JP2013528251A - Large area vapor deposition equipment for gas mixing prevention - Google Patents

Abstract

The present invention provides a large-area vapor deposition apparatus for preventing gas mixing.
In the large area vapor deposition apparatus for preventing gas mixing according to the present invention, an injection nozzle having a multi-tube structure is applied, and each gas is supplied to different injection nozzles. , Uniformly mixed and sprayed uniformly into the chamber. That is, the gas can be prevented from being mixed before flowing into the chamber with a simple structure, and the gas can be uniformly mixed and injected into the chamber uniformly, thereby reducing cost. There is an effect that. In addition, since the gas is injected while the injection nozzle vibrates from side to side, the gas is mixed more uniformly and injected more uniformly onto the substrate in the chamber, so that the quality of the film deposited on the substrate is improved. There is. Furthermore, since each spray nozzle can be repaired or cleaned separately, there is an effect that the maintenance work is simple.
[Selection] Figure 2

Description

  The present invention relates to a large-area vapor deposition apparatus for preventing gas mixing, and prevents the gases from being mixed with each other before flowing into the chamber, and the gases are uniformly mixed with each other and uniformly injected into the chamber. The present invention relates to a large area vapor deposition apparatus for preventing gas mixing.

  Thin film deposition technology by chemical vapor deposition (CVD) is used in various application fields such as insulating layers and active layers of semiconductor devices, transparent electrodes of liquid crystal display devices, light emitting layers and protective layers of light emitting display devices. Very important.

  Generally, the physical properties of a thin film deposited by CVD are very sensitively influenced by process conditions such as deposition pressure, deposition temperature, and deposition time. For example, the composition, density, adhesive strength, and deposition rate of the deposited thin film may change due to changes in the deposition pressure.

  Chemical vapor deposition methods are LPCVD (Low Pressure Chemical Vapor Deposition), APCVD (Atmospheric Pressure Chemical Vapor Deposition), LTCVD (Low Temperature Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition). ) Etc.

  Among them, MOCVD uses a metal organic compound as a precursor, and sends a vapor of a metal organic compound having a high vapor pressure to the surface of a substrate heated in a chamber. This is a technique for growing a desired thin film.

  MOCVD is excellent in step coverage and has no damage to the surface of the substrate or crystal, so that a high-purity and high-quality thin film can be grown. And, since the deposition rate is relatively fast and the process time can be shortened, the productivity is also excellent.

  The conventional MOCVD apparatus has a problem that the cost is increased because a shower head in which many fine holes are formed is required for uniform gas injection.

  In particular, the conventional MOCVD apparatus has a more complicated shape for the shower head in order to prevent two or more kinds of gases used in the deposition of the thin film from being mixed before injection and performing deposition in an undesired place. Must be processed. As a result, there is a problem that the cost of the MOCVD apparatus further increases.

  In addition, the conventional MOCVD apparatus has a problem that maintenance is inconvenient because the entire shower head must be separated when the gas injection hole of the shower head is clogged and repair or cleaning is required.

  The present invention has been made to solve the above-mentioned problems of the prior art, and the object of the present invention is to prevent the gases from being mixed with each other before flowing into the chamber with a simple structure. Another object of the present invention is to provide a large-area vapor deposition apparatus for preventing gas mixing by allowing gas to be uniformly mixed and uniformly injected into a chamber so as to reduce costs.

  Another object of the present invention is to provide a large-area vapor deposition apparatus for preventing gas mixing that is easy to maintain.

  A large-area deposition apparatus for preventing gas mixing according to the present invention for achieving the above object is provided in a chamber for providing a deposition space for depositing a predetermined substance on a substrate, and provided on one side of the chamber. A plurality of supply ports for supplying gas into the chamber; a plurality of supply lines disposed in the chamber; connected to the supply ports; and disposed above the substrate put into the chamber. And a plurality of injection nozzles that are connected along the supply lines and are alternately arranged to inject different gases onto the upper surface of the substrate alternately.

