KR101120039B1 - Large Area Deposition Apparatus For Preventing Gas Mixing - Google Patents

Abstract

The present invention relates to a large area deposition apparatus for preventing gas mixing, comprising: a chamber (C) in which gas is deposited on a substrate; A plurality of supply ports 100 for supplying gas into the chamber C; A plurality of supply lines (110) disposed inside the chamber (C) and connected to the respective supply ports (100); And disposed above the substrate in the chamber C, connected along each of the supply lines 110, and alternately disposed along the inner space of the chamber C to alternate different gases. A plurality of injection nozzles 120 to supply to the upper surface of the substrate. According to the present invention, by applying a plurality of injection nozzles in which different gases are injected to prevent the mixing of the gas, the left and right movements (vibration) to the plurality of injection nozzles using air cylinders and bellows when the gas is injected into the chamber, Even mixing and even distribution of the gas injected from the nozzle may be achieved to improve the quality of the deposited film during the organometallic chemical vapor deposition process.

Description

Large Area Deposition Apparatus For Preventing Gas Mixing

The present invention relates to a large-area deposition apparatus for preventing gas mixing, and prevents mixing of each gas before reaching the inside of the chamber, and prevents the mixing of gas to uniformly distribute and evenly distribute the gas to an even area when gas is injected into the chamber. It relates to an area deposition apparatus.

Thin film deposition by Chemical Vapor Deposition (CVD) is very technically applicable in many applications such as insulating layers and active layers of semiconductor devices, transparent electrodes of liquid crystal display devices, light emitting layers of electroluminescent display devices, and protective layers. It is important.

In general, physical properties of thin films deposited by CVD are very sensitive to CVD process conditions such as deposition pressure, deposition temperature, and deposition time. For example, the composition, density, adhesion, deposition rate, and the like of the thin film to be deposited may vary depending on the deposition pressure.

Chemical vapor deposition includes LPCVD (Low Pressure Chemical Vapor Deposition), APCVD (Atmospheric Pressure Chemical Vapor Deposition), LTCVD (Low Temperature Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition) Can be divided.

Among them, MOCVD uses a metal organic compound (ie, a metal organic compound) as a precursor, and is a technology for growing a desired thin film by sending a high vapor pressure metal organic compound vapor to a heated substrate surface in a chamber.

MOCVD has the advantages of excellent step coverage, no damage to the substrate or crystal surface, and relatively high deposition rate, which can shorten the process time, so that high purity and high quality thin film can be grown and productivity is also excellent. Do.

Such a MOCVD is essential to produce light emitting devices used for large display boards, color images, graphics, display devices, traffic signals, etc., which are currently widely used, and are also used for fabricating memory devices using ferroelectric materials.

Conventional MOCVD technology has a problem in that the cost of the MOCVD apparatus increases as a showerhead is processed with a myriad of fine holes for even gas injection. In particular, in order to prevent undesired deposition of two or more gases used when depositing a compound using MOCVD technology, the showerhead needs to be processed into a more complicated shape, which increases the cost of the MOCVD apparatus. There was a further rising issue. In addition, the use of the MOCVD apparatus has a problem in that the gas injection hole of the shower head is clogged or the entire shower head needs to be separated when the shower head is cleaned.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and prevents mixing of each gas before reaching the inside of the chamber, and prevents the mixing of gas to uniformly mix and distribute the gas evenly to an even area when gas is injected into the chamber. It is to provide an area deposition apparatus.

A large area deposition apparatus for preventing gas mixing according to the present invention includes a chamber (C) provided with a deposition space for a predetermined material on a substrate; A plurality of supply ports 100 for supplying gas into the chamber C; A plurality of supply lines (110) disposed inside the chamber (C) and connected to the respective supply ports (100); And disposed above the substrate in the chamber C, connected along each of the supply lines 110, and alternately disposed along the inner space of the chamber C to alternate different gases. It characterized in that it comprises a plurality of injection nozzles 120 to supply to the upper surface of the substrate.

