JP2013526066A - 低減されたダイ歪みアッセンブリのためのパッケージ基板のためのｃｔｅ補償 - Google Patents

低減されたダイ歪みアッセンブリのためのパッケージ基板のためのｃｔｅ補償 Download PDF

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JP2013526066A
JP2013526066A JP2013508271A JP2013508271A JP2013526066A JP 2013526066 A JP2013526066 A JP 2013526066A JP 2013508271 A JP2013508271 A JP 2013508271A JP 2013508271 A JP2013508271 A JP 2013508271A JP 2013526066 A JP2013526066 A JP 2013526066A
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substrate
dies
die
package substrate
singulated
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JP2013526066A5 (enExample
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ローズ シモンズ マシューズ マーガレット
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日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013508271A 2010-04-29 2011-04-29 低減されたダイ歪みアッセンブリのためのパッケージ基板のためのｃｔｅ補償 Pending JP2013526066A (ja)

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US20130029457A1 (en) 2013-01-31
CN102844861A (zh) 2012-12-26
US20140183719A1 (en) 2014-07-03
CN102844861B (zh) 2016-01-13
US8759154B2 (en) 2014-06-24
US20110266693A1 (en) 2011-11-03
WO2011139875A2 (en) 2011-11-10
WO2011139875A3 (en) 2012-02-23

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