JP2013541843A - 高さが低い双アーム真空ロボット - Google Patents

高さが低い双アーム真空ロボット Download PDF

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Publication number
JP2013541843A
JP2013541843A JP2013529313A JP2013529313A JP2013541843A JP 2013541843 A JP2013541843 A JP 2013541843A JP 2013529313 A JP2013529313 A JP 2013529313A JP 2013529313 A JP2013529313 A JP 2013529313A JP 2013541843 A JP2013541843 A JP 2013541843A
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JP
Japan
Prior art keywords
forearm
actuator
transfer robot
substrate transfer
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013529313A
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English (en)
Japanese (ja)
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JP2013541843A5 (enExample
Inventor
イズヤ クレマーマン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2013541843A publication Critical patent/JP2013541843A/ja
Publication of JP2013541843A5 publication Critical patent/JP2013541843A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • B25J9/1015—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2013529313A 2010-09-15 2011-09-15 高さが低い双アーム真空ロボット Pending JP2013541843A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38314010P 2010-09-15 2010-09-15
US61/383,140 2010-09-15
US13/232,951 US20120063874A1 (en) 2010-09-15 2011-09-14 Low profile dual arm vacuum robot
US13/232,951 2011-09-14
PCT/US2011/051699 WO2012037312A2 (en) 2010-09-15 2011-09-15 Low profile dual arm vacuum robot

Publications (2)

Publication Number Publication Date
JP2013541843A true JP2013541843A (ja) 2013-11-14
JP2013541843A5 JP2013541843A5 (enExample) 2015-01-15

Family

ID=45806871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013529313A Pending JP2013541843A (ja) 2010-09-15 2011-09-15 高さが低い双アーム真空ロボット

Country Status (6)

Country Link
US (1) US20120063874A1 (enExample)
JP (1) JP2013541843A (enExample)
KR (1) KR20130100153A (enExample)
CN (1) CN103430296A (enExample)
TW (1) TW201228784A (enExample)
WO (1) WO2012037312A2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102326244B (zh) 2009-01-11 2014-12-17 应用材料公司 用于在电子器件制造中传输基板的机械手系统、装置及方法
WO2014008009A1 (en) * 2012-07-05 2014-01-09 Applied Materials, Inc Boom drive apparatus, multi-arm robot apparatus, electronic device processing systems, and methods for transporting substrates in electronic device manufacturing systems
US20140220777A1 (en) * 2013-02-05 2014-08-07 International Business Machines Corporation Processing system for combined metal deposition and reflow anneal for forming interconnect structures
CN106015497B (zh) * 2016-05-16 2017-11-14 太原理工大学 一种密闭空间定位操作机构
US11270904B2 (en) * 2016-07-12 2022-03-08 Brooks Automation Us, Llc Substrate processing apparatus
US10704142B2 (en) * 2017-07-27 2020-07-07 Applied Materials, Inc. Quick disconnect resistance temperature detector assembly for rotating pedestal
CN109994358B (zh) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 一种等离子处理系统和等离子处理系统的运行方法
KR20240167943A (ko) 2019-07-12 2024-11-28 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇
US11443973B2 (en) 2019-07-12 2022-09-13 Applied Materials, Inc. Robot for simultaneous substrate transfer
US11117265B2 (en) 2019-07-12 2021-09-14 Applied Materials, Inc. Robot for simultaneous substrate transfer
US11574826B2 (en) * 2019-07-12 2023-02-07 Applied Materials, Inc. High-density substrate processing systems and methods
KR20230002355A (ko) * 2020-03-02 2023-01-05 퍼시몬 테크놀로지스 코포레이션 소형 횡단 로봇

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
JPH10308430A (ja) * 1997-03-05 1998-11-17 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11277467A (ja) * 1998-03-25 1999-10-12 Mecs Corp 薄型基板搬送ロボット
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JP2001332599A (ja) * 2000-05-24 2001-11-30 Daihen Corp 搬送装置
US20020098072A1 (en) * 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
JP2005032994A (ja) * 2003-07-14 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置
WO2008124108A1 (en) * 2007-04-06 2008-10-16 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392776A (en) * 1981-05-15 1983-07-12 Westinghouse Electric Corp. Robotic manipulator structure
US6428266B1 (en) * 1995-07-10 2002-08-06 Brooks Automation, Inc. Direct driven robot
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
JPH11300663A (ja) * 1998-04-24 1999-11-02 Mecs Corp 薄型基板搬送装置
AU2041000A (en) * 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP2002166376A (ja) * 2000-11-30 2002-06-11 Hirata Corp 基板搬送用ロボット
US7281741B2 (en) * 2001-07-13 2007-10-16 Semitool, Inc. End-effectors for handling microelectronic workpieces
JP4222068B2 (ja) * 2003-03-10 2009-02-12 東京エレクトロン株式会社 被処理体の搬送装置
US7244095B2 (en) * 2004-12-16 2007-07-17 Energent Corporation Dual pressure Euler steam turbine
US9248568B2 (en) * 2005-07-11 2016-02-02 Brooks Automation, Inc. Unequal link SCARA arm
CN100358097C (zh) * 2005-08-05 2007-12-26 中微半导体设备(上海)有限公司 半导体工艺处理系统及其处理方法
KR101366651B1 (ko) * 2007-05-31 2014-02-25 어플라이드 머티어리얼스, 인코포레이티드 이중 스카라 로봇 링키지의 리치를 연장하기 위한 방법 및 장치
JP4971063B2 (ja) * 2007-07-27 2012-07-11 株式会社ダイヘン 搬送装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
JPH10308430A (ja) * 1997-03-05 1998-11-17 Dainippon Screen Mfg Co Ltd 基板処理装置
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JPH11277467A (ja) * 1998-03-25 1999-10-12 Mecs Corp 薄型基板搬送ロボット
JP2001332599A (ja) * 2000-05-24 2001-11-30 Daihen Corp 搬送装置
US20020098072A1 (en) * 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
JP2005032994A (ja) * 2003-07-14 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置
WO2008124108A1 (en) * 2007-04-06 2008-10-16 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms

Also Published As

Publication number Publication date
CN103430296A (zh) 2013-12-04
KR20130100153A (ko) 2013-09-09
WO2012037312A3 (en) 2012-06-21
US20120063874A1 (en) 2012-03-15
TW201228784A (en) 2012-07-16
WO2012037312A2 (en) 2012-03-22

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