In addition, the outside of the chamber (C) may be provided with an air cylinder 130 for vibrating the injection nozzle (120).

In addition, a plurality of shaft rods 135 are provided on the outside of the chamber C so as to be movable in the chamber C, and interlocked with the cylinder rod 131 of the air cylinder 130. A plurality of nozzle brackets 140 having one end coupled to the shaft rod 135 and the other end connected to the injection nozzle 120 may be provided inside (C).

In addition, three shaft rods 135 are installed on the upper surface of the chamber C, two of the three shaft rods 135 are connected to the air cylinder 130, and the other is on the opposite side It may be connected to any one of the nozzle bracket 140.

In addition, the cylinder rod 131 of the air cylinder 130 may be connected to the moving table 136 which is slidably moved, and the two shaft rods 135 may be coupled to both sides of the moving table 136. .

In addition, slide tubes 137 are installed at both sides of the movable table 136, and the slide tubes 137 may be fitted to guide bars 138 for guiding the movement of the slide tubes 137.

In addition, both ends of the guide bar 138 may be coupled to the holder 139.

In addition, a plurality of shaft housings 145 are provided outside the chamber C to provide a closed space through which the shaft rod 135 passes, and both ends of the shaft rod 135 are movable. Can be.

In addition, a floating joint 141 may be provided between the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 to reduce vibration due to an axis error.

In addition, the shaft rod 135 may be provided with a bellows 147 for buffering the shock transmitted from the cylinder rod 131 of the air cylinder 130.

In addition, a ball bushing 148 contacting the bellows 147 may be installed on the shaft rod 135.

In addition, the air cylinder 130 may allow any of the injection nozzles 120 to vibrate within the interval between the injection nozzles 120.

In addition, the supply line 110 may be fixed to the circumference of the support 150 installed in the chamber (C) on the substrate.

In addition, the supporter 150 has a rectangular shape with an edge penetrating the inside thereof, and the injection nozzles 120 are installed in a row below the supporter 150 to close the inner space of the edge of the supporter 150. can do.

In addition, the support 150 may be provided with a fixing block 151 for fixing the supply line 110.

In addition, a first connecting pipe 161 is coupled to a bottom surface of the supply line 110, and a second connecting pipe 162 is formed on an upper surface of the injection nozzle 120 to correspond to the first connecting pipe 161. Coupled, a connector 163 for connection may be installed between the first connector 161 and the second connector 162.

In addition, a bellows pipe 164 may be provided between the plurality of supply ports 100 and the supply line 110.

In addition, the injection nozzle 120 may be composed of a plurality of tubes.

In addition, the injection nozzle 120 is connected to the supply line 110, the first tube 171 is provided with a first hole (171a) for supplying gas from the supply line 110 and outflow gas upward; And a second tube 172 surrounding the first tube 171 and having a second hole 172a for flowing out gas downward.

In addition, the injection nozzle 120 may be arranged in a line in the longitudinal direction of the substrate to form a square.

As described above, the large-area vapor deposition apparatus for preventing gas mixing according to the present invention applies each nozzle to different injection nozzles by applying injection nozzles having a double tube structure to prevent mixing of gases, By using the bellows to move the injection nozzles left and right to achieve even mixing and even distribution of the gas injected from each injection nozzle has the effect of improving the quality of the deposited film during the organic metal chemical vapor deposition process.

In addition, the large-area deposition apparatus for preventing gas mixing according to the present invention is performed for each spray nozzle during the cleaning operation for maintenance due to the use of equipment, so that the cleaning operation is easy and the processing cost is considerably higher than that of the shower head spray method. Has an inexpensive effect.

