JP2013521662A - ナノ構造およびそれを実施する光起電力セル - Google Patents
ナノ構造およびそれを実施する光起電力セル Download PDFInfo
- Publication number
- JP2013521662A JP2013521662A JP2012556244A JP2012556244A JP2013521662A JP 2013521662 A JP2013521662 A JP 2013521662A JP 2012556244 A JP2012556244 A JP 2012556244A JP 2012556244 A JP2012556244 A JP 2012556244A JP 2013521662 A JP2013521662 A JP 2013521662A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- layers
- photovoltaic structure
- photovoltaic
- nanocable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002086 nanomaterial Substances 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 151
- 239000000463 material Substances 0.000 claims description 137
- 239000000758 substrate Substances 0.000 claims description 75
- 238000000151 deposition Methods 0.000 claims description 64
- 239000004065 semiconductor Substances 0.000 claims description 57
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 238000007747 plating Methods 0.000 claims description 54
- 239000002245 particle Substances 0.000 claims description 52
- 229910004613 CdTe Inorganic materials 0.000 claims description 40
- 230000008021 deposition Effects 0.000 claims description 40
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 36
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 150000001875 compounds Chemical class 0.000 claims description 32
- 229910052710 silicon Inorganic materials 0.000 claims description 29
- 239000010703 silicon Substances 0.000 claims description 29
- 239000004020 conductor Substances 0.000 claims description 26
- 238000005530 etching Methods 0.000 claims description 25
- 229910052980 cadmium sulfide Inorganic materials 0.000 claims description 22
- 239000011787 zinc oxide Substances 0.000 claims description 18
- 239000011701 zinc Substances 0.000 claims description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 14
- 238000009792 diffusion process Methods 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 14
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 13
- 229910001887 tin oxide Inorganic materials 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000002019 doping agent Substances 0.000 claims description 10
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 8
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910002601 GaN Inorganic materials 0.000 claims description 6
- 229910052793 cadmium Inorganic materials 0.000 claims description 6
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 claims description 4
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical group [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 238000002161 passivation Methods 0.000 claims description 3
- 229910000925 Cd alloy Inorganic materials 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical group [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- 150000001805 chlorine compounds Chemical class 0.000 claims description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- UMJICYDOGPFMOB-UHFFFAOYSA-N zinc;cadmium(2+);oxygen(2-) Chemical group [O-2].[O-2].[Zn+2].[Cd+2] UMJICYDOGPFMOB-UHFFFAOYSA-N 0.000 claims description 2
- 229910000807 Ga alloy Inorganic materials 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 230000000704 physical effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 242
- 210000004027 cell Anatomy 0.000 description 140
- 239000010408 film Substances 0.000 description 89
- 238000013459 approach Methods 0.000 description 50
- 230000008569 process Effects 0.000 description 43
- 239000012528 membrane Substances 0.000 description 42
- 229920000642 polymer Polymers 0.000 description 28
- 238000005229 chemical vapour deposition Methods 0.000 description 25
- 239000010949 copper Substances 0.000 description 21
- 239000010409 thin film Substances 0.000 description 21
- 230000000694 effects Effects 0.000 description 20
- 238000004070 electrodeposition Methods 0.000 description 19
- 239000012212 insulator Substances 0.000 description 18
- 229910044991 metal oxide Inorganic materials 0.000 description 18
- 150000004706 metal oxides Chemical class 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 18
- 239000011162 core material Substances 0.000 description 17
- 230000035515 penetration Effects 0.000 description 17
