WO2011149278A2

WO2011149278A2 - Large-area deposition device for gas-mixing prevention

Info

Publication number: WO2011149278A2
Application number: PCT/KR2011/003855
Authority: WO
Inventors: 이경호
Original assignee: 주식회사 테라세미콘
Priority date: 2010-05-28
Filing date: 2011-05-26
Publication date: 2011-12-01
Also published as: JP2013528251A; KR20110130877A; KR101120039B1; TW201213598A; WO2011149278A3; CN102906861A

Abstract

Disclosed is a large-area deposition device for gas-mixing prevention. According to the present invention, since injection nozzles of a multi-tube structure are applied, the large-area deposition device for gas-mixing prevention enables each gas to be supplied to the different injection nozzles whereby the gases are uniformly mixed when being jetted in a chamber, such that the mixed gases are jetted to the inside of the chamber in a uniform manner. That is to say, the invention with a simple structure is capable of preventing the gases from being mixed before the gases flow into the inside of the chamber, and equally mixing the gases to uniformly jet the mixed gases to the inside of the chamber, thereby reducing costs. Further, since the injection nozzles jet the gases by vibrating in a horizontal direction, the gases are mixed more uniformly in such a manner that the mixed gases are jetted to a substrate inside the chamber in a more uniform manner, whereby the quality of films deposited on the substrate is improved. In addition, since the injection nozzles are repaired or cleaned by being separated from each other, maintenance works can be simply conducted.

Description

Large area deposition equipment for preventing gas mixing

The present invention relates to a large-area deposition apparatus for preventing gas mixing, which prevents gas from being mixed with each other before the gas is introduced into the chamber, and prevents gas mixture from being uniformly mixed with the gas to be uniformly injected into the chamber. A large area deposition apparatus.

Thin film deposition technology by chemical vapor deposition (CVD) is very important in many applications such as insulating layer and active layer of semiconductor device, transparent electrode of liquid crystal display device, light emitting layer and protective layer of light emitting display device. .

In general, physical properties of thin films deposited by CVD are highly sensitive to process conditions such as deposition pressure, deposition temperature, and deposition time. For example, the composition, density, adhesion, and deposition rate of the thin film to be deposited may be changed according to the change in deposition pressure.

Chemical vapor deposition includes LPCVD (Low Pressure Chemical Vapor Deposition), APCVD (Atmospheric Pressure Chemical Vapor Deposition), LTCVD (Low Temperature Chemical Vapor Deposition), PECVD (Plasma Enhanced Chemical Vapor Deposition), MOCVD (Metal Organic Chemical Vapor Deposition) Can be divided.

Among them, MOCVD uses metal organic compounds as precursors, and is a technology for growing a desired thin film by sending high vapor pressure metal organic compound vapor to a heated substrate surface in a chamber.

MOCVD has excellent step coverage and is free from damage to the substrate or the crystal surface, and can grow high purity and high quality thin films. In addition, since the deposition rate is relatively short, the process time can be shortened, and the productivity is also excellent.

The conventional MOCVD apparatus requires a shower head in which many fine holes are formed for uniformly injecting a gas, thereby increasing the cost.

In particular, conventional MOCVD devices require processing of the shower head into a more complex shape to prevent the two or more gases used in the deposition of the thin film to mix before spraying to prevent deposition in undesired locations. For this reason, there is a problem that the cost of the MOCVD apparatus further increases.

In addition, the conventional MOCVD apparatus has a problem in that maintenance is inconvenient because the entire shower head must be separated when the gas injection hole of the shower head is clogged for repair or cleaning.

The present invention has been made to solve the above problems of the prior art, an object of the present invention is to simplify the structure of the gas to prevent the mutual mixing before entering the chamber, and at the same time the gas is uniformly mixed chamber It is to provide a large-area deposition apparatus for preventing gas mixing by uniformly spraying the inside, which can reduce the cost.

Another object of the present invention is to provide a large area deposition apparatus for preventing gas mixing, which is easy to maintain.