1 is a plan view of a large-area deposition apparatus for preventing gas mixing according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line II of FIG. 1.
3A is an enlarged view of a portion A of FIG. 2.
3B is an enlarged view of a portion B of FIG. 2.
Figure 4 is a perspective view of a gas supply line of the large area deposition apparatus for preventing gas mixing according to an embodiment of the present invention.
FIG. 5 is a perspective view of one supply line and a spray nozzle of FIG. 4. FIG.
FIG. 6 is a cross-sectional view of the II-II part of FIG. 1.
7 is a cross-sectional view of the injection nozzle of FIG. 5.
8 is a cross-sectional view of the connector of FIG.
9 is a plan view of FIG. 4.

DETAILED DESCRIPTION The following detailed description of the invention refers to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It should be understood that the various embodiments of the present invention are different but need not be mutually exclusive. For example, certain features, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the invention in connection with an embodiment. It is also to be understood that the position or arrangement of the individual components within each disclosed embodiment may be varied without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention, if properly described, is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled. In the drawings, like reference numerals refer to the same or similar functions throughout the several aspects, and length, area, thickness, and the like may be exaggerated for convenience.

 Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, a gas mixing prevention large area deposition apparatus according to an embodiment of the present invention includes a susceptor functioning as a heater to heat the substrate A in the chamber C and the chamber C. (Susceptor) (S), a gate valve (G) for entering and exiting the interior of the chamber (C), the vacuum pump for exhausting the interior of the chamber (C) is provided outside the chamber (C) (I) include known components. The chamber C is an enclosed space for providing a deposition space of a predetermined material with respect to the substrate, except when the gate valve G is opened to enter and exit the substrate A. The substrate A is deposited on the plurality of fins P and deposited.

In the chamber C, a plurality of supply ports 100 for supplying gas into the chamber C are installed above the chamber C. A plurality of supply lines 110 connected to each supply port 100 to receive deposition gas are disposed in the chamber C. The supply line 110 is a pipeline through which gas, steam, or the like can flow. A plurality of injection nozzles 120 are installed below the supply line 110. The injection nozzle 120 is a conduit in which holes are formed to allow the gas moving inside to flow out. The injection nozzle 120 is disposed above the substrate A in the chamber C, is connected along each supply line 110, and alternately disposed along the inner space of the chamber C, and thus different gases. Is supplied to the upper surface of the substrate A at alternating positions. The injection nozzle 120 may be densely arranged in a row above the substrate A to evenly deposit the deposition gas onto the substrate A corresponding to the large area. Different gases injected from the injection nozzle 120 are simultaneously discharged to the lower portion of the injection nozzle 120, and the injection regions overlap each other and are mixed and deposited on the large-area substrate A with an even thickness.

1 to 3A and 3B, in the upper surface portion of the chamber C, the injection nozzle 120 is constantly vibrated on the large-area substrate A to mix different deposition gases with respect to the substrate A. FIG. A vibration air cylinder 130 is provided to increase the efficiency. The air cylinder 130 is mechanically connected to the injection nozzle 120 to vibrate the injection nozzle 120. That is, the air cylinder 130 is coupled to the shaft rod 135 and the shaft rod 135 which moves linearly by the stroke provided by the air cylinder 130 to cross the vibration displacement of the shaft rod 135 to the injection nozzle ( The nozzle bracket 140 for transmitting to 120 is connected. The air cylinder 130 may be replaced with a vibration motor having a shaft capable of electrically vibrating. In addition, the air cylinder 130 may be replaced with a reciprocating mechanism that enables the mechanical rotational movement of the rotational movement of the motor. The air cylinder 130 is merely a drive capable of providing reciprocating motion for vibration.

In this case, a plurality of shaft rods 135 may be installed on the chamber (C). As shown, for example, three shaft rods 135 may be installed on the upper surface of the chamber (C). Two of the three shaft rods 135 on the left side are connected to the air cylinder 130 and the nozzle bracket 140 on the lower side, and the other one on the right side is connected only to the nozzle bracket 140 on the lower side. The shaft rod 135 and the nozzle bracket 140 may support the weight of the injection nozzle 120 suspended from the chamber C and may be changed in various numbers to balance the vibration nozzle. In the illustrated example, the three parts of the spray nozzle 120 are supported, but in order to increase stability, the two-sided support may be made of a four-part support structure, or a five- or six-part support structure. .