- 238000010521 absorption reaction Methods 0.000 description 16
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- 230000008901 benefit Effects 0.000 description 15
- 238000012545 processing Methods 0.000 description 15
- 229910052799 carbon Inorganic materials 0.000 description 14
- 239000002073 nanorod Substances 0.000 description 14
- 230000003287 optical effect Effects 0.000 description 14
- 238000004544 sputter deposition Methods 0.000 description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 238000005516 engineering process Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 239000013078 crystal Substances 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 238000000527 sonication Methods 0.000 description 11
- -1 NiPt Inorganic materials 0.000 description 10
- 230000005611 electricity Effects 0.000 description 10
- 239000010931 gold Substances 0.000 description 10
- 239000011148 porous material Substances 0.000 description 10
- 238000010248 power generation Methods 0.000 description 10
- 239000011669 selenium Substances 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910006404 SnO 2 Inorganic materials 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 7
- 238000003877 atomic layer epitaxy Methods 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 230000007246 mechanism Effects 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 230000006798 recombination Effects 0.000 description 7
- 238000005215 recombination Methods 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- 238000003491 array Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 238000004049 embossing Methods 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 230000012010 growth Effects 0.000 description 6
- 229910052714 tellurium Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 5
- 239000000975 dye Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 239000002356 single layer Substances 0.000 description 5
- 229910052717 sulfur Inorganic materials 0.000 description 5
- 239000004408 titanium dioxide Substances 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 229920001940 conductive polymer Polymers 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000002070 nanowire Substances 0.000 description 4
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 229920000553 poly(phenylenevinylene) Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 230000002441 reversible effect Effects 0.000 description 4
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 239000002071 nanotube Substances 0.000 description 3
- 230000036961 partial effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- 239000010944 silver (metal) Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- 239000011593 sulfur Substances 0.000 description 3
- 238000007725 thermal activation Methods 0.000 description 3
- 238000002207 thermal evaporation Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- LRFVTYWOQMYALW-UHFFFAOYSA-N 9H-xanthine Chemical compound O=C1NC(=O)NC2=C1NC=N2 LRFVTYWOQMYALW-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910005913 NiTe Inorganic materials 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 229910007709 ZnTe Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000001994 activation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229920000109 alkoxy-substituted poly(p-phenylene vinylene) Polymers 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 230000005465 channeling Effects 0.000 description 2
- 238000000224 chemical solution deposition Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000000609 electron-beam lithography Methods 0.000 description 2
- 238000001962 electrophoresis Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 229910003002 lithium salt Inorganic materials 0.000 description 2
- 159000000002 lithium salts Chemical class 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910001923 silver oxide Inorganic materials 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- ZDHWTWWXCXEGIC-UHFFFAOYSA-N 2-ethenylpyrimidine Chemical compound C=CC1=NC=CC=N1 ZDHWTWWXCXEGIC-UHFFFAOYSA-N 0.000 description 1
