JP2013530514A - インライン基板処理装置 - Google Patents

インライン基板処理装置 Download PDF

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Publication number
JP2013530514A
JP2013530514A JP2013507876A JP2013507876A JP2013530514A JP 2013530514 A JP2013530514 A JP 2013530514A JP 2013507876 A JP2013507876 A JP 2013507876A JP 2013507876 A JP2013507876 A JP 2013507876A JP 2013530514 A JP2013530514 A JP 2013530514A
Authority
JP
Japan
Prior art keywords
chamber
substrate
unit
plasma
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013507876A
Other languages
English (en)
Japanese (ja)
Inventor
キム、スウン
イ、ギョンホ
チョン、スンビン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tera Semicon Corp
Original Assignee
Tera Semicon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tera Semicon Corp filed Critical Tera Semicon Corp
Publication of JP2013530514A publication Critical patent/JP2013530514A/ja
Withdrawn legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013507876A 2010-04-26 2011-04-25 インライン基板処理装置 Withdrawn JP2013530514A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2010-0038603 2010-04-26
KR1020100038603A KR101129038B1 (ko) 2010-04-26 2010-04-26 인라인 기판처리 장치
PCT/KR2011/003002 WO2011136525A2 (ko) 2010-04-26 2011-04-25 인라인 기판 처리 장치

Publications (1)

Publication Number Publication Date
JP2013530514A true JP2013530514A (ja) 2013-07-25

Family

ID=44862026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013507876A Withdrawn JP2013530514A (ja) 2010-04-26 2011-04-25 インライン基板処理装置

Country Status (5)

Country Link
JP (1) JP2013530514A (ko)
KR (1) KR101129038B1 (ko)
CN (1) CN102859722A (ko)
TW (1) TW201203374A (ko)
WO (1) WO2011136525A2 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016005003A (ja) * 2014-06-17 2016-01-12 エルジー エレクトロニクス インコーポレイティド 太陽電池の後処理装置
JP2017123372A (ja) * 2016-01-05 2017-07-13 住重試験検査株式会社 水素プラズマ処理装置および水素プラズマ処理方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371709B1 (ko) * 2012-09-24 2014-03-07 주식회사 선익시스템 기판 전처리 시스템
JP6285446B2 (ja) 2012-10-09 2018-02-28 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 割り送り式インライン基板処理ツール
KR101446132B1 (ko) * 2012-12-24 2014-10-06 엘아이지에이디피 주식회사 기판 처리 장치
KR101392491B1 (ko) * 2012-12-24 2014-05-27 엘아이지에이디피 주식회사 기판 처리 장치
JP6449074B2 (ja) * 2015-03-25 2019-01-09 住友化学株式会社 基板処理装置及び基板処理方法
KR101713196B1 (ko) * 2015-06-30 2017-03-09 주식회사 테라세미콘 인라인 열처리 장치
CN111850518A (zh) * 2020-07-21 2020-10-30 上海理想万里晖薄膜设备有限公司 托盘预热腔及对应的pecvd设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3211356B2 (ja) * 1992-04-22 2001-09-25 株式会社島津製作所 インライン式プラズマcvd装置
KR100691875B1 (ko) * 2005-03-25 2007-03-09 최진문 대기압 플라즈마 유전체 세정장치
KR100979189B1 (ko) * 2007-12-20 2010-08-31 다이나믹솔라디자인 주식회사 연속 기판 처리 시스템

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016005003A (ja) * 2014-06-17 2016-01-12 エルジー エレクトロニクス インコーポレイティド 太陽電池の後処理装置
US10109511B2 (en) 2014-06-17 2018-10-23 Lg Electronics Inc. Post-processing apparatus of solar cell
JP2017123372A (ja) * 2016-01-05 2017-07-13 住重試験検査株式会社 水素プラズマ処理装置および水素プラズマ処理方法

Also Published As

Publication number Publication date
WO2011136525A3 (ko) 2012-01-26
WO2011136525A2 (ko) 2011-11-03
CN102859722A (zh) 2013-01-02
KR20110119098A (ko) 2011-11-02
KR101129038B1 (ko) 2012-03-27
TW201203374A (en) 2012-01-16

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A300 Application deemed to be withdrawn because no request for examination was validly filed

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Effective date: 20140701