On the other hand, the cylinder rod 131 of the air cylinder 130 is connected to the moving table 136 is a slide movement, the two shaft rods 135 are coupled to both sides of the moving table (136). Slide tubes 137 are provided on both sides of the movable table 136, and the slide tubes 137 are fitted to guide bars 138 for guiding the movement of the slide tubes 137. At this time, both end portions of the guide bar 138 is coupled to the holder 139 is fixed on the chamber (C). The two shaft rods 135 are connected to the cylinder rod 131 of the air cylinder 130 through the moving table 136 and move together by the cylinder rod 131. The guide bar 138 and the slide tube 137 may be replaced with another slide mechanism for transmitting the linear motion of the air cylinder 131. The reason why the slide bar 137 and the guide bar 138 fitted to the slide pipe 137 are adopted is that the binding force of the guide bar 138 to the slide pipe 137 is good during the slide motion.

Again, referring to FIG. 2, shaft rods 135 are installed on the left and right sides of the chamber C. FIG. The shaft rod 135 on the left side receives the driving force of the air cylinder 130, and the shaft rod 135 on the right side is connected to another part of the spray nozzle 120 to provide a large area deposition area. ) To guide the movement. The nozzle bracket 140 extends downward from the upper portion of the chamber C, the upper end is coupled to the shaft rod 135, and the lower end is connected to the injection nozzle 120. The air cylinder 130 may cause any of the plurality of injection nozzles 120 arranged in a line to vibrate within the interval between the injection nozzles 120. For example, if a plurality of injection nozzles 120 are disposed at 20 mm intervals and two different gases are alternately injected, the vibration displacement of any of the injection nozzles 120 may be up to 40 mm.

2, 3A, and 3B, a floating joint for attenuating vibration by reducing axis errors between the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 is disposed on the upper left portion of the chamber C. 141 is provided. In general, the cylinder rod 131 of the air cylinder 130 and the movement path of the shaft rod 135 may be difficult to accurately mount to the upper surface of the chamber C. When the cylinder rod 131 of the air cylinder 130 and the shaft rod 135 connected to the cylinder rod 131 in a state where the movement paths of the shaft rod 135 do not coincide in a straight line are repeatedly transmitted the axial force that is displaced The durability of the air cylinder 130 and the shaft rod 135 is reduced. Accordingly, the floating joint 141 may perform buffered power transmission even when the axis of power transmission is shifted between the cylinder rod 131 and the shaft rod 135.

The left / right upper surface portion of the chamber C is provided with a closed space through which the shaft rod 135 passes, and a shaft housing 145 in which both ends of the shaft rod 135 are movable is installed. The shaft housing 145 serves to seal the movement path of the shaft rod 135, and is installed with a sealing guide 146 surrounding and closing the shaft rod 135 protruding to both sides of the shaft housing 145. do. Although not shown, as the various sealing means for maintaining airtightness between the sealing guide 146 and the shaft housing 145, a metal O-ring or rubber ring may be installed together. The shaft rod 135 is inserted and installed in the sealing guide 146 installed on the right side of the shaft housing 145, and a bellows 147 that cushions the shock transmitted from the rod of the air cylinder 130 is installed. The bellows 147 is a corrugated pipe in which a passage through which the shaft rod 135 is inserted is formed. In addition, the ball bushing 148 into which the shaft rod 135 is inserted is fixed to the left and right sealing guides 146. The ball bushing 148 guides the linear movement of the shaft rod 135 and also performs an airtight function on the outside of the hermetic guide 146.