- 101710134784 Agnoprotein Proteins 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910002531 CuTe Inorganic materials 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 229910000878 H alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N NMP Substances CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000943 NiAl Inorganic materials 0.000 description 1
- 229910005578 NiBi Inorganic materials 0.000 description 1
- 229910003322 NiCu Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 206010035148 Plague Diseases 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- 229910018321 SbTe Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910021607 Silver chloride Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 229910007717 ZnSnO Inorganic materials 0.000 description 1
- XHCLAFWTIXFWPH-UHFFFAOYSA-N [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[V+5].[V+5] XHCLAFWTIXFWPH-UHFFFAOYSA-N 0.000 description 1
- UOBPHQJGWSVXFS-UHFFFAOYSA-N [O].[F] Chemical compound [O].[F] UOBPHQJGWSVXFS-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 239000002885 antiferromagnetic material Substances 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 239000012707 chemical precursor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 210000002858 crystal cell Anatomy 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 230000013742 energy transducer activity Effects 0.000 description 1
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical class O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 239000011245 gel electrolyte Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000003955 hot wall epitaxy Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004943 liquid phase epitaxy Methods 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- ZJZXSOKJEJFHCP-UHFFFAOYSA-M lithium;thiocyanate Chemical compound [Li+].[S-]C#N ZJZXSOKJEJFHCP-UHFFFAOYSA-M 0.000 description 1
- MCVFFRWZNYZUIJ-UHFFFAOYSA-M lithium;trifluoromethanesulfonate Chemical compound [Li+].[O-]S(=O)(=O)C(F)(F)F MCVFFRWZNYZUIJ-UHFFFAOYSA-M 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000009766 low-temperature sintering Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910000474 mercury oxide Inorganic materials 0.000 description 1
- UKWHYYKOEPRTIC-UHFFFAOYSA-N mercury(ii) oxide Chemical compound [Hg]=O UKWHYYKOEPRTIC-UHFFFAOYSA-N 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- PEUPIGGLJVUNEU-UHFFFAOYSA-N nickel silicon Chemical compound [Si].[Ni] PEUPIGGLJVUNEU-UHFFFAOYSA-N 0.000 description 1
- HBVFXTAPOLSOPB-UHFFFAOYSA-N nickel vanadium Chemical compound [V].[Ni] HBVFXTAPOLSOPB-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000013086 organic photovoltaic Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- HBEQXAKJSGXAIQ-UHFFFAOYSA-N oxopalladium Chemical compound [Pd]=O HBEQXAKJSGXAIQ-UHFFFAOYSA-N 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical group [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910003445 palladium oxide Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910052699 polonium Inorganic materials 0.000 description 1
- HZEBHPIOVYHPMT-UHFFFAOYSA-N polonium atom Chemical compound [Po] HZEBHPIOVYHPMT-UHFFFAOYSA-N 0.000 description 1
- 229920000075 poly(4-vinylpyridine) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000005381 potential energy Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000004626 scanning electron microscopy Methods 0.000 description 1
- 238000000263 scanning probe lithography Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-N sulfurothioic S-acid Chemical compound OS(O)(=O)=S DHCDFWKWKRSZHF-UHFFFAOYSA-N 0.000 description 1
- 230000036561 sun exposure Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 238000004758 underpotential deposition Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910001935 vanadium oxide Inorganic materials 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229940075420 xanthine Drugs 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035209—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures
- H01L31/035227—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions comprising a quantum structures the quantum structure being quantum wires, or nanorods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/0296—Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035272—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions characterised by at least one potential jump barrier or surface barrier
