CN103430296A - 小尺寸双臂真空机器人 - Google Patents

小尺寸双臂真空机器人 Download PDF

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Publication number
CN103430296A
CN103430296A CN2011800445226A CN201180044522A CN103430296A CN 103430296 A CN103430296 A CN 103430296A CN 2011800445226 A CN2011800445226 A CN 2011800445226A CN 201180044522 A CN201180044522 A CN 201180044522A CN 103430296 A CN103430296 A CN 103430296A
Authority
CN
China
Prior art keywords
forearm
actuator
robot
base plate
pulley
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800445226A
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English (en)
Chinese (zh)
Inventor
伊贾·克雷默曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN103430296A publication Critical patent/CN103430296A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • B25J9/043—Cylindrical coordinate type comprising an articulated arm double selective compliance articulated robot arms [SCARA]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/06—Programme-controlled manipulators characterised by multi-articulated arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/1005—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means
    • B25J9/1015—Programme-controlled manipulators characterised by positioning means for manipulator elements comprising adjusting means using additional, e.g. microadjustment of the end effector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
CN2011800445226A 2010-09-15 2011-09-15 小尺寸双臂真空机器人 Pending CN103430296A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38314010P 2010-09-15 2010-09-15
US61/383,140 2010-09-15
US13/232,951 US20120063874A1 (en) 2010-09-15 2011-09-14 Low profile dual arm vacuum robot
US13/232,951 2011-09-14
PCT/US2011/051699 WO2012037312A2 (en) 2010-09-15 2011-09-15 Low profile dual arm vacuum robot

Publications (1)

Publication Number Publication Date
CN103430296A true CN103430296A (zh) 2013-12-04

Family

ID=45806871

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800445226A Pending CN103430296A (zh) 2010-09-15 2011-09-15 小尺寸双臂真空机器人

Country Status (6)

Country Link
US (1) US20120063874A1 (enExample)
JP (1) JP2013541843A (enExample)
KR (1) KR20130100153A (enExample)
CN (1) CN103430296A (enExample)
TW (1) TW201228784A (enExample)
WO (1) WO2012037312A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106015497A (zh) * 2016-05-16 2016-10-12 太原理工大学 一种密闭空间定位操作机构
CN109715347A (zh) * 2016-07-12 2019-05-03 布鲁克斯自动化公司 基底处理设备
CN115210046A (zh) * 2020-03-02 2022-10-18 柿子技术公司 紧凑型横移机器人

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102326244B (zh) 2009-01-11 2014-12-17 应用材料公司 用于在电子器件制造中传输基板的机械手系统、装置及方法
WO2014008009A1 (en) * 2012-07-05 2014-01-09 Applied Materials, Inc Boom drive apparatus, multi-arm robot apparatus, electronic device processing systems, and methods for transporting substrates in electronic device manufacturing systems
US20140220777A1 (en) * 2013-02-05 2014-08-07 International Business Machines Corporation Processing system for combined metal deposition and reflow anneal for forming interconnect structures
US10704142B2 (en) * 2017-07-27 2020-07-07 Applied Materials, Inc. Quick disconnect resistance temperature detector assembly for rotating pedestal
CN109994358B (zh) * 2017-12-29 2021-04-27 中微半导体设备(上海)股份有限公司 一种等离子处理系统和等离子处理系统的运行方法
KR20240167943A (ko) 2019-07-12 2024-11-28 어플라이드 머티어리얼스, 인코포레이티드 동시 기판 이송을 위한 로봇
US11443973B2 (en) 2019-07-12 2022-09-13 Applied Materials, Inc. Robot for simultaneous substrate transfer
US11117265B2 (en) 2019-07-12 2021-09-14 Applied Materials, Inc. Robot for simultaneous substrate transfer
US11574826B2 (en) * 2019-07-12 2023-02-07 Applied Materials, Inc. High-density substrate processing systems and methods