Referring to FIG. 4, the supply line 110 is fixed around the support 150. The support 150 is mounted on the substrate A and is suspended from the inside of the chamber C by the nozzle bracket 140 coupled to the shaft rod 135. The support body 150 has a rectangular shape in which an inner side penetrates and a frame is left outside, and the injection nozzles 120 are installed in a row below the support body 150 to close most of the inner space of the edge of the support body 150. Supply line 110 is fixed to the support 150 by a fixed block 151. Both sides of the fixing block 151 is formed with a semi-circular groove 152 that can be inserted and constrained half of the supply line 110 having a circular cross section. The fixing block 151 is fixed on the support 150 by fastening means such as screws or bolts. The fixed block 151 is installed at predetermined intervals along the supply line 110 disposed on the rectangular support 150.

In addition, referring to FIG. 4, the supply line 110 is installed on the upper surface of the support 150, and the injection nozzles 120 are arranged in a row below the support 150. The injection nozzle 120 is installed in the transverse direction crossing the transverse direction corresponding to the longer side in the support 150. That is, the injection nozzles 120 are arranged in a line in the longitudinal direction of the substrate A to form a quadrangle corresponding to the quadrangle substrate A. FIG. 5. In the case of the fifth generation substrate A, the square of the spray nozzle 120 is rectangular and provides an area corresponding to 1500 mm x 1300 mm. Of course, the injection nozzle 120 may be installed to cross in the longitudinal direction of the short length of the support 150.

5 illustrates a connection relationship between the supply line 110 and the injection nozzle 120 in which the support 150 is omitted. That is, the first connecting pipe 161 is coupled to the bottom of the supply line 110, the second connecting pipe 162 is coupled to the upper surface of the injection nozzle 120 in correspondence with the first connecting pipe 161. A connector 163 for connection is installed between the first connector 161 and the second connector 162. At this time, the first connection pipe 161 is coupled to the connector 163 through the support 150. The connector 163 is fitting means for connecting the tubes disposed on both sides.

Referring to FIG. 6, a bellows pipe 164 is provided between the plurality of supply ports 100 and the supply line 110. Bellows pipe 164 is a flexible means for connecting the supply port 100 and the supply line 110, and allows the left and right flow of the supply line 110 with respect to the supply port 100. The bellows pipe 164 is not directly connected to the supply line 110, but is connected to the supply line 110 through another supply port connected by a fitting.

7 and 8, the injection nozzle 120 is composed of a double tube. That is, the injection nozzle 120 is connected to the supply line 110 to receive the gas from the supply line 110, the first tube 171 formed with a first hole 171a for outflowing the gas upwards, and the first The second tube 172 surrounds the tube 171 and has a second hole 172a for flowing out gas downward. The first hole 171a of the first tube 171 has a larger gap between holes than the hole of the second tube 172. In general, the two first holes 171a of the first tube 171 may supply the deposition gas corresponding to the five second holes 172a of the second tube 172. The deposition gas flowing out through the first hole 171a of the first tube 171 moves along the first tube 171 and flows downward in an evenly spread state, and passes the second tube 172 to the second hole ( It flows out evenly through 172a). On the other hand, the injection nozzle 120 may be manufactured in a triple tube structure. At this time, it is advantageous for the uniform outflow of the gas to reverse the direction of the holes through which the gas flows out for each tube.

FIG. 9 is a plan view of FIG. 4 and illustrates a flow direction of the deposition gas supplied to the two supply ports 100 of FIGS. 1 and 6. For reference, arrows illustrated in FIGS. 5 and 8 illustrate the flow direction of the deposition gas flowing out of one injection nozzle 120.

Referring to FIGS. 4 to 9 together with FIG. 2, gas mixing, flow, and deposition processes of the large-area vapor deposition preventing apparatus according to an embodiment of the present invention will be described. Source materials of the deposition gas flowing through each of the two supply ports 100 shown in FIG. ₂ are, for example, Zn and O ₂ . After the substrate A is heated to a constant temperature in the susceptor S, each supply port 100 has Zn and O _2. Source material is introduced. Zinc source material may be a zinc organic compound DEZ (diethylzinc) is used, oxygen source material may be used O ₂ . At this time, DEZ is not in a gaseous state at room temperature, so the temperature is raised to a predetermined temperature, for example, about 100 ° C., so that DEZ is changed from a solid or liquid state to a gaseous state and then supplied to one supply port 100. The source material of oxygen, O _2, is a gaseous state at room temperature, and thus is supplied as it is to another supply port 100.