- H01L31/03529—Shape of the potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/073—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising only AIIBVI compound semiconductors, e.g. CdS/CdTe solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02603—Nanowires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0665—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body the shape of the body defining a nanostructure
- H01L29/0669—Nanowires or nanotubes
- H01L29/0673—Nanowires or nanotubes oriented parallel to a substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/543—Solar cells from Group II-VI materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本発明は、ナノテクノロジー一般に関し、より特定的に、ナノスケール構造およびこれらの構造を作製するための処理に関する。
太陽エネルギーを利用し、それを電気的エネルギーに変換する太陽電池パネルは、よく知られている。代表的な太陽電気システムは、以下のコンポーネント:太陽電池パネル、負荷コントローラ、インバータおよびしばしばバッテリを備える。光起電力(PV)モジュールと呼ばれることが多い代表的な太陽電池パネルは、ガラスカバーおよび押し出しアルミニウムケーシングからなる保護パッケージ内に環境的に密閉された1つ以上の相互接続したPVセルからなる。
以下の説明は、本発明を実施するために現在企図されている最良の形態である。この説明は、本発明の一般原理を明示する目的でなされるものであり、本明細書中で特許請求される本発明の概念を限定すると意味しない。さらに、本明細書中で記載する特定の特徴は、可能な様々な組み合わせおよび並べ替えの各々ならびにそれらのいずれかにおいて、記載する他の特徴と組み合わせて使用することができる。
Atotal=Atop+Agap
同じ計算の間に、所与のケーブル密度についての間隔の空き具合が、所与の形状に対して実行可能であるか否かを判定することが有用である。ナノケーブル22の直径(Dnanocable)が50nmであるとき、PV剛毛最小直径Dは、約220nmである。Dnanocable=150nmのとき、PV剛毛の光学的な最小の厚さは、約320nmである。剛毛20の物理的な直径は、ナノケーブル22の直径よりも100〜500nm大きいが、外殻が透明であるので、これらの数値は、光学的な直径の計算に使用されるべきである。光学的な直径は、太陽効率を計算するために使用され、物理的な直径は、処理の限界を決定するために使用される。
ρ=106−109孔/cm2=1010−1013孔/m2
である。金属酸化物の鋳型を使用するとき、密度範囲は:
ρ=1012−1015孔/m2
にシフトする。
S=ケーブルの間隔(中心点間)−剛毛の直径(半透明な材料)
光学的な間隔が決定した後に、PV剛毛の頂部の面積(Atop)ならびに剛毛間の面積(Agap)を決定する。表1は、平面状の表面積の大部分が、剛毛頂部ではなくPVセルの間隙内に存在することを示している。しかしながら、頂部の表面積の有意水準を有する構造点が存在する。
Tpen=侵入の厚さ=Stanθ
厚さまたは剛毛の高さは、最大侵入に関連する。多くの場合における光の流れに対する平均侵入は、約θ/2である。しかしながら、θが90°に近づくにつれ、セルの底面は、理論的には光で溢れ得る。しかしながら、現実には、光は、剛毛の形状の不規則さの影響を受け、わずかに剛毛を傾けることによって、光は排除され得るので、この溢れるという作用は、極わずかであるか、または実際に起こらない。
Acell=T(π)(Dρ/2)
(式中、Tは、ケーブルの高さであり、Dは、PV剛毛の光学的な直径であり、ρは、単位面積当たりの剛毛の数である)によって与えられるPVブラシが利用可能な表面積である。ほとんどの光吸収は、一度にセルの半分の面を照らす日光から生じるものであると仮定されるので、この量を2で割る。同様に散乱光からの吸収事象がかなり存在するが、大部分の光子は、直接日光から来るものである。表3では、いくつかのAcellの計算値をまとめ、高密度のセルの間隔および剛毛の高さを有するPVセル表面積が急速に増大することを示している。「セルの間隔」とは、1本の剛毛中心からその隣の剛毛の中心までを測定したものである。
Apen=光が最初に侵入した面積=Tpen(π)(Dρ)
ここで、Agap>>Atopである場合、光の減衰は、以下の式によって示される:
Apen=Tpen/T*Atotal
ApenおよびAgap(表1)から、セルに生じる光の減衰量を示す計算がなされ得る。光の減衰は、日光の吸収事象および均一な加熱に対する機会にとって重要である。どこにホットスポットが存在したとしても、変換効率が急速に低下する。ホットスポットが生じる傾向にある集中光がどこに存在したとしても、吸収事象に対する機会と光子の数との比が低下する。
いくつかの実施形態では、PV層54、56はヘテロ接合を形成してもよい。1つのアプローチでは、ヘテロ接合は、II−VI化合物を含む半導体層とIII−V化合物を含む別の半導体層との間に形成される。いくつかのアプローチにおけるIII−V化合物は、化学式XY(ここで、Xはホウ素、アルミニウム、ガリウム、インジウムおよびタリウムを含む群から選択され、Yは窒素、リン、ヒ素、アンチモンおよびビスマスを含む群から選択される)を有する材料であってもよい。いくつかのアプローチにおけるIII−V化合物は、たとえば窒化ガリウムであり得る。窒化ガリウムは、窒化ガリウムアルミニウムであり得る。第2の半導体層は、II−VI化合物またはその合金を含んでいてもよい。II−VI化合物は、化学式X′Y′(ここで、X′は亜鉛、カドミウムおよび水銀を含む群から選択され、Y′は酸素、硫黄、セレン、テルルおよびポロニウムを含む群から選択される)を有する材料であり得る。II−VI化合物は、たとえばテルル化カドミウムであり得る。
好ましくは、PV層は、上述のおよび/または以下に記載する厚さおよび平均粒径/粒径分布を有する。
Te 10ppm〜500ppm
Cd 10000ppm〜500000ppm
Cl 50ppm〜1000ppm
硫酸塩モル濃度 0.001〜1.0ミリモル硫黄濃度。
P=6.18kWh/(m2×d)(California市に対する平均値から)
PBrush=P×E×O
例えば、CdTe/CdS PVセルについてE=29(29%効率)およびO=配向性獲得(orientation gain)1.44(44%増)の場合、PBrush=2.60kW時/(m2×d)(CAにおける平均的な町における平均的な日)。
Claims (92)
- 光起電力構造であって、
各々が導電性ナノケーブルと、前記ナノケーブルの上方に光起電力(PV)層とを有する光起電力ナノ構造のアレイを備え、
前記PV層のうちの少なくとも1つの平均粒径が約100nm未満である、光起電力構造。 - 前記PV層の各々の平均粒径が約100nm未満である、請求項1に記載の光起電力構造。
- 前記PV層の各々の平均粒径が約1〜約60nmである、請求項1に記載の光起電力構造。
- 前記PV層の各々の堆積厚さが約1000nm未満である、請求項1に記載の光起電力構造。
- 前記PV層の各々の堆積厚さが約500nm未満である、請求項1に記載の光起電力構造。
- 前記光起電力ナノ構造のアレイは、ブラシの構成で配置される、請求項1に記載の光起電力構造。
- 前記ナノケーブルは細長い、請求項1に記載の光起電力構造。
- 前記ナノケーブルは、実質的に均一な外周および長手方向長さを有する、請求項1に記載の光起電力構造。
- 前記PV層は、パルスめっきの物理的特性を示す、請求項1に記載の光起電力構造。
- 前記PV層は、反転パルスめっきの物理的特性を示す、請求項1に記載の光起電力構造。
- 前記アレイと同一の基体上に形成されたパワーインバータをさらに備える、請求項1に記載の光起電力構造。
- 前記PV層のうちの少なくとも1つの平均粒径は、前記PV層のうちの前記少なくとも1つの堆積厚さによって変化する、請求項1に記載の光起電力構造。
- 前記光起電力ナノ構造のアレイに関与する光子当たり2つ以上の電子を生成する能力を特徴とする、請求項1に記載の光起電力構造。
- 前記PV層のうちの1つは、めっきされたp型CdTeである、請求項1に記載の光起電力構造。
- 前記PV層の上方に上部導電層をさらに備え、前記上部導電層は、前記上部導電層の導電性を増大させるドーパントを含む、請求項1に記載の光起電力構造。
- 前記上部導電層は、前記PV層に最も近接させて、ドーピングされていない層を含む、請求項15に記載の光起電力構造。