  The large area vapor deposition apparatus for preventing gas mixing according to the present invention uses a multi-tube structure injection nozzle, and each gas is supplied to different injection nozzles. Therefore, when the gases are injected from the chamber, they are mixed uniformly. And sprayed uniformly into the chamber. That is, the gas can be prevented from being mixed before flowing into the chamber with a simple structure, and the gas can be uniformly mixed and injected into the chamber uniformly, thereby reducing cost. There is an effect that.

  In addition, since the gas is injected while the injection nozzle vibrates from side to side, the gas is mixed more uniformly and injected more uniformly onto the substrate in the chamber, so that the quality of the film deposited on the substrate is improved. There is.

  Furthermore, since each spray nozzle can be repaired or cleaned separately, there is an effect that the maintenance work is simple.

It is a top view of the large area vapor deposition apparatus for gas mixing prevention concerning one Embodiment of this invention. It is II sectional drawing of FIG. FIG. 3 is an enlarged view of an “X” portion in FIG. 2. FIG. 3 is an enlarged view of a “Y” portion of FIG. 2. It is a perspective view of the supply line of the large area vapor deposition apparatus for gas mixing prevention concerning one Embodiment of this invention. It is a perspective view regarding one supply line and injection nozzle shown in FIG. It is II-II sectional drawing of FIG. It is sectional drawing regarding the injection nozzle shown in FIG. FIG. 9 is a cut-away perspective view of a part of the connector portion shown in FIG. 8. FIG. 6 is a plan view of FIG. 5.

  The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention can be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, the specific shapes, specific structures, and characteristics described herein are associated with the embodiments and can be implemented in other embodiments without departing from the spirit and scope of the invention. It should also be understood that the location or arrangement of the individual components in each disclosed embodiment can be changed without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is limited only by the appended claims, if properly described, along with the full scope of claims that the claims claim. The The length, area, thickness, and form of the embodiments shown in the drawings may be exaggerated for convenience.

  Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

  Referring to FIGS. 1 and 2, a large-area vapor deposition apparatus for preventing gas mixing according to an embodiment of the present invention is a susceptor that functions as a chamber C and a heater that is provided in the chamber C and heats the substrate A. (Susceptor) S, a gate valve G provided on one side of the chamber C and allowing the substrate A to enter and exit, and a vacuum pump (not shown) provided outside the chamber C and exhausting the air in the chamber C Including.

  The chamber C provides a sealed space for depositing a predetermined material on the substrate A, except when the gate valve G is opened for entering and exiting the substrate A. The substrate A is placed on a plurality of pins P and deposited.

  A plurality of supply ports 100 for supplying gas are provided in the upper part of the chamber C, and a plurality of supply lines 110 connected to the supply ports 100 and supplied with vapor deposition gas are arranged inside the chamber C. Is done. The supply line 110 is a pipe line through which gas or steam can move.

  A plurality of injection nozzles 120 are provided below the plurality of supply lines 110. The injection nozzle 120 is a pipe line in which an injection hole is formed so that a gas moving inside the supply line 110 can be injected to the outside. The injection nozzle 120 is disposed above the substrate A inside the chamber C. The plurality of spray nozzles 120 are arranged alternately along the supply lines 110 for each supply line, and supply different gases to the upper surface of the substrate A for each supply line.

  The injection nozzles 120 are densely arranged in a line above the substrate A, and uniformly inject the vapor deposition gas onto the substrate A corresponding to a large area. Gases different from each other and injected from the plurality of injection nozzles 120 are injected and mixed with each other so that the injection regions overlap. And it vapor-deposits with a uniform thickness on the board | substrate A of a large area.

  Referring to FIGS. 1 to 4, an injection nozzle 120 is oscillated uniformly on a large area substrate A on the upper surface of the chamber C to increase the efficiency of vapor deposition by mixing different gases on the substrate A. A vibration air cylinder 130 is disposed. The air cylinder 130 is mechanically connected to the injection nozzle 120 so that the injection nozzle 120 can be vibrated.