Deposition gas of each source material is supplied to each supply line 110 connected to each supply port 100 to fill the supply line 110 formed in a square. Then, each deposition gas is injected downward through the injection nozzle 120 connected in the transverse direction with respect to each supply line (110). At this time, the injection nozzle 120 is composed of a double tube, the deposition gas flowing along the first tube 171 by flowing upward through the first hole 171a of the first tube 171 is the second tube. It flows out to the board | substrate A below through the 2nd hole 172a of 172.

On the other hand, the cylinder rod 131 of the air cylinder 130 is reciprocating, the cylinder rod 131 reciprocates the shaft rod 135 installed in the shaft housing 145. The shaft rod 135 vibrates the nozzle bracket 140 coupled to the support 150 by a reciprocating motion while moving by the stroke of the cylinder rod 131 preset. When the nozzle bracket 140 is vibrated, the injection nozzle 120 installed at the bottom of the nozzle bracket 140 vibrates while reciprocating to both sides. In this case, the vibration range of the arbitrary injection nozzles 120 among the plurality of injection nozzles 120 may be set within a distance between the arbitrary injection nozzles 120 and the nearest injection nozzle 120. For example, in the present embodiment, the plurality of injection nozzles 120 are composed of alternating DEZ gas injection nozzles 120 and O ₂ gas injection nozzles 120, and vibration of any DEZ gas injection nozzles 120. The range may be twice the spacing between any DEZ gas injection nozzle 120 and the nearest O ₂ gas injection nozzle 120.

As such, each injection nozzle 120 discharges the deposition gas by exchanging positions of different deposition gases with each other by the vibration of the air cylinder 130, and the deposited deposition gas forms a zigzag waveform from above to below. While reaching the substrate side. At this time, the DEZ gas and the O ₂ gas, which is the deposition gas, are sprayed onto the substrate A while being more easily mixed by the vibration of the injection nozzle 120, and have a constant thickness on the substrate A by chemical reaction such as oxidation / reduction. ZnO may be deposited.

The drawings of the embodiments of the present invention described above are omitted in detail, and are schematically illustrated so as to easily identify parts belonging to the technical idea of the present invention. It should be noted that the above-described embodiments are not intended to limit the technical spirit of the present invention and are merely a reference for understanding the technical scope of the present invention.

A: substrate C: chamber
S: susceptor G: gate valve
P: Pin 100: Supply port
110: supply line 120: injection nozzle
130: air cylinder 131: cylinder rod
135: shaft rod 136: moving table
137: slide tube 138: guide bar
139: holder 140: nozzle bracket
141: floating joint 145: shaft housing
146: sealing guide 147: bellows
148: ball bushing 150: support
151: fixed block 152: semicircular groove
161: first connector 162: second connector
163: connector 164: bellows tube
171: first tube 171a: first hole
172: second tube 172a: second hole

Claims (20)