In the large-area vapor deposition apparatus for preventing gas mixing according to the present invention, since a multi-tube spray nozzle is applied to each gas to be supplied to different spray nozzles, when the gas is ejected from the chamber, the gas is uniformly mixed into the chamber. It is ejected uniformly. That is, the gas can be prevented from being mixed before the gas is introduced into the chamber with a simple structure, and the gas can be uniformly mixed to eject the gas into the chamber, thereby reducing the cost.

Further, since the injection nozzle ejects the gas while oscillating left and right, the gas is more uniformly mixed and more uniformly ejected to the substrate inside the chamber, thereby improving the quality of the film deposited on the substrate.

And, since it can be repaired or cleaned separately for each injection nozzle, there is a simple effect of maintenance work.

1 is a plan view of a large-area vapor deposition preventing apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line “I-I” of FIG. 1.

3 is an enlarged view of a portion “X” of FIG. 2.

4 is an enlarged view of a portion “Y” of FIG. 2.

5 is a perspective view of a supply line of a large-area vapor deposition preventing apparatus according to an embodiment of the present invention.

FIG. 6 is a perspective view of one supply line and a spray nozzle shown in FIG. 5.

FIG. 7 is a cross-sectional view taken along the line “II-II” of FIG. 1.

8 is a cross-sectional view of the jet nozzle shown in FIG. 6.

FIG. 9 is a partially cutaway perspective view of the connector portion shown in FIG. 8. FIG.

FIG. 10 is a plan view of FIG. 5.

According to an aspect of the present invention, there is provided a gas mixing prevention large area deposition apparatus comprising: a chamber providing a deposition space for depositing a predetermined material on a substrate; A plurality of supply ports installed at one side of the chamber and supplying gas into the chamber; A plurality of supply lines disposed in the chamber and connected to the respective supply ports; And a plurality of injection nozzles disposed above the substrate introduced into the chamber, connected along each supply line, and alternately arranged to alternately disperse different gases to eject the upper surface of the substrate. do.

DETAILED DESCRIPTION OF THE INVENTION The following detailed description of the invention refers to the accompanying drawings that illustrate specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention, although different from one another, need not be mutually exclusive. For example, certain shapes, specific structures, and features described herein may be embodied in other embodiments without departing from the spirit and scope of the invention in connection with the embodiments. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, along with the full scope of equivalents to which such claims are entitled. The length, area, thickness, and shape of the embodiments shown in the drawings may be exaggerated for convenience.

Hereinafter, the configuration of the present invention will be described in detail with reference to the accompanying drawings.

1 and 2, the large-area vapor deposition preventing apparatus according to an embodiment of the present invention is installed in the chamber C, the chamber C, and functions as a heater to heat the substrate A. A susceptor S and a gate valve G installed at one side of the chamber C to allow the substrate A to enter and exit the chamber C, and are provided outside the chamber C to supply air inside the chamber C. And a vacuum pump (not shown) for exhausting.

Except when the gate valve G is opened for entry and exit of the substrate A, the chamber C provides a closed space for depositing a predetermined material on the substrate A. The substrate A is deposited on the plurality of fins P and deposited.

A plurality of supply ports 100 for supplying gas are installed in an upper portion of the chamber C, and a plurality of supply lines 110 connected to the respective supply ports 100 to supply deposition gas inside the chamber C. ) Is placed. Supply line 110 is a pipeline through which gas or steam flows.

A plurality of injection nozzles 120 are installed below the supply line 110. The injection nozzle 120 is a conduit in which holes are formed to eject the gas moving inside the supply line 110 to the outside. The injection nozzle 120 is disposed above the substrate A inside the chamber C, and is alternately disposed along each supply line 110 to alternately supply other gases to the upper surface of the substrate A.

The injection nozzle 120 is densely arranged in a row above the substrate A to uniformly inject the deposition gas onto the substrate A corresponding to the large area. Different gases injected from the injection nozzles 120 are sprayed and overlapped with each other, so that they are mixed with each other. Then, it is deposited with a uniform thickness on the large-area substrate (A).

