JP2013544952A - ナノ積層黄銅合金の電気化学析出の材料および過程 - Google Patents
ナノ積層黄銅合金の電気化学析出の材料および過程 Download PDFInfo
- Publication number
- JP2013544952A JP2013544952A JP2013520899A JP2013520899A JP2013544952A JP 2013544952 A JP2013544952 A JP 2013544952A JP 2013520899 A JP2013520899 A JP 2013520899A JP 2013520899 A JP2013520899 A JP 2013520899A JP 2013544952 A JP2013544952 A JP 2013544952A
- Authority
- JP
- Japan
- Prior art keywords
- nano
- plastic
- coating
- brass
- polymer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910001369 Brass Inorganic materials 0.000 title claims abstract description 156
- 239000010951 brass Substances 0.000 title claims abstract description 156
- 238000000034 method Methods 0.000 title claims abstract description 73
- 238000004070 electrodeposition Methods 0.000 title claims description 58
- 229910045601 alloy Inorganic materials 0.000 title claims description 39
- 239000000956 alloy Substances 0.000 title claims description 39
- 230000008569 process Effects 0.000 title description 34
- 239000000463 material Substances 0.000 title description 11
- 238000000576 coating method Methods 0.000 claims abstract description 145
- 229920003023 plastic Polymers 0.000 claims abstract description 77
- 239000004033 plastic Substances 0.000 claims abstract description 77
- 229920000307 polymer substrate Polymers 0.000 claims abstract description 64
- 239000011248 coating agent Substances 0.000 claims description 129
- 239000000758 substrate Substances 0.000 claims description 53
- 239000000203 mixture Substances 0.000 claims description 45
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 claims description 30
- 230000000737 periodic effect Effects 0.000 claims description 28
- 239000011701 zinc Substances 0.000 claims description 25
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 24
- 229910052725 zinc Inorganic materials 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000003792 electrolyte Substances 0.000 claims description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- 239000004593 Epoxy Substances 0.000 claims description 7
- 150000002739 metals Chemical class 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 6
- 229910052752 metalloid Inorganic materials 0.000 claims description 6
- 150000002738 metalloids Chemical class 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 6
- 229920000515 polycarbonate Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910021645 metal ion Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 238000013019 agitation Methods 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000002000 Electrolyte additive Substances 0.000 claims description 3
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 229920002873 Polyethylenimine Polymers 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 229920001643 poly(ether ketone) Polymers 0.000 claims description 3
- 229920006260 polyaryletherketone Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 2
- 239000008151 electrolyte solution Substances 0.000 claims description 2
- 239000010944 silver (metal) Substances 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052785 arsenic Inorganic materials 0.000 claims 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 3
- 229920000049 Carbon (fiber) Polymers 0.000 claims 2
- 239000004917 carbon fiber Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 239000003365 glass fiber Substances 0.000 claims 2
- 238000010348 incorporation Methods 0.000 claims 2
- 239000012764 mineral filler Substances 0.000 claims 2
- 230000001747 exhibiting effect Effects 0.000 claims 1
- 229920002457 flexible plastic Polymers 0.000 claims 1
- 229910052741 iridium Inorganic materials 0.000 claims 1
- 229910052702 rhenium Inorganic materials 0.000 claims 1
- 229910052703 rhodium Inorganic materials 0.000 claims 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 23
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 23
- 238000005253 cladding Methods 0.000 description 12
- 239000000523 sample Substances 0.000 description 9
- 238000007747 plating Methods 0.000 description 8