  That is, a shaft rod 135 that moves linearly for the stroke provided by the air cylinder 130 is coupled to the air cylinder 130 and a nozzle that crosses the shaft rod 135 and transmits the vibration displacement of the shaft rod 135 to the injection nozzle 120. A bracket 140 is connected. The air cylinder 130 can be replaced by a vibration motor having an electrically vibrated shaft. The air cylinder 130 can be replaced with a reciprocating mechanism capable of mechanically reciprocating the rotational movement of the motor. That is, the air cylinder 130 is a driving body that provides reciprocating motion for vibration of the injection nozzle 120.

  At this time, a plurality of shaft rods 135 can be installed on the chamber C. As shown in the figure, three shaft rods 135 can be installed on the upper surface of the chamber C. Of the three shaft rods 135, the two on the left are connected to the air cylinder 130 and the nozzle bracket 140 below, and the one on the right is connected only to the nozzle bracket 140 below. The shaft rod 135 and the nozzle bracket 140 can support the weight of the injection nozzle 120 provided in a form suspended in the chamber C, and the number of the shaft rod 135 and the nozzle bracket 140 is various so that the balance can be maintained when the injection nozzle 120 vibrates. It can be changed. That is, although the illustrated example supports three portions of the injection nozzle 120, in order to improve stability, it may be manufactured as a four-part support structure that supports two portions on both sides, and further, 5 Or you may produce as a 6-part support structure.

  On the other hand, a movable table 136 that can slide is coupled to the cylinder rod 131 of the air cylinder 130, and two shaft rods 135 are coupled to both sides of the movable table 136. Further, slide tubes 137 are provided on both sides of the movable table 136, and the slide tubes 137 are sandwiched between guide bars 138 that guide the movement of the slide tubes 137. At this time, both end portions of the guide bar 138 are coupled to the fixing base 139 and fixed on the chamber C.

  The two shaft rods 135 are connected to the cylinder rod 131 of the air cylinder 130 via the moving table 136, and move together by the cylinder rod 131. The guide bar 138 and the slide tube 137 can be replaced with other slide mechanisms for transmitting the linear motion of the air cylinder 131. The reason why the slide tube 137 and the guide bar 138 are used is that the restraining force of the guide bar 138 on the slide tube 137 is good during the sliding motion.

  Referring to FIG. 2, shaft rods 135 are provided on the left and right sides of the chamber C. The driving shaft of the air cylinder 130 is transmitted to the left shaft rod 135, and the right shaft rod 135 is connected to the other part of the injection nozzle 120 and functions to guide the movement of the injection nozzle 120. The nozzle bracket 140 extends downward from the upper part of the chamber C, has an upper end connected to the shaft rod 135 and a lower end connected to the injection nozzle 120.

  The air cylinder 130 causes the plurality of spray nozzles 120 arranged in a row to vibrate between the spray nozzles 120 adjacent to each other. For example, if a plurality of injection nozzles 120 are arranged at intervals of 20 mm and two different gases are alternately injected, the vibration displacement of any injection nozzle 120 is 40 mm at the maximum.

  Referring to FIGS. 2, 3, and 4, a floating joint 141 for reducing an axial error between the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 and attenuating vibration is provided on the upper left side portion of the chamber C. It is done.

  In general, it is difficult to attach the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 to the upper surface portion of the chamber C with the movement paths of the cylinder rod 131 and the shaft rod 135 being exactly matched. If the shaft rod 135 connected to the cylinder rod 131 repeatedly receives an axial force when the movement path of the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 does not coincide with a straight line, the air cylinder 130 and the shaft rod The durability of 135 decreases. In this case, the floating joint 141 performs buffered power transmission when the power transmission axis between the cylinder rod 131 and the shaft rod 135 is removed.

  A sealed space through which the shaft rod 135 passes is provided on the upper left and right sides of the chamber C, and a shaft housing 145 in which both end portions of the shaft rod 135 are movably provided is provided. The shaft housing 145 functions to seal the movement path of the shaft rod 135, and a sealing guide 146 that surrounds and closes the shaft rod 135 protruding on both sides of the shaft housing 145 is provided in the shaft housing 145.

  Between the sealing guide 146 and the shaft housing 145, a metal O-ring (not shown) or a rubber ring (not shown) can be installed as various sealing means for maintaining airtightness. . A hermetic guide 146 provided on the right side of the shaft housing 145 is provided with a bellows 147 that cushions an impact transmitted from the shaft rod 135 by the air cylinder 130.