1 to 4, the upper surface portion of the chamber C vibrates the injection nozzle 120 uniformly on the large-area substrate A to improve the efficiency in which different gases are mixed and deposited on the substrate A. FIG. A vibration air cylinder 130 for increasing is provided. The air cylinder 130 is mechanically connected to the injection nozzle 120 to vibrate the injection nozzle 120.

That is, the air cylinder 130 is coupled to the shaft rod 135 and the shaft rod 135 which moves linearly by the stroke provided by the air cylinder 130 to cross the vibration displacement of the shaft rod 135 to the injection nozzle ( The nozzle bracket 140 for transmitting to 120 is connected. The air cylinder 130 may be replaced with a vibration motor having a shaft capable of electrically vibrating. In addition, the air cylinder 130 may be replaced with a reciprocating mechanism that enables the mechanical rotational movement of the rotational movement of the motor. That is, the air cylinder 130 is a driving body that provides a reciprocating motion for the vibration of the injection nozzle (120).

In this case, a plurality of shaft rods 135 may be installed on the chamber (C). As shown, three shaft rods 135 may be installed on the upper surface of the chamber (C). Two of the three shaft rods 135 on the left side are connected to the air cylinder 130 and the nozzle bracket 140 on the lower side, and the other on the right side is connected only to the nozzle bracket 140 on the lower side. The shaft rod 135 and the nozzle bracket 140 can support the weight of the injection nozzle 120 installed in the form of hanging in the chamber (C), and the number varies so as to balance the vibration of the injection nozzle 120. Can be changed. That is, the illustrated example supports the three parts of the injection nozzle 120, but can also be fabricated as a four-part support structure for supporting two parts on both sides in order to increase the stability, and furthermore can be manufactured as a five or six part support structure It may be.

On the other hand, the cylinder rod 131 of the air cylinder 130 is connected to the moving table 136 is a slide movement, the two shaft rods 135 are coupled to both sides of the moving table (136). In addition, slide tubes 137 are provided on both sides of the movable table 136, and the slide tubes 137 are fitted to guide bars 138 for guiding the movement of the slide tubes 137. At this time, both end portions of the guide bar 138 is coupled to the holder 139 is fixed on the chamber (C).

The two shaft rods 135 are connected to the cylinder rod 131 of the air cylinder 130 through the moving table 136 and move together by the cylinder rod 131. The guide bar 138 and the slide tube 137 can be replaced with other slide mechanisms for transmitting the linear motion of the air cylinder 131. The slide tube 137 and the guide bar 138 are adopted because the binding force of the guide bar 138 to the slide tube 137 during the slide movement is good.

2, the shaft rod 135 is installed on the left and right sides of the chamber (C). The shaft rod 135 on the left side receives the driving force of the air cylinder 130, and the shaft rod 135 on the right side is connected to another part of the spray nozzle 120 to guide the movement of the spray nozzle 120. Perform. The nozzle bracket 140 extends downward from the upper portion of the chamber C, the upper end is coupled to the shaft rod 135, and the lower end is connected to the injection nozzle 120.

The air cylinder 130 causes the plurality of injection nozzles 120 arranged in a line to vibrate between the main nozzle 120 and the injection nozzle 120 adjacent to each other. For example, if a plurality of injection nozzles 120 are arranged at intervals of 20 mm each and two different gases are alternately injected, the vibration displacement of any injection nozzle 120 is up to 40 mm.

2, 3, and 4, a floating joint for attenuating vibration by reducing axis errors between the cylinder rod 131 and the shaft rod 135 of the air cylinder 130 is disposed on the upper left portion of the chamber C. 141 is provided.