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6669434B2 (en) * 2000-11-17 2003-12-30 Tazmo Co., Ltd. Double arm substrate transport unit
US6764271B2 (en) * 2000-11-30 2004-07-20 Hirata Corporation Substrate conveyer robot
CN1909182A (zh) * 2005-08-05 2007-02-07 中微半导体设备(上海)有限公司 半导体工艺处理系统及其处理方法
US20070104559A1 (en) * 2001-07-13 2007-05-10 Woodruff Daniel J End-effectors for handling microelectronic workpieces
US20090035114A1 (en) * 2007-07-27 2009-02-05 Daihen Corporation Transfer apparatus

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4392776A (en) * 1981-05-15 1983-07-12 Westinghouse Electric Corp. Robotic manipulator structure
US6428266B1 (en) * 1995-07-10 2002-08-06 Brooks Automation, Inc. Direct driven robot
US5789878A (en) * 1996-07-15 1998-08-04 Applied Materials, Inc. Dual plane robot
JP3562748B2 (ja) * 1997-03-05 2004-09-08 大日本スクリーン製造株式会社 基板処理装置
US6155768A (en) * 1998-01-30 2000-12-05 Kensington Laboratories, Inc. Multiple link robot arm system implemented with offset end effectors to provide extended reach and enhanced throughput
JPH11277467A (ja) * 1998-03-25 1999-10-12 Mecs Corp 薄型基板搬送ロボット
AU2041000A (en) * 1998-12-02 2000-06-19 Kensington Laboratories, Inc. Specimen holding robotic arm end effector
JP4456725B2 (ja) * 2000-05-24 2010-04-28 株式会社ダイヘン 搬送装置
US20020098072A1 (en) * 2001-01-19 2002-07-25 Applied Materials, Inc. Dual bladed robot apparatus and associated method
JP4222068B2 (ja) * 2003-03-10 2009-02-12 東京エレクトロン株式会社 被処理体の搬送装置
JP2005032994A (ja) * 2003-07-14 2005-02-03 Hitachi Kokusai Electric Inc 基板処理装置
US7244095B2 (en) * 2004-12-16 2007-07-17 Energent Corporation Dual pressure Euler steam turbine
US9248568B2 (en) * 2005-07-11 2016-02-02 Brooks Automation, Inc. Unequal link SCARA arm
US7946800B2 (en) * 2007-04-06 2011-05-24 Brooks Automation, Inc. Substrate transport apparatus with multiple independently movable articulated arms
KR101366651B1 (ko) * 2007-05-31 2014-02-25 어플라이드 머티어리얼스, 인코포레이티드 이중 스카라 로봇 링키지의 리치를 연장하기 위한 방법 및 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10163296A (ja) * 1996-11-27 1998-06-19 Rootsue Kk 基板搬送装置
US6234738B1 (en) * 1998-04-24 2001-05-22 Mecs Corporation Thin substrate transferring apparatus
US6669434B2 (en) * 2000-11-17 2003-12-30 Tazmo Co., Ltd. Double arm substrate transport unit
US6764271B2 (en) * 2000-11-30 2004-07-20 Hirata Corporation Substrate conveyer robot
US20070104559A1 (en) * 2001-07-13 2007-05-10 Woodruff Daniel J End-effectors for handling microelectronic workpieces
CN1909182A (zh) * 2005-08-05 2007-02-07 中微半导体设备(上海)有限公司 半导体工艺处理系统及其处理方法
US20090035114A1 (en) * 2007-07-27 2009-02-05 Daihen Corporation Transfer apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106015497A (zh) * 2016-05-16 2016-10-12 太原理工大学 一种密闭空间定位操作机构
CN109715347A (zh) * 2016-07-12 2019-05-03 布鲁克斯自动化公司 基底处理设备
CN109715347B (zh) * 2016-07-12 2022-09-06 博鲁可斯自动化美国有限责任公司 基底处理设备
CN115210046A (zh) * 2020-03-02 2022-10-18 柿子技术公司 紧凑型横移机器人

Also Published As

Publication number Publication date
KR20130100153A (ko) 2013-09-09
WO2012037312A3 (en) 2012-06-21
US20120063874A1 (en) 2012-03-15
JP2013541843A (ja) 2013-11-14
TW201228784A (en) 2012-07-16
WO2012037312A2 (en) 2012-03-22

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131204