- 239000002659 electrodeposit Substances 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000001208 nuclear magnetic resonance pulse sequence Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 231100001231 less toxic Toxicity 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006277 sulfonation reaction Methods 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36692410P | 2010-07-22 | 2010-07-22 | |
| US61/366,924 | 2010-07-22 | ||
| PCT/US2011/045128 WO2012012789A1 (en) | 2010-07-22 | 2011-07-22 | Material and process for electrochemical deposition of nanolaminated brass alloys |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015251694A Division JP6196285B2 (ja) | 2010-07-22 | 2015-12-24 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013544952A true JP2013544952A (ja) | 2013-12-19 |
| JP2013544952A5 JP2013544952A5 (enExample) | 2014-08-28 |
Family
ID=45497201
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013520899A Pending JP2013544952A (ja) | 2010-07-22 | 2011-07-22 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
| JP2015251694A Active JP6196285B2 (ja) | 2010-07-22 | 2015-12-24 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
| JP2017157381A Pending JP2018040052A (ja) | 2010-07-22 | 2017-08-17 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015251694A Active JP6196285B2 (ja) | 2010-07-22 | 2015-12-24 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
| JP2017157381A Pending JP2018040052A (ja) | 2010-07-22 | 2017-08-17 | ナノ積層黄銅合金の電気化学析出の材料および過程 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9732433B2 (enExample) |
| EP (1) | EP2596150B1 (enExample) |
| JP (3) | JP2013544952A (enExample) |
| CN (2) | CN105386103B (enExample) |
| CA (1) | CA2806328C (enExample) |
| WO (1) | WO2012012789A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021085059A (ja) * | 2019-11-27 | 2021-06-03 | 住友金属鉱山株式会社 | 銅張積層板の製造方法 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2619509C (en) | 2005-08-12 | 2015-01-06 | Modumetal, Llc. | Compositionally modulated composite materials and methods for making the same |
| CA2730229C (en) | 2008-07-07 | 2017-02-14 | John D. Whitaker | Property modulated materials and methods of making the same |
| CN102639758B (zh) | 2009-06-08 | 2016-05-18 | 莫杜美拓有限公司 | 用于防腐蚀的电镀纳米叠层涂层和包层 |
| CA2806328C (en) | 2010-07-22 | 2019-01-22 | Modumetal Llc | Material and process for electrochemical deposition of nanolaminated brass alloys |
| EA201500948A1 (ru) | 2013-03-15 | 2016-03-31 | Модьюметл, Инк. | Способ изготовления изделия и изделие, изготовленное вышеуказанным способом |
| US10472727B2 (en) * | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
| BR112015022235A2 (pt) | 2013-03-15 | 2017-07-18 | Modumetal Inc | revestimentos nanolaminados |
| HK1220742A1 (zh) * | 2013-03-15 | 2017-05-12 | Modumetal, Inc. | 用於连续施加纳米层压金属涂层的方法和装置 |
| CN105189828B (zh) | 2013-03-15 | 2018-05-15 | 莫杜美拓有限公司 | 具有高硬度的镍铬纳米层压涂层 |
| US20160208372A1 (en) * | 2013-08-27 | 2016-07-21 | University Of Virginia Patent Foundation | Lattice materials and structures and related methods thereof |
| EA201790643A1 (ru) | 2014-09-18 | 2017-08-31 | Модьюметал, Инк. | Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий |
| CA2961507C (en) | 2014-09-18 | 2024-04-09 | Modumetal, Inc. | Methods of preparing articles by electrodeposition and additive manufacturing processes |
| EP3220209B1 (fr) * | 2016-03-14 | 2019-02-06 | Nivarox-FAR S.A. | Composant d'affichage d'horlogerie economique |
| EP3510185A1 (en) | 2016-09-08 | 2019-07-17 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
| TW201821649A (zh) | 2016-09-09 | 2018-06-16 | 美商馬杜合金股份有限公司 | 層合物與奈米層合物材料於工具及模製方法之應用 |
| WO2018053158A1 (en) | 2016-09-14 | 2018-03-22 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
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| CN103261479A (zh) | 2013-08-21 |
| CA2806328C (en) | 2019-01-22 |
| JP2018040052A (ja) | 2018-03-15 |
| EP2596150A4 (en) | 2016-06-08 |
| US9732433B2 (en) | 2017-08-15 |
| US20180016692A1 (en) | 2018-01-18 |
| EP2596150B1 (en) | 2020-06-17 |
| EP2596150A1 (en) | 2013-05-29 |
| CN105386103A (zh) | 2016-03-09 |
| CN103261479B (zh) | 2015-12-02 |
| US20130130057A1 (en) | 2013-05-23 |
| JP6196285B2 (ja) | 2017-09-13 |
| WO2012012789A1 (en) | 2012-01-26 |
| CA2806328A1 (en) | 2012-01-26 |
| US10662542B2 (en) | 2020-05-26 |
| CN105386103B (zh) | 2018-07-31 |
| JP2016121400A (ja) | 2016-07-07 |
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