  The bellows 147 is a bellows tube in which a passage into which the shaft rod 135 is inserted is formed. Further, a ball bush 148 into which the shaft rod 135 is inserted is fixed to the left and right sealing guides 146. The ball bushing 148 guides the linear motion of the shaft rod 135 and also serves as an airtight function to the outside of the sealing guide 146.

  3 to 5, the supply line 110 is fixed around the support 150. The support 150 is provided on the substrate A and is suspended in the chamber C by a nozzle bracket 140 coupled to the shaft rod 135.

  The support 150 is a quadrangular frame (frame), and the injection nozzles 120 are arranged in a row on the lower surface side of the support 150, and almost close the inner space of the support 150.

  The supply line 110 is fixed to the support body 150 by a fixing block 151. On both side portions of the fixed block 151, a semicircular groove 152 that can be restrained by inserting a half of the supply line 110 having a circular cross section is formed. The fixing block 151 is fixed on the support 150 by fastening means such as screws or bolts. The fixed blocks 151 are disposed at predetermined intervals along the supply line 110 disposed on the quadrangular support 150.

  Referring to FIG. 5, the supply line 110 is provided on the upper surface side of the support 150, and the injection nozzles 120 are arranged in a row on the lower surface side of the support 150. Each injection nozzle 120 is provided in the vertical direction intersecting the horizontal direction corresponding to the longitudinal direction of the support 150. That is, the plurality of spray nozzles 120 are arranged along the longitudinal direction of the substrate A, and form a quadrangle corresponding to the quadrangle substrate A. In the case of the 5.5th generation substrate A, the injection nozzle 120 is rectangular and provides an area corresponding to 1500 mm × 1300 mm. Of course, the injection nozzle 120 may be provided so as to intersect the vertical direction in which the length of the support 150 is short. FIG. 6 shows the connection relationship between the supply line 110 and the injection nozzle 120. That is, the first connection pipe 161 is coupled to the bottom surface of the supply line 110, and the second connection pipe 162 is coupled to the top surface of the injection nozzle 120 corresponding to the first connection pipe 161. The connection pipe 161 and the second connection pipe 162 are connected to each other via a connector 163. At this time, the first connecting pipe 161 passes through the support 150 (see FIG. 5) and is coupled to the connector 163. The connector 163 is a fitting means.

  Referring to FIG. 7, a bellows pipe 164 is provided between the plurality of supply ports 100 and the supply line 110. The bellows pipe 164 connects the supply port 100 and the supply line 110, and expands and contracts so that the right and left flow of the supply line 110 can be allowed with respect to the supply port 100. The bellows pipe 164 is not directly connected to the supply line 110 but is connected to the supply line 110 via another supply port that is fitting-connected.

  Referring to FIGS. 8 and 9, the injection nozzle 120 is composed of a concentric double tube. That is, the injection nozzle 120 is connected to the supply line 110, receives a supply of gas from the supply line 110, and has a first tube 171 formed with a first injection hole 171a for injecting gas upward, The second tube 172 surrounds the tube 171 and has a second injection hole 172a for injecting gas downward.

  The first injection holes 171 a of the first tube 171 are formed with a larger interval between the injection holes than the injection holes of the second tube 172. In general, the two first injection holes 171a of the first tube 171 can supply vapor deposition gas corresponding to the five second injection holes 172a of the second tube 172. The vapor deposition gas injected from the first injection hole 171a of the first tube 171 moves along the second tube 172 and flows downward in a uniformly spread state, and the second gas of the second tube 172 Are uniformly injected downward from the injection holes 172a.

  On the other hand, the injection nozzle 120 can also be manufactured as a multiple tube structure of triple or more. At this time, for each tube, it is advantageous for the uniform gas injection to make the directions of the injection holes for injecting the gas opposite to each other.