In general, the cylinder rod 131 of the air cylinder 130 and the movement path of the shaft rod 135 may be difficult to accurately mount to the upper surface of the chamber C. If the cylinder rod 131 of the air cylinder 130 and the movement path of the shaft rod 135 do not coincide in a straight line, the shaft rod 135 connected to the cylinder rod 131 repeatedly transmits the axial force that is displaced. If received, the durability of the air cylinder 130 and the shaft rod 135 is reduced. In this case, the floating joint 141 performs buffered power transmission when the power transmission axis between the cylinder rod 131 and the shaft rod 135 is shifted.

The left / right upper surface portion of the chamber C is provided with a closed space through which the shaft rod 135 passes, and a shaft housing 145 in which both ends of the shaft rod 135 are movable is installed. The shaft housing 145 serves to close the movement path of the shaft rod 135. The shaft guide 146 surrounding the shaft rod 135 protruding to both sides of the shaft housing 145 closes the shaft. It is installed in the housing 145.

As the various sealing means for maintaining the airtightness between the sealing guide 146 and the shaft housing 145, a metal O-ring (not shown), rubber ring (not shown) may be installed together. The sealing guide 146 installed on the right side of the shaft housing 145 is provided with a bellows 147 for buffering the shock transmitted from the shaft rod 135 in the air cylinder 130.

The bellows 147 is a corrugated pipe in which a passage through which the shaft rod 135 is inserted is formed. In addition, the ball bushing 148 into which the shaft rod 135 is inserted is fixed to the left and right sealing guides 146. The ball bushing 148 guides the linear movement of the shaft rod 135 and also performs an airtight function on the outside of the hermetic guide 146.

3 to 5, the supply line 110 is fixed around the support 150. The support 150 is positioned on the substrate A, and is installed in the form of being suspended in the chamber C by the nozzle bracket 140 coupled to the shaft rod 135.

The support 150 is a rectangular frame, and the injection nozzles 120 are installed in a row below the support 150 to close most of the inner space of the support 150.

Supply line 110 is fixed to the support 150 by a fixed block 151. Semicircular grooves 152 are formed at both sides of the fixed block 151 so that half of the supply line 110 having a circular cross section is inserted and restrained. The fixing block 151 is fixed on the support 150 by fastening means such as screws or bolts. The fixed block 151 is installed at predetermined intervals along the supply line 110 disposed on the rectangular support 150.

Referring to FIG. 5, the supply line 110 is installed at an upper surface of the support 150, and the injection nozzles 120 are arranged in a row below the support 150. Injection nozzle 120 is installed in the longitudinal direction to cross the horizontal direction corresponding to the long side in the support 150. Thus, the plurality of injection nozzles 120 are disposed along the longitudinal direction of the substrate A to form a quadrangle corresponding to the quadrangle substrate A. FIG. 5. In the case of the fifth generation substrate A, the spray nozzle 120 provides a rectangular area corresponding to 1500 mm x 1300 mm. Of course, the injection nozzle 120 may be installed to cross in the longitudinal direction of the short length of the support 150. 6 illustrates a connection relationship between the supply line 110 and the injection nozzle 120. That is, the first connecting pipe 161 is coupled to the bottom of the supply line 110, the second connecting pipe 162 is coupled to the upper surface of the injection nozzle 120 in correspondence with the first connecting pipe 161. The first connector 161 and the second connector 162 are interconnected via the connector 163. At this time, the first connection pipe 161 is coupled to the connector 163 through the support 150 (see FIG. 5). The connector 163 is a fitting means.

Referring to FIG. 7, a bellows pipe 164 is provided between the plurality of supply ports 100 and the supply line 110. The bellows pipe 164 connects the supply port 100 and the supply line 110 and is stretched to allow the left and right flow of the supply line 110 with respect to the supply port 100. The bellows pipe 164 is not directly connected to the supply line 110, but is connected to the supply line 110 through another supply port connected by a fitting.

8 and 9, the injection nozzle 120 is composed of a concentric double tube. That is, the injection nozzle 120 is connected to the supply line 110 to receive the gas from the supply line 110 and the first tube 171 and the first tube formed with a first hole 171a for ejecting the gas upwards It is comprised by the 2nd tube 172 which wraps around 171, and the 2nd hole 172a which blows gas downward is formed.