A chamber C providing a deposition space for depositing a predetermined material on the substrate;
A plurality of supply ports 100 for supplying gas into the chamber C;
A plurality of supply lines (110) disposed inside the chamber (C) and connected to the respective supply ports (100); And
A plurality of first holes 171a disposed above the substrate in the chamber C to be connected to the supply line 110, and receive gas from the supply line 110 to allow gas to flow upward. A plurality of second holes 172a are installed to surround the formed first tube 171 and the first tube 171, and allow the gas flowing out of the first hole 171a to flow out downward of the substrate. A plurality of injection nozzles 120 each having a second tube 172 formed thereon and alternately disposed along the inner space of the chamber C to supply different gases to the upper surface of the substrate at alternate positions. Large area deposition apparatus for preventing gas mixing, comprising a. The method of claim 1,
The large area deposition apparatus for preventing gas mixing, characterized in that the outside of the chamber (C) is provided with an air cylinder 130 for vibrating the injection nozzle (120). The method of claim 2,
Outside the chamber (C) is provided with a plurality of shaft rods 135 which are movably installed in the chamber (C), interlocked with the cylinder rod (131) of the air cylinder (130),
Inside the chamber C, a plurality of nozzle brackets 140 having one end coupled to the shaft rod 135 and the other end connected to the injection nozzle 120 are provided. Device. The method of claim 3,
Three shaft rods 135 are installed on the upper surface of the chamber C, two of the three shaft rods 135 are connected to the air cylinder 130,
The other is a large area deposition apparatus for preventing gas mixing, characterized in that connected to any one of the nozzle bracket 140 on the opposite side. The method of claim 4, wherein
The cylinder rod 131 of the air cylinder 130 is connected to the moving table 136 which is slidably moved, and the two shaft rods 135 are coupled to both sides of the moving table 136. Large area deposition equipment for preventing gas mixing. The method of claim 5,
Slide tubes 137 are installed on both sides of the movable table 136, and the slide tubes 137 are fitted to guide bars 138 for guiding the movement of the slide tubes 137. Large area vapor deposition apparatus for prevention. The method of claim 6,
Both end portions of the guide bar (138) is a large area deposition apparatus for preventing gas mixing, characterized in that coupled to the fixing (139). The method of claim 3,
It is provided that a plurality of shaft housings 145 are provided outside the chamber C to provide a closed space through which the shaft rod 135 passes, and both ends of the shaft rod 135 are movable. A large area vapor deposition apparatus for preventing gas mixing. The method of claim 3,
Large area deposition apparatus for preventing gas mixing, characterized in that the floating joint (141) is provided between the cylinder rod (131) and the shaft rod (135) of the air cylinder 130 to reduce the vibration caused by the axis error. The method of claim 3,
The shaft rod 135 is a large-area deposition apparatus for preventing gas mixing, characterized in that the bellows (147) for buffering the shock transmitted from the cylinder rod (131) of the air cylinder (130) is installed. The method of claim 10,
The shaft rod 135 is a large area deposition apparatus for preventing gas mixing, characterized in that the ball bushing (148) in contact with the bellows (147) is installed. The method of claim 2,
The air cylinder 130 is a large-area deposition apparatus for preventing gas mixing, characterized in that the arbitrary injection nozzles 120 to vibrate within the interval between the injection nozzles (120). The method of claim 1,
The supply line 110 is a large area deposition apparatus for preventing gas mixing, characterized in that fixed to the circumference of the support 150 is installed in the chamber (C) on the substrate. The method of claim 13,
The support 150 has a rectangular shape in which the edge is left through to the inside, and the injection nozzle 120 is installed in a row below the support 150 to close the inner space of the edge of the support 150. A large area vapor deposition apparatus for preventing gas mixing. The method of claim 13,
The support 150 is a large area deposition apparatus for preventing gas mixing, characterized in that the fixing block 151 for fixing the supply line 110 is provided. The method of claim 1,
A first connecting pipe 161 is coupled to a bottom of the supply line 110, and a second connecting pipe 162 is coupled to an upper surface of the injection nozzle 120 in correspondence with the first connecting pipe 161. And a connector 163 for connection between the first connector 161 and the second connector 162 is installed. The method of claim 1,
A large-area deposition apparatus for preventing gas mixing, characterized in that a bellows pipe (164) is provided between the plurality of supply ports (100) and the supply line (110). delete delete The method of claim 1,
The spray nozzle 120 is a large area deposition apparatus for preventing gas mixing, characterized in that arranged in a line in the longitudinal direction of the substrate to form a square.

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