WO2011136525A3 - 인라인 기판 처리 장치 - Google Patents

인라인 기판 처리 장치 Download PDF

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Publication number
WO2011136525A3
WO2011136525A3 PCT/KR2011/003002 KR2011003002W WO2011136525A3 WO 2011136525 A3 WO2011136525 A3 WO 2011136525A3 KR 2011003002 W KR2011003002 W KR 2011003002W WO 2011136525 A3 WO2011136525 A3 WO 2011136525A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
treating apparatus
substrate
inline substrate
inline
Prior art date
Application number
PCT/KR2011/003002
Other languages
English (en)
French (fr)
Other versions
WO2011136525A2 (ko
Inventor
김수웅
이경호
정순빈
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to JP2013507876A priority Critical patent/JP2013530514A/ja
Priority to CN201180021270.5A priority patent/CN102859722A/zh
Publication of WO2011136525A2 publication Critical patent/WO2011136525A2/ko
Publication of WO2011136525A3 publication Critical patent/WO2011136525A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

인라인 기판 처리 장치가 개시된다. 본 발명에 따른 인라인 기판 처리 장치는 기판(10)을 예열하는 제1 챔버(100); 제1 챔버(100)에서 예열된 기판(10)을 전달받아 가열하면서 플라즈마 처리하는 제2 챔버(200); 및 제2 챔버(200)에서 플라즈마 처리된 기판(10)을 전달받아 냉각하면서 플라즈마 처리하는 제3 챔버(300)를 포함하고, 제1 챔버(100), 제2 챔버(200) 및 제3 챔버(300)는 순차적으로 일렬로 연결되어 배치된 구성이다.
PCT/KR2011/003002 2010-04-26 2011-04-25 인라인 기판 처리 장치 WO2011136525A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013507876A JP2013530514A (ja) 2010-04-26 2011-04-25 インライン基板処理装置
CN201180021270.5A CN102859722A (zh) 2010-04-26 2011-04-25 直列式基板处理装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100038603A KR101129038B1 (ko) 2010-04-26 2010-04-26 인라인 기판처리 장치
KR10-2010-0038603 2010-04-26

Publications (2)

Publication Number Publication Date
WO2011136525A2 WO2011136525A2 (ko) 2011-11-03
WO2011136525A3 true WO2011136525A3 (ko) 2012-01-26

Family

ID=44862026

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/003002 WO2011136525A2 (ko) 2010-04-26 2011-04-25 인라인 기판 처리 장치

Country Status (5)

Country Link
JP (1) JP2013530514A (ko)
KR (1) KR101129038B1 (ko)
CN (1) CN102859722A (ko)
TW (1) TW201203374A (ko)
WO (1) WO2011136525A2 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101371709B1 (ko) * 2012-09-24 2014-03-07 주식회사 선익시스템 기판 전처리 시스템
US9406538B2 (en) 2012-10-09 2016-08-02 Applied Materials, Inc. Indexed inline substrate processing tool
KR101392491B1 (ko) * 2012-12-24 2014-05-27 엘아이지에이디피 주식회사 기판 처리 장치
KR101446132B1 (ko) * 2012-12-24 2014-10-06 엘아이지에이디피 주식회사 기판 처리 장치
KR20150144585A (ko) * 2014-06-17 2015-12-28 엘지전자 주식회사 태양 전지의 후처리 장치
JP6449074B2 (ja) * 2015-03-25 2019-01-09 住友化学株式会社 基板処理装置及び基板処理方法
KR101713196B1 (ko) * 2015-06-30 2017-03-09 주식회사 테라세미콘 인라인 열처리 장치
JP6529914B2 (ja) * 2016-01-05 2019-06-12 住重アテックス株式会社 水素プラズマ処理装置および水素プラズマ処理方法
CN111850518B (zh) * 2020-07-21 2024-07-19 理想万里晖半导体设备(上海)股份有限公司 托盘预热腔及对应的pecvd设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295551A (ja) * 1992-04-22 1993-11-09 Shimadzu Corp インライン式プラズマｃｖｄ装置
KR20060102781A (ko) * 2005-03-25 2006-09-28 최진문 대기압 플라즈마 유전체 세정장치
KR20090066996A (ko) * 2007-12-20 2009-06-24 다이나믹솔라디자인 주식회사 연속 기판 처리 시스템

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05295551A (ja) * 1992-04-22 1993-11-09 Shimadzu Corp インライン式プラズマｃｖｄ装置
KR20060102781A (ko) * 2005-03-25 2006-09-28 최진문 대기압 플라즈마 유전체 세정장치
KR20090066996A (ko) * 2007-12-20 2009-06-24 다이나믹솔라디자인 주식회사 연속 기판 처리 시스템

Also Published As

Publication number Publication date
KR101129038B1 (ko) 2012-03-27
JP2013530514A (ja) 2013-07-25
WO2011136525A2 (ko) 2011-11-03
TW201203374A (en) 2012-01-16
KR20110119098A (ko) 2011-11-02
CN102859722A (zh) 2013-01-02

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