The first hole 171a of the first tube 171 has a larger gap between holes than the hole of the second tube 172. In general, the two first holes 171a of the first tube 171 may supply the deposition gas corresponding to the five second holes 172a of the second tube 172. The deposition gas ejected through the first hole 171a of the first tube 171 moves along the second tube 172 and flows downward in an evenly spread state, and the second hole (2) of the second tube 172 172a) is ejected evenly downward.

On the other hand, the injection nozzle 120 can be manufactured in a multi-tube structure of more than three. At this time, it is advantageous for the uniform ejection of the gas to reverse the directions of the holes for ejecting the gas for each tube.

FIG. 10 is a plan view of FIG. 5 and illustrates a flow direction of the deposition gas supplied to the two supply ports 100 of FIGS. 1 and 7. For reference, arrows illustrated in FIGS. 6 and 9 illustrate the flow direction of the deposition gas ejected from one injection nozzle 120.

5 to 10 together with FIG. 2 will be described the gas mixing, flow and deposition process of the large area deposition apparatus for preventing gas mixing according to an embodiment of the present invention.

Source materials of the deposition gas flowing through each of the two supply ports 100 shown in FIG. ₂ are, for example, Zn and O ₂ . After the substrate A is heated to a predetermined temperature in the susceptor S, Zn and O ₂ source materials are introduced into each supply port 100. Zn source material may be a Zn organic compound DEZ (diethylzinc) is used, O ₂ source material may be used O ₂ . At this time, since DEZ is not in a gaseous state at room temperature, the temperature is raised, for example, about 100 ° C., so that DEZ is changed from a solid or liquid state to a gaseous state, and then supplied to one supply port 100. The source material of the O ₂ O ₂ is supplied onto Since gaseous at normal temperatures and third port 100.

Deposition gas of each source material is supplied to each supply line 110 connected to each supply port 100 to fill the supply line 110 formed in a square. Then, each deposition gas is injected downward through the injection nozzle 120 connected in the transverse direction with respect to each supply line (110). At this time, the injection nozzle 120 is composed of a double tube, the deposition gas spread along the second tube 172 by flowing upward through the first hole 171a of the first tube 171 is the second tube. It blows out to the board | substrate A below through the 2nd hole 172a of 172.

Meanwhile, the cylinder rod 131 of the air cylinder 130 is reciprocated, and the cylinder rod 131 reciprocates the shaft rod 135 installed in the shaft housing 145. The shaft rod 135 vibrates the nozzle bracket 140 coupled to the support 150 by a reciprocating motion while moving by the stroke of the cylinder rod 131 set in advance. When the nozzle bracket 140 is vibrated, the injection nozzle 120 installed at the lower portion of the nozzle bracket 140 vibrates while reciprocating to both sides. In this case, the vibration range of the arbitrary injection nozzles 120 among the plurality of injection nozzles 120 may be set within the interval between the arbitrary injection nozzles 120 and the nearest injection nozzle 120. For example, in the present embodiment, the plurality of injection nozzles 120 are composed of alternating DEZ gas injection nozzles 120 and O ₂ gas injection nozzles 120, and vibration of any DEZ gas injection nozzles 120. The range may be twice the spacing between any DEZ gas injection nozzle 120 and the nearest O ₂ gas injection nozzle 120.

As described above, each of the injection nozzles 120 injects different deposition gases while exchanging positions by vibrating the air cylinder 130, and the injected deposition gases form a zigzag waveform from above to below. A) is reached to the side. At this time, the DEZ gas and the O ₂ gas, which is the deposition gas, are sprayed onto the substrate A while being more easily mixed by the vibration of the injection nozzle 120, and have a constant thickness on the substrate A by chemical reaction such as oxidation / reduction. Is deposited with ZnO.