  FIG. 10 is a plan view of FIG. 5, in which the flow direction of the vapor deposition gas supplied to the two supply ports 100 of FIGS. 1 and 7 is shown. For reference, the arrows shown in FIGS. 6 and 9 indicate the flow direction of the vapor deposition gas injected from one injection nozzle 120.

  With reference to FIG. 2 and FIG. 5 to FIG. 10, the gas mixing, flow, and vapor deposition process of the large area vapor deposition apparatus for preventing gas mixing according to an embodiment of the present invention will be described.

Source materials for the vapor deposition gas flowing in through the two supply ports 100 shown in FIG. 2 are, for example, Zn and O ₂ . After the substrate A is heated to a constant temperature by the susceptor S, Zn and O ₂ source materials flow into each supply port 100. The Zn source material may be Zn organic compound DEZ (diethylzinc), and the O ₂ source material may be O ₂ . At this time, since DEZ is not in a gaseous state at normal temperature, the temperature is increased by, for example, about 100 ° C., and DEZ is changed from a solid or liquid state to a gaseous state, and then supplied to one supply port 100. O ₂ , which is a source material of O _2, is in a gaseous state at room temperature, and is supplied as it is to the other supply port 100.

  The vapor deposition gas of each source material is supplied to each supply line 110 connected to each supply port 100 to fill the supply line 110 arranged to form a quadrangle. Then, each vapor deposition gas is injected below through the injection nozzle 120 arrange | positioned so that each supply line 110 extended in a longitudinal direction may be crossed. At this time, although the injection nozzle 120 is configured by a double tube, the vapor deposition gas flows upward through the first injection hole 171a of the first tube 171 and spreads along the second tube 172. Is injected to the substrate A below through the second injection hole 172a of the second tube 172.

On the other hand, the cylinder rod 131 of the air cylinder 130 reciprocates, and the cylinder rod 131 reciprocates the shaft rod 135 provided in the shaft housing 145. The shaft rod 135 vibrates the nozzle bracket 140 coupled to the support 150 by this reciprocation while moving only by a stroke of the cylinder rod 131 set in advance. When the nozzle bracket 140 vibrates, the spray nozzle 120 provided at the lower portion of the nozzle bracket 140 vibrates while reciprocating in both sides. At this time, the vibration range of an arbitrary injection nozzle 120 among the plurality of injection nozzles 120 can be set within an interval between the arbitrary injection nozzle 120 and the adjacent injection nozzle 120. For example, in the present embodiment, the plurality of injection nozzles 120 are composed of alternating DEZ gas injection nozzles 120 and O ₂ gas injection nozzles 120, but the vibration range of any DEZ gas injection nozzle 120 is arbitrary DEZ. It may be twice the interval between the gas injection nozzle 120 and the O ₂ gas injection nozzle 120 nearest to it.

In this way, the vibration of the air cylinder 130 causes the respective injection nozzles 120 to inject different vapor deposition gases while reciprocating, and the vapor deposition gas thus ejected moves toward the substrate A while forming a zigzag waveform from above to below. To reach. At this time, the DEZ gas and the O ₂ gas of the vapor deposition gas are more easily mixed by the vibration of the injection nozzle 120 and injected onto the substrate A, and ZnO having a certain thickness is formed on the substrate A by a chemical reaction such as oxidation / reduction. Vapor deposited.

  The drawings relating to the embodiments of the present invention described above are schematically shown so that detailed contour lines are omitted and portions belonging to the technical idea of the present invention can be easily known. Further, the above-described embodiment does not become a standard for limiting the technical idea of the present invention, and is merely a reference matter for understanding the technical matters included in the claims of the present invention.