- 前記PV層の上方に上部導電層をさらに備え、前記上部導電層は、ドーピングされた導電性酸化物を含む、請求項1に記載の光起電力構造。
- 前記PV層の上方に上部導電層をさらに備え、前記上部導電層とそこに最も近接した前記PV層との間にパッシベーション層をさらに備える、請求項1に記載の光起電力構造。
- 前記PV層のうちの少なくとも1つは、II−VI p型またはn型材料およびIII−V p型またはn型材料からなる群から選択される材料を含む、請求項1に記載の光起電力構造。
- 前記PV層のうちの少なくとも1つは、CdTe、硫化カドミウム、ヒ化ガリウム、セレン化銅インジウムガリウムおよびアモルファスシリコンからなる群から選択される材料を含む、請求項1に記載の光起電力構造。
- 前記ナノケーブルは金属製であり、前記PV層のうちの少なくとも1つはアモルファスシリコンを含む、請求項1に記載の光起電力構造。
- 前記ナノケーブルはニッケルを含み、前記PV層のうちの少なくとも1つはアモルファスシリコンを含む、請求項1に記載の光起電力構造。
- 各々が導電性ナノケーブルと、前記ナノケーブルの上方に光起電力(PV)層とを有する光起電力ナノ構造のアレイを備え、前記ナノケーブルの端部は、過剰めっき材料によって結合される、可撓性光起電力構造。
- ナノ構造を形成する方法であって、
基体の上方にバックプレーン接点を形成するステップと、
ビアを含むマスクを前記バック接点の上方に形成するステップと、
前記ビアに沿って延びるナノケーブルのアレイを形成するステップと、
前記マスクを除去するステップと、
前記ナノケーブルの上方に光起電力(PV)層を追加するステップとを備え、
前記PV層のうちの少なくとも1つの平均粒径が約100nm未満である、方法。 - 前記ナノケーブルは細長い、請求項24に記載の方法。
- 前記PV層の各々の平均粒径が約100nm未満である、請求項24に記載の方法。
- 前記PV層の各々の平均粒径が約1〜約60nmである、請求項24に記載の方法。
- 前記PV層の各々の堆積厚さが約1000nm未満である、請求項24に記載の方法。
- 前記PV層の各々の堆積厚さが約500nm未満である、請求項24に記載の方法。
- 前記光起電力ナノ構造のアレイは、ブラシの構成で配置される、請求項24に記載の方法。
- 前記ナノケーブルは細長い、請求項24に記載の方法。
- 前記ナノケーブルは、実質的に均一な外周および長手方向長さを有する、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つは、パルスめっきによって形成される、請求項24に記載の方法。
- 前記パルスめっきのデューティサイクルは、約70%以上のオン時間を有する、請求項33に記載の方法。
- 前記パルスめっきのデューティサイクルは、約90%以上のオン時間を有する、請求項34に記載の方法。
- 前記パルスめっきのデューティサイクルは、約70%未満のオン時間を有する、請求項33に記載の方法。
- 前記パルスめっきのデューティサイクルは、約30%未満のオン時間を有する、請求項36に記載の方法。
- 前記パルスめっきのデューティサイクルは、約30%〜約70%のオン時間を有する、請求項33に記載の方法。
- 前記PV層のうちの少なくとも1つは、反転パルスめっきによって形成される、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つはめっきによって形成され、前記めっき中にめっき浴を超音波処理するステップをさらに備える、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つは、約70℃未満の浴温度でp型CdTeをめっきすることによって形成される、請求項24に記載の方法。
- 前記基体上にパワーインバータを形成するステップをさらに備える、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つの平均粒径は、前記PV層のうちの前記少なくとも1つの堆積厚さによって変化する、請求項24に記載の方法。
- 上にPV層を有する前記ナノケーブルのアレイは、前記光起電力ナノ構造のアレイに関与する光子当たり2つ以上の電子を生成することができる、請求項24に記載の方法。
- 前記ナノケーブルの上方に前記PV層を追加するステップは、p型CdTeをめっきするステップを含む、請求項24に記載の方法。
- n型PV層がp型PV層の上方に形成され、
前記n型層を上に形成する前に、前記p型層を洗浄するステップ、
前記n型層を上に形成する前に、前記p型層をエッチングするステップ、
熱拡散活性化ステップを実行するステップのうちの少なくとも1つをさらに備える、請求項24に記載の方法。 - 前記PV層のうちの少なくとも1つの粒界を不動態化するステップをさらに備える、請求項24に記載の方法。
- 前記不動態化するステップは、前記PV層のうちの前記少なくとも1つに1つ以上の塩化物を加えるステップを含む、請求項47に記載の方法。
- 前記PV層の上方に上部導電層を形成するステップをさらに備える、請求項24に記載の方法。
- 前記PV層の上方に上部導電層を形成するステップは、その導電性を増大させるために層を導電性材料でドーピングするステップを含む、請求項49に記載の方法。
- 前記上部導電層は、前記PV層に最も近接させて、ドーピングされていない層を含む、請求項50に記載の方法。
- 前記PV層の上方に上部導電層を形成し、前記上部導電層とそこに最も近接した前記PV層との間にパッシベーション層を形成するステップをさらに備える、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つは、II−VI p型またはn型材料およびIII−V p型またはn型材料からなる群から選択される材料を含む、請求項24に記載の方法。
- 前記PV層のうちの少なくとも1つは、CdTe、硫化カドミウム、ヒ化ガリウム、セレン化銅インジウムガリウムおよびアモルファスシリコンからなる群から選択される材料を含む、請求項24に記載の方法。
- 前記ナノケーブルは金属製であり、前記PV層のうちの少なくとも1つはアモルファスシリコンを含む、請求項24に記載の方法。
- 前記ナノケーブルはニッケルを含み、前記PV層のうちの少なくとも1つはアモルファスシリコンを含む、請求項24に記載の方法。
- 可撓性光起電力構造を形成する方法であって、
中にビアホールを有するマスクを作製するステップと、
前記ビアホールに導電性ナノケーブルのアレイを形成するためにめっきするステップとを備え、前記めっきは、前記ビアホールからのめっき材料の過剰充填物が前記マスク上に成長するまで行なわれ、前記方法はさらに、
前記マスクを除去するステップと、
前記ナノケーブルの上方に光起電力(PV)層を形成するステップとを備える、方法。 - 各々が導電性ナノケーブルと、前記ナノケーブルの上方に光起電力(PV)層とを有する光起電力ナノ構造のアレイを調整する方法であって、
前記アレイの観察可能な電力出力を増大させるためにその基体の平面において前記光起電力ナノ構造のアレイを回転させるステップを備える、方法。 - 前記アレイの観察可能な電力出力をさらに増大させるために光源の位置に対する前記アレイの提示角度を調整するステップをさらに備える、請求項58に記載の方法。
- 前記PV層の間にヘテロ接合が形成される、請求項1に記載の光起電力構造。
- 前記PV層の間に整流接合を形成する界面層をさらに備える、請求項1に記載の光起電力構造。
- 基体から延びるナノケーブルのアレイと、
前記ナノケーブル上に位置決めされた、III−V化合物半導体を含む第1の半導体層と、
前記ナノケーブル上に位置決めされ、前記第1の半導体層とともに整流接合を形成する、II−VI化合物半導体を含む第2の半導体層とを備える、デバイス。 - 前記III−V化合物半導体とII−VI化合物半導体との間の前記整流接合を向上させる界面層をさらに備える、請求項62に記載のデバイス。
- 前記II−VI化合物はテルル化カドミウムである、請求項62に記載のデバイス。
- 前記III−V化合物は窒化ガリウムである、請求項62に記載のデバイス。
- 前記II−VI化合物はテルル化カドミウムの合金である、請求項62に記載のデバイス。
- 前記II−VI化合物はテルル化カドミウムのドーピングされた組成物である、請求項62に記載のデバイス。
- 前記III−V化合物は窒化ガリウムの合金である、請求項62に記載のデバイス。
- 前記III−V化合物は窒化ガリウムのドーピングされた組成物である、請求項62に記載のデバイス。
- 前記窒化ガリウムは窒化ガリウムアルミニウムである、請求項69に記載のデバイス。
- 前記界面層は酸化物を含む、請求項62に記載のデバイス。
- 前記酸化物はドーピングされた酸化スズである、請求項71に記載のデバイス。
- 前記ドーピングされた酸化スズは、亜鉛がドーピングされた酸化スズである、請求項72に記載のデバイス。
- 前記ドーピングされた酸化スズは、カドミウムがドーピングされた酸化スズである、請求項72に記載のデバイス。
- 前記酸化物はドーピングされた酸化亜鉛である、請求項71に記載のデバイス。
- 前記酸化物は酸化カドミウム亜鉛である、請求項71に記載のデバイス。
- 光起電力デバイスを製造する方法であって、
III−V化合物半導体を含む第1の半導体層をナノケーブルのアレイの上方に堆積するステップと、
II−VI化合物半導体を含み、前記第1の半導体層とともに整流接合を形成する第2の半導体層を前記ナノケーブルのアレイの上方に堆積するステップとを備える、方法。 - 前記III−V化合物半導体とII−VI化合物半導体との間の前記整流接合を向上させるために、前記第1の半導体層と前記第2の半導体層との間に界面層を堆積するステップをさらに備える、請求項77に記載の方法。
