-06-25 | 2012-06-25 | パターン形成方法 |
US13/784,232 US20130344698A1 (en) | 2012-06-25 | 2013-03-04 | Pattern formation method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012142527A JP2014007306A (ja) | 2012-06-25 | 2012-06-25 | パターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014007306A true JP2014007306A (ja) | 2014-01-16 |
Family
ID=49774783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012142527A Pending JP2014007306A (ja) | 2012-06-25 | 2012-06-25 | パターン形成方法 |
Country Status (2)
Country | Link |
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US (1) | US20130344698A1 (ja) |
JP (1) | JP2014007306A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9934984B2 (en) * | 2015-09-09 | 2018-04-03 | International Business Machines Corporation | Hydrofluorocarbon gas-assisted plasma etch for interconnect fabrication |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10209134A (ja) * | 1996-08-22 | 1998-08-07 | Toshiba Corp | パターン形成方法 |
JP2004228242A (ja) * | 2003-01-21 | 2004-08-12 | Semiconductor Leading Edge Technologies Inc | 微細パターン形成方法 |
JP2007140252A (ja) * | 2005-11-21 | 2007-06-07 | Shin Etsu Chem Co Ltd | フォトレジスト膜のリワーク方法 |
JP2008235332A (ja) * | 2007-03-16 | 2008-10-02 | Nec Electronics Corp | 半導体装置の製造方法および制御システム |
JP2012043869A (ja) * | 2010-08-17 | 2012-03-01 | Nippon Zeon Co Ltd | エッチングガスおよびエッチング方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3813309A (en) * | 1969-12-23 | 1974-05-28 | Ibm | Method for stripping resists from substrates |
US7060628B2 (en) * | 2004-03-19 | 2006-06-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating a hard mask polysilicon gate |
KR100618907B1 (ko) * | 2005-07-30 | 2006-09-01 | 삼성전자주식회사 | 다중 반사 방지층을 포함한 반도체 구조물 및 그 구조물을이용한 pr 패턴 형성 방법 및 반도체 소자의 패턴 형성방법 |
WO2009041560A1 (ja) * | 2007-09-28 | 2009-04-02 | Zeon Corporation | プラズマエッチング方法 |
-
2012
- 2012-06-25 JP JP2012142527A patent/JP2014007306A/ja active Pending
-
2013
- 2013-03-04 US US13/784,232 patent/US20130344698A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10209134A (ja) * | 1996-08-22 | 1998-08-07 | Toshiba Corp | パターン形成方法 |
JP2004228242A (ja) * | 2003-01-21 | 2004-08-12 | Semiconductor Leading Edge Technologies Inc | 微細パターン形成方法 |
JP2007140252A (ja) * | 2005-11-21 | 2007-06-07 | Shin Etsu Chem Co Ltd | フォトレジスト膜のリワーク方法 |
JP2008235332A (ja) * | 2007-03-16 | 2008-10-02 | Nec Electronics Corp | 半導体装置の製造方法および制御システム |
JP2012043869A (ja) * | 2010-08-17 | 2012-03-01 | Nippon Zeon Co Ltd | エッチングガスおよびエッチング方法 |
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US20130344698A1 (en) | 2013-12-26 |
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