100: supply port 110: supply line 120: injection nozzle 130: vibration cylinder 140: nozzle bracket 150: support A: substrate C: chamber G: gate valve S: susceptor

Claims (20)

A chamber providing a deposition space for depositing a predetermined material on the substrate;
A plurality of supply ports provided on one side of the chamber for supplying gas into the chamber;
A plurality of supply lines disposed inside the chamber and connected to the supply ports;
The supply lines are respectively connected to the plurality of supply lines, and are arranged so as to be staggered for each of the supply lines along the plurality of supply lines above the substrate accommodated in the chamber, and the supply is provided on an upper surface of the substrate. A large-area vapor deposition apparatus for preventing gas mixing, comprising a plurality of injection nozzles that inject different gases for each line.   2. The large-area vapor deposition apparatus for preventing gas mixing according to claim 1, further comprising an air cylinder provided outside the chamber for vibrating the spray nozzle. A plurality of shaft rods provided outside the chamber and moving in conjunction with a cylinder rod of the air cylinder;
3. The apparatus according to claim 2, further comprising a plurality of nozzle brackets provided in the chamber, wherein one end is coupled to the shaft rod and the other end is coupled to the injection nozzle. Large area deposition equipment for preventing gas mixing. Three shaft rods are provided on the upper surface of the chamber,
Two shaft rods of the three shaft rods are connected to the air cylinder,
4. The large area deposition apparatus for preventing gas mixing according to claim 3, wherein the remaining one shaft rod is connected to one of the plurality of nozzle brackets on the opposite side. A movable table that can slide is connected to the cylinder rod of the air cylinder,
The large-area vapor deposition apparatus for gas mixing prevention according to claim 4, wherein the two shaft rods connected to the air cylinder are coupled to both sides of the moving table. Slide tubes are provided on both sides of the moving table,
The large-area vapor deposition apparatus for gas mixing prevention according to claim 5, wherein the slide tube is sandwiched between guide bars for guiding the movement of the slide tube.   The large-area vapor deposition apparatus for gas mixing prevention according to claim 6, wherein both end portions of the guide bar are coupled to a fixed base provided on an upper surface of the chamber.   4. A plurality of shaft housings are provided outside the chamber to provide a sealed space through which the shaft rod passes and in which both end portions of the shaft rod are movably provided. A large-area vapor deposition apparatus for preventing gas mixing as described in 1.   The large area deposition for gas mixture prevention according to claim 3, wherein a floating joint for reducing vibration due to an axial error is provided between the cylinder rod and the shaft rod of the air cylinder. apparatus.   The large-area vapor deposition apparatus for preventing gas mixing according to claim 3, wherein the shaft rod is provided with a bellows for buffering an impact transmitted from the cylinder rod of the air cylinder.   11. The large area vapor deposition apparatus for gas mixing prevention according to claim 10, wherein a ball bush that contacts the bellows is provided on the shaft rod.   The large area vapor deposition apparatus for gas mixing prevention according to claim 2, wherein the air cylinder vibrates an arbitrary injection nozzle within an interval between adjacent injection nozzles.   2. The large-area vapor deposition apparatus for gas mixing prevention according to claim 1, wherein the supply line is fixed to a peripheral portion of a support body disposed above the substrate inside the chamber.   14. The gas according to claim 13, wherein the support is a rectangular frame, and the injection nozzles are arranged in a row on a lower surface side of the support to close an inner space of the support. Large area vapor deposition equipment for mixing prevention.   The large-area vapor deposition apparatus for preventing gas mixing according to claim 13, wherein the support has a fixing block for fixing the supply line. A first connecting pipe is coupled to the bottom surface of the supply line;
A second connection pipe corresponding to the first connection pipe is coupled to the upper surface of the injection nozzle;
2. The large-area vapor deposition apparatus for preventing gas mixing according to claim 1, wherein the first and second connecting pipes are connected to each other through a connector.   The large-area vapor deposition apparatus for gas mixing prevention according to claim 1, wherein a bellows pipe is provided between the plurality of supply ports and the supply line.   2. The large-area vapor deposition apparatus for preventing gas mixing according to claim 1, wherein the spray nozzle is composed of concentric multiple tubes. A first tube in which the injection nozzle is connected to the supply line and has a first injection hole for injecting the gas supplied from the supply line upward;
The first tube according to claim 18, further comprising a second tube surrounding the first tube and having a second injection hole formed to inject the gas injected from the first injection hole downward. The large area vapor deposition apparatus for gas mixing prevention of description.   The large-area vapor deposition apparatus for gas mixing prevention according to claim 1, wherein the plurality of spray nozzles are arranged along a longitudinal direction of the substrate and form a quadrangle.

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