JP2013530514A - インライン基板処理装置 - Google Patents
インライン基板処理装置 Download PDFInfo
- Publication number
- JP2013530514A JP2013530514A JP2013507876A JP2013507876A JP2013530514A JP 2013530514 A JP2013530514 A JP 2013530514A JP 2013507876 A JP2013507876 A JP 2013507876A JP 2013507876 A JP2013507876 A JP 2013507876A JP 2013530514 A JP2013530514 A JP 2013530514A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- substrate
- unit
- plasma
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0038603 | 2010-04-26 | ||
KR1020100038603A KR101129038B1 (ko) | 2010-04-26 | 2010-04-26 | 인라인 기판처리 장치 |
PCT/KR2011/003002 WO2011136525A2 (ko) | 2010-04-26 | 2011-04-25 | 인라인 기판 처리 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013530514A true JP2013530514A (ja) | 2013-07-25 |
Family
ID=44862026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013507876A Withdrawn JP2013530514A (ja) | 2010-04-26 | 2011-04-25 | インライン基板処理装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2013530514A (ko) |
KR (1) | KR101129038B1 (ko) |
CN (1) | CN102859722A (ko) |
TW (1) | TW201203374A (ko) |
WO (1) | WO2011136525A2 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016005003A (ja) * | 2014-06-17 | 2016-01-12 | エルジー エレクトロニクス インコーポレイティド | 太陽電池の後処理装置 |
JP2017123372A (ja) * | 2016-01-05 | 2017-07-13 | 住重試験検査株式会社 | 水素プラズマ処理装置および水素プラズマ処理方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101371709B1 (ko) * | 2012-09-24 | 2014-03-07 | 주식회사 선익시스템 | 기판 전처리 시스템 |
JP6285446B2 (ja) | 2012-10-09 | 2018-02-28 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 割り送り式インライン基板処理ツール |
KR101446132B1 (ko) * | 2012-12-24 | 2014-10-06 | 엘아이지에이디피 주식회사 | 기판 처리 장치 |
KR101392491B1 (ko) * | 2012-12-24 | 2014-05-27 | 엘아이지에이디피 주식회사 | 기판 처리 장치 |
JP6449074B2 (ja) * | 2015-03-25 | 2019-01-09 | 住友化学株式会社 | 基板処理装置及び基板処理方法 |
KR101713196B1 (ko) * | 2015-06-30 | 2017-03-09 | 주식회사 테라세미콘 | 인라인 열처리 장치 |
CN111850518A (zh) * | 2020-07-21 | 2020-10-30 | 上海理想万里晖薄膜设备有限公司 | 托盘预热腔及对应的pecvd设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3211356B2 (ja) * | 1992-04-22 | 2001-09-25 | 株式会社島津製作所 | インライン式プラズマcvd装置 |
KR100691875B1 (ko) * | 2005-03-25 | 2007-03-09 | 최진문 | 대기압 플라즈마 유전체 세정장치 |
KR100979189B1 (ko) * | 2007-12-20 | 2010-08-31 | 다이나믹솔라디자인 주식회사 | 연속 기판 처리 시스템 |
-
2010
- 2010-04-26 KR KR1020100038603A patent/KR101129038B1/ko active IP Right Grant
-
2011
- 2011-04-25 TW TW100114278A patent/TW201203374A/zh unknown
- 2011-04-25 JP JP2013507876A patent/JP2013530514A/ja not_active Withdrawn
- 2011-04-25 CN CN201180021270.5A patent/CN102859722A/zh active Pending
- 2011-04-25 WO PCT/KR2011/003002 patent/WO2011136525A2/ko active Application Filing
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016005003A (ja) * | 2014-06-17 | 2016-01-12 | エルジー エレクトロニクス インコーポレイティド | 太陽電池の後処理装置 |
US10109511B2 (en) | 2014-06-17 | 2018-10-23 | Lg Electronics Inc. | Post-processing apparatus of solar cell |
JP2017123372A (ja) * | 2016-01-05 | 2017-07-13 | 住重試験検査株式会社 | 水素プラズマ処理装置および水素プラズマ処理方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2011136525A3 (ko) | 2012-01-26 |
WO2011136525A2 (ko) | 2011-11-03 |
CN102859722A (zh) | 2013-01-02 |
KR20110119098A (ko) | 2011-11-02 |
KR101129038B1 (ko) | 2012-03-27 |
TW201203374A (en) | 2012-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2013530514A (ja) | インライン基板処理装置 | |
JP5813920B2 (ja) | 基板上に薄膜を蒸着する方法および基板のインライン真空処理のための装置 | |
TWI449121B (zh) | 調節基板溫度之基板支撐件及其應用 | |
US5248349A (en) | Process for making photovoltaic devices and resultant product | |
TWI524432B (zh) | 沉積薄膜電晶體之方法與系統 | |
KR101157201B1 (ko) | Cigs층 형성장치 | |
US8039051B2 (en) | Method and apparatus for hydrogenation of thin film silicon on glass | |
US20180282864A1 (en) | Apparatus and method of turning over a substrate in a substrate processing system | |
US20120264072A1 (en) | Method and apparatus for performing reactive thermal treatment of thin film pv material | |
US20140165910A1 (en) | Apparatus for large-area atomic layer deposition | |
US9079304B2 (en) | Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit | |
KR101147658B1 (ko) | 플라즈마 처리 장치 및 이를 이용한 방법 | |
KR101680950B1 (ko) | 코팅된 기판을 처리하기 위한 처리 박스, 장치 및 방법 | |
TWI492305B (zh) | 製造半導體裝置之方法及設備 | |
KR100719330B1 (ko) | 유기물 발광 다이오드 및 액정표시 장치 제조용 플라즈마화학 증착 장비 | |
KR101299189B1 (ko) | 멀티 스테이지공정을 이용한 대면적 유리기판 cigs 박막의 연속 제조용 인라인 장비시스템과 대면적 유리기판 cigs 박막의 제조방법 | |
US8476108B2 (en) | Method and apparatus for manufacturing semiconductor device | |
KR101199972B1 (ko) | 배치식 플라즈마 처리 장치 및 이를 이용한 플라즈마 처리 방법 | |
KR20100113774A (ko) | 기판처리장치 | |
JP2015137415A (ja) | 大面積原子層蒸着装置 | |
KR101365048B1 (ko) | 보트 이송 시스템 | |
KR101088453B1 (ko) | 인라인 기판처리 장치 | |
KR101943022B1 (ko) | 트랜지스터 어레이 기판의 제조 장치 및 제조 방법 | |
TW201216367A (en) | High-temperature activation process | |
KR20120113970A (ko) | 기판처리시스템 및 그에 사용되는 트레이 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20140701 |