The drawings of the embodiments of the present invention described above are schematically illustrated so as to easily understand the parts belonging to the technical idea of the present invention by omitting detailed outline lines. In addition, the embodiments are not intended to limit the technical spirit of the present invention, but are merely a reference for understanding the technical matters included in the claims of the present invention.

Claims

A chamber providing a deposition space for depositing a predetermined material on a substrate;

A plurality of supply ports installed at one side of the chamber and supplying gas into the chamber;

A plurality of supply lines disposed in the chamber and connected to the respective supply ports; And

And a plurality of injection nozzles disposed above the substrate introduced into the chamber, connected along each supply line, and alternately arranged to alternately disperse different gases to eject the upper surface of the substrate. Large area deposition equipment for preventing gas mixing.
The method of claim 1,

Large area deposition apparatus for preventing gas mixing, characterized in that the outer cylinder is provided with an air cylinder for vibrating the injection nozzle.
The method of claim 2,

A plurality of shaft rods are installed on the outside of the chamber so as to be movable and interlock with the cylinder rods of the air cylinders.

And a plurality of nozzle brackets having one end coupled to the shaft rod and the other end connected to the injection nozzle, respectively, in the chamber.
The method of claim 3,

Three shaft rods are installed on the upper surface of the chamber,

Two of the three shaft rods are connected to the air cylinder,

The other large area deposition apparatus for preventing gas mixing, characterized in that connected to any one of the nozzle bracket on the opposite side.
The method of claim 4, wherein

The movable rod which is slide-moved is connected to the cylinder rod of the air cylinder, and the two shaft rods connected to the air cylinder are coupled to both sides of the movable unit.
The method of claim 5,

A slide tube is installed on both sides of the movable table, and the slide tube is fitted with a guide bar for guiding the movement of the slide tube.
The method of claim 6,

Both end portions of the guide bar is gas mixing prevention large-area deposition apparatus, characterized in that coupled to the fixing table installed on the upper surface of the chamber.
The method of claim 3,

And a plurality of shaft housings provided at an outer side of the chamber to provide a closed space through which the shaft rod passes, and wherein both shaft ends of the shaft rod are movable to be installed.
The method of claim 3,

And a floating joint is provided between the cylinder rod of the air cylinder and the shaft rod to reduce vibration due to an axial error.
The method of claim 3,

The shaft rod is a large area deposition apparatus for preventing gas mixing, characterized in that the bellows for cushioning the shock transmitted from the cylinder rod of the air cylinder is installed.
The method of claim 10,

The shaft rod deposition apparatus for preventing gas mixing, characterized in that the ball bushing in contact with the bellows is installed.
The method of claim 2,

And the air cylinder vibrates any of the spray nozzles within a distance between adjacent spray nozzles.
The method of claim 1,

And the supply line is fixed around a support installed in the chamber above the substrate.
The method of claim 13,

The support body has a rectangular frame shape, the injection nozzle is installed in a row below the support to close the inner space of the support gas deposition preventing large area deposition apparatus, characterized in that.
The method of claim 13,

A large area deposition apparatus for preventing gas mixing, characterized in that the support block is installed on the support to fix the supply line.
The method of claim 1,

A first connector is coupled to a bottom surface of the supply line, and a second connector is coupled to an upper surface of the injection nozzle corresponding to the first connector, and the first connector and the second connector connect a connector. Large area deposition apparatus for preventing gas mixing, characterized in that interconnected via a medium.
The method of claim 1,

A large-area deposition apparatus for preventing gas mixing, characterized in that a bellows pipe is provided between the plurality of supply ports and the supply line.
The method of claim 1,

The injection nozzle is a large area deposition apparatus for preventing gas mixing, characterized in that consisting of multiple concentric tubes.
The method of claim 18,

The injection nozzle may include a first tube connected to the supply line and receiving a gas from the supply line and having a first hole for ejecting gas upwardly; And

And a second tube surrounding the first tube, the second tube having a second hole for ejecting the gas ejected from the first hole downward.
The method of claim 1,

And the plurality of injection nozzles are disposed along a length direction of the substrate to form a quadrangle.