- 前記PV層の空乏領域は、前記PV層の厚さ全体にわたって延びている、請求項1に記載の光起電力構造。
- 前記ナノ構造は、底部直径または幅よりも小さな頂部直径または幅を有する、請求項1に記載の光起電力構造。
- 前記第1および第2の半導体層の空乏領域は、前記半導体層の厚さ全体にわたって延びている、請求項62に記載のデバイス。
- 前記ナノケーブルおよび半導体層を備えるナノ構造は、底部直径または幅よりも小さな頂部直径または幅を有する、請求項62に記載のデバイス。
- 前記導電性ナノケーブルとそこに最も近接した前記PV層との間に界面を形成するバック接点層をさらに備え、前記バック接点層は、フェルミ準位および前記界面のバンドベンディングを調整して、前記光起電力構造のVocを向上させ、前記導電性ナノケーブルへの前記PV層の接着を向上させることを手助けする金属膜である、請求項1に記載の光起電力構造。
- 前記導電性ナノケーブルとそこに最も近接した前記PV層との間に界面を形成するために前記ナノケーブルの上方にバック接点層を形成するステップをさらに備え、前記バック接点層は、フェルミ準位および前記界面のバンドベンディングを調整して、前記光起電力構造のVocを向上させ、前記導電性ナノケーブルへの前記PV層の接着を向上させることを手助けする金属膜である、請求項24に記載の方法。
- 前記光起電力構造は、200mmのシリコンウェハ、300mmのシリコンウェハおよび450mmのシリコンウェハからなる群から選択される基体上に構築される、請求項1に記載の光起電力構造。
- 前記光起電力構造は、フラットパネルディスプレイガラスの基体上に構築される、請求項1に記載の光起電力構造。
- 前記光起電力構造は、可撓性の基体上に構築される、請求項1に記載の光起電力構造。
- 前記光起電力構造は、ガラス基体上に構築される、請求項1に記載の光起電力構造。
- 前記光起電力構造は、200mmのシリコンウェハ、300mmのシリコンウェハおよび450mmのシリコンウェハからなる群から選択される基体上に構築される、請求項24に記載の方法。
- 前記光起電力構造は、フラットパネルディスプレイガラスの基体上に構築される、請求項24に記載の方法。
- 前記光起電力構造は、可撓性の基体上に構築される、請求項24に記載の方法。
- 前記光起電力構造は、ガラス基体上に構築される、請求項24に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US31022710P | 2010-03-03 | 2010-03-03 | |
US61/310,227 | 2010-03-03 | ||
US13/039,208 | 2011-03-02 | ||
US13/039,208 US9202954B2 (en) | 2010-03-03 | 2011-03-02 | Nanostructure and photovoltaic cell implementing same |
PCT/US2011/027066 WO2011109644A1 (en) | 2010-03-03 | 2011-03-03 | Nanostructure and Photovoltaic Cell Implementing Same |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013521662A true JP2013521662A (ja) | 2013-06-10 |
JP2013521662A5 JP2013521662A5 (ja) | 2014-04-17 |
Family
ID=44530252
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012556244A Pending JP2013521662A (ja) | 2010-03-03 | 2011-03-03 | ナノ構造およびそれを実施する光起電力セル |
Country Status (6)
Country | Link |
---|---|
US (1) | US9202954B2 (ja) |
EP (2) | EP2887404A1 (ja) |
JP (1) | JP2013521662A (ja) |
KR (1) | KR20130084218A (ja) |
SG (2) | SG182519A1 (ja) |
WO (1) | WO2011109644A1 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2256762A1 (en) * | 2009-05-27 | 2010-12-01 | Honeywell International Inc. | Improved hole transfer polymer solar cell |
US20110108102A1 (en) * | 2009-11-06 | 2011-05-12 | Honeywell International Inc. | Solar cell with enhanced efficiency |
US20120031490A1 (en) * | 2010-08-03 | 2012-02-09 | Honeywell International Inc. | Quantum dot solar cells and methods for manufacturing such solar cells |
KR101709959B1 (ko) * | 2010-11-17 | 2017-02-27 | 삼성전자주식회사 | 범프 구조물, 이를 갖는 반도체 패키지 및 반도체 패키지의 제조 방법 |
WO2012177804A2 (en) | 2011-06-20 | 2012-12-27 | Alliance For Sustainable Energy, Llc | IMPROVED CdTe DEVICES AND METHOD OF MANUFACTURING SAME |
TWI472048B (zh) * | 2011-07-07 | 2015-02-01 | Univ Nat Chiao Tung | 光感測元件及其製備方法 |
US8852989B2 (en) | 2011-10-27 | 2014-10-07 | Intermolecular, Inc. | Back-contact for thin film solar cells optimized for light trapping for ultrathin absorbers |
US20160172514A1 (en) * | 2011-11-04 | 2016-06-16 | Q1 Nanosystems | Photovoltaic Microstructure and Photovoltaic Device Employing Nanowires with Single-Side Conductive Strips |
JP2014049736A (ja) * | 2012-09-04 | 2014-03-17 | Asahi Kasei Corp | 太陽電池及び太陽電池システム |
US9328427B2 (en) * | 2012-09-28 | 2016-05-03 | Sunpower Corporation | Edgeless pulse plating and metal cleaning methods for solar cells |
US9150434B2 (en) * | 2012-11-09 | 2015-10-06 | International Business Machines Corporation | Electricity-less water disinfection |
US9227855B2 (en) | 2012-11-09 | 2016-01-05 | International Business Machines Corporation | Large-scale electricity-less disinfection of fluent water |
CN103866360B (zh) * | 2012-12-10 | 2016-10-05 | 中物院成都科学技术发展中心 | 一种复杂波形脉冲离子液共镀铜铟镓硒预制层的方法 |
US9082911B2 (en) | 2013-01-28 | 2015-07-14 | Q1 Nanosystems Corporation | Three-dimensional metamaterial device with photovoltaic bristles |
WO2014121187A2 (en) * | 2013-02-01 | 2014-08-07 | First Solar, Inc. | Photovoltaic device including a p-n junction and method of manufacturing |
US20160071990A1 (en) * | 2013-03-14 | 2016-03-10 | Q1 Nanosystems Corporation | Three-Dimensional Photovoltaic Devices Including Cavity-containing Cores and Methods of Manufacture |
US9954126B2 (en) | 2013-03-14 | 2018-04-24 | Q1 Nanosystems Corporation | Three-dimensional photovoltaic devices including cavity-containing cores and methods of manufacture |
US20140264998A1 (en) * | 2013-03-14 | 2014-09-18 | Q1 Nanosystems Corporation | Methods for manufacturing three-dimensional metamaterial devices with photovoltaic bristles |
US11876140B2 (en) | 2013-05-02 | 2024-01-16 | First Solar, Inc. | Photovoltaic devices and method of making |
US20150101761A1 (en) * | 2013-05-12 | 2015-04-16 | Solexel, Inc. | Solar photovoltaic blinds and curtains for residential and commercial buildings |
KR101517123B1 (ko) * | 2013-05-27 | 2015-05-04 | 엘에스엠트론 주식회사 | 화합물 박막 태양전지 |
US10062800B2 (en) | 2013-06-07 | 2018-08-28 | First Solar, Inc. | Photovoltaic devices and method of making |
US10840400B2 (en) * | 2013-08-29 | 2020-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photovoltaic device with back reflector |
FR3011381B1 (fr) * | 2013-09-30 | 2017-12-08 | Aledia | Dispositif optoelectronique a diodes electroluminescentes |
US10529883B2 (en) | 2014-11-03 | 2020-01-07 | First Solar, Inc. | Photovoltaic devices and method of manufacturing |
KR102375889B1 (ko) | 2014-12-19 | 2022-03-16 | 삼성전자주식회사 | 에너지 발생 장치 및 그 제조방법 |
US10665451B2 (en) * | 2015-10-20 | 2020-05-26 | King Abdullah University Of Science And Technology | Nanowires-based light emitters on thermally and electrically conductive substrates and of making same |
KR101904607B1 (ko) * | 2016-10-17 | 2018-10-04 | 울산과학기술원 | 3차원 접합 실리콘 태양전지 및 이의 제조방법 |
CN106898663A (zh) * | 2017-02-23 | 2017-06-27 | 京东方科技集团股份有限公司 | 一种太阳能电池、太阳能电池的制作方法及用电设备 |
US11233332B2 (en) * | 2017-05-02 | 2022-01-25 | Electronics And Telecommunications Research Institute | Light absorber |
CN107009201B (zh) * | 2017-05-04 | 2023-07-25 | 玉环卡布里尔刀具科技有限公司 | 一种硬质超硬材料精密刀具钝化机 |
CN110190022B (zh) * | 2019-05-23 | 2021-08-31 | 上海集成电路研发中心有限公司 | 一种空气隙的形成方法 |
CN110975890B (zh) * | 2019-12-24 | 2021-11-02 | 福州大学 | 一种阳离子置换法制备Mo掺杂CdS光催化剂的方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080178924A1 (en) * | 2007-01-30 | 2008-07-31 | Solasta, Inc. | Photovoltaic cell and method of making thereof |
US20080202581A1 (en) * | 2007-02-12 | 2008-08-28 | Solasta, Inc. | Photovoltaic cell with reduced hot-carrier cooling |
US20090007956A1 (en) * | 2007-07-03 | 2009-01-08 | Solasta, Inc. | Distributed coax photovoltaic device |
JP2009507397A (ja) * | 2005-08-22 | 2009-02-19 | キュー・ワン・ナノシステムズ・インコーポレイテッド | ナノ構造およびそれを実施する光起電力セル |
Family Cites Families (85)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3150999A (en) * | 1961-02-17 | 1964-09-29 | Transitron Electronic Corp | Radiant energy transducer |
US3976508A (en) * | 1974-11-01 | 1976-08-24 | Mobil Tyco Solar Energy Corporation | Tubular solar cell devices |
DE2639841C3 (de) * | 1976-09-03 | 1980-10-23 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Solarzelle und Verfahren zu ihrer Herstellung |
US4234352A (en) * | 1978-07-26 | 1980-11-18 | Electric Power Research Institute, Inc. | Thermophotovoltaic converter and cell for use therein |
US4454372A (en) * | 1981-04-17 | 1984-06-12 | Electric Power Research Institute, Inc. | Photovoltaic battery |
US4816082A (en) * | 1987-08-19 | 1989-03-28 | Energy Conversion Devices, Inc. | Thin film solar cell including a spatially modulated intrinsic layer |
JPH03151672A (ja) | 1989-11-08 | 1991-06-27 | Sharp Corp | 非晶質シリコン太陽電池 |
US5238519A (en) * | 1990-10-17 | 1993-08-24 | United Solar Systems Corporation | Solar cell lamination apparatus |
JPH04296060A (ja) | 1991-03-26 | 1992-10-20 | Hitachi Ltd | 太陽電池 |
US5178685A (en) * | 1991-06-11 | 1993-01-12 | Mobil Solar Energy Corporation | Method for forming solar cell contacts and interconnecting solar cells |
JP3269668B2 (ja) | 1992-09-18 | 2002-03-25 | 株式会社日立製作所 | 太陽電池 |
JP2755281B2 (ja) | 1992-12-28 | 1998-05-20 | 富士電機株式会社 | 薄膜太陽電池およびその製造方法 |
US5371470A (en) * | 1993-03-04 | 1994-12-06 | Photometrics, Ltd. | Transverse filter circuit |
DE69433696T2 (de) * | 1993-11-02 | 2004-08-12 | Matsushita Electric Industrial Co., Ltd., Kadoma | Halbleiterbauelement mit einem Aggregat von Mikro-Nadeln aus Halbleitermaterial |
US5733381A (en) * | 1993-12-22 | 1998-03-31 | Fuji Electric Co., Ltd. | Thin-film solar cell array and method of manufacturing same |
US5476553A (en) * | 1994-02-18 | 1995-12-19 | Ase Americas, Inc. | Solar cell modules and method of making same |
CN1082254C (zh) * | 1995-08-22 | 2002-04-03 | 松下电器产业株式会社 | 硅结构体及其制造方法和装置及使用硅结构体的太阳电池 |
JP3876021B2 (ja) | 1995-08-22 | 2007-01-31 | 松下電器産業株式会社 | シリコン構造体、その製造方法及びその製造装置、並びにシリコン構造体を用いた太陽電池 |
US6147296A (en) * | 1995-12-06 | 2000-11-14 | University Of Houston | Multi-quantum well tandem solar cell |
WO1997021252A1 (fr) * | 1995-12-07 | 1997-06-12 | Japan Energy Corporation | Procede de fabrication d'un dispositif photoelectrique de conversion |
US5994164A (en) * | 1997-03-18 | 1999-11-30 | The Penn State Research Foundation | Nanostructure tailoring of material properties using controlled crystallization |
DE19813188A1 (de) * | 1998-03-25 | 1999-10-07 | Siemens Solar Gmbh | Verfahren zur einseitigen Dotierung eines Halbleiterkörpers |
US6468828B1 (en) * | 1998-07-14 | 2002-10-22 | Sky Solar L.L.C. | Method of manufacturing lightweight, high efficiency photovoltaic module |
DE19854269B4 (de) * | 1998-11-25 | 2004-07-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Dünnschichtsolarzellenanordnung sowie Verfahren zur Herstellung derselben |
US6649824B1 (en) * | 1999-09-22 | 2003-11-18 | Canon Kabushiki Kaisha | Photoelectric conversion device and method of production thereof |
US6340822B1 (en) * | 1999-10-05 | 2002-01-22 | Agere Systems Guardian Corp. | Article comprising vertically nano-interconnected circuit devices and method for making the same |
US6337283B1 (en) * | 1999-12-30 | 2002-01-08 | Sunpower Corporation | Method of fabricating a silicon solar cell |
US6423568B1 (en) * | 1999-12-30 | 2002-07-23 | Sunpower Corporation | Method of fabricating a silicon solar cell |
US6372538B1 (en) * | 2000-03-16 | 2002-04-16 | University Of Delaware | Fabrication of thin-film, flexible photovoltaic module |
US6858158B2 (en) * | 2002-01-25 | 2005-02-22 | Konarka Technologies, Inc. | Low temperature interconnection of nanoparticles |
US6913713B2 (en) * | 2002-01-25 | 2005-07-05 | Konarka Technologies, Inc. | Photovoltaic fibers |
US6900382B2 (en) * | 2002-01-25 | 2005-05-31 | Konarka Technologies, Inc. | Gel electrolytes for dye sensitized solar cells |
US6620996B2 (en) * | 2000-05-29 | 2003-09-16 | Kyocera Corporation | Photoelectric conversion device |
EP1320892A2 (en) * | 2000-07-06 | 2003-06-25 | BP Corporation North America Inc. | Partially transparent photovoltaic modules |
CN101887935B (zh) * | 2000-08-22 | 2013-09-11 | 哈佛学院董事会 | 掺杂的拉长半导体,其生长,包含这类半导体的器件及其制造 |
US6548751B2 (en) * | 2000-12-12 | 2003-04-15 | Solarflex Technologies, Inc. | Thin film flexible solar cell |
KR100401130B1 (ko) * | 2001-03-28 | 2003-10-10 | 한국전자통신연구원 | 수직형 채널을 가지는 초미세 mos 트랜지스터 제조방법 |
EP2273552A3 (en) * | 2001-03-30 | 2013-04-10 | The Regents of the University of California | Methods of fabricating nanstructures and nanowires and devices fabricated therefrom |
US20030005957A1 (en) * | 2001-06-22 | 2003-01-09 | Kunihide Tanaka | Solar energy converter using optical concentration through a liquid |
US6709929B2 (en) * | 2001-06-25 | 2004-03-23 | North Carolina State University | Methods of forming nano-scale electronic and optoelectronic devices using non-photolithographically defined nano-channel templates |
JP2005514795A (ja) * | 2002-01-02 | 2005-05-19 | レベオ, インコーポレイティッド | 光発電セル及び光発電セルの製造方法 |
US6872645B2 (en) * | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
US20040018525A1 (en) * | 2002-05-21 | 2004-01-29 | Bayer Aktiengesellschaft | Methods and compositions for the prediction, diagnosis, prognosis, prevention and treatment of malignant neoplasma |
US6660930B1 (en) * | 2002-06-12 | 2003-12-09 | Rwe Schott Solar, Inc. | Solar cell modules with improved backskin |
US7253017B1 (en) * | 2002-06-22 | 2007-08-07 | Nanosolar, Inc. | Molding technique for fabrication of optoelectronic devices |
US6946597B2 (en) | 2002-06-22 | 2005-09-20 | Nanosular, Inc. | Photovoltaic devices fabricated by growth from porous template |
US6852920B2 (en) * | 2002-06-22 | 2005-02-08 | Nanosolar, Inc. | Nano-architected/assembled solar electricity cell |
US7335908B2 (en) * | 2002-07-08 | 2008-02-26 | Qunano Ab | Nanostructures and methods for manufacturing the same |
US20050126628A1 (en) * | 2002-09-05 | 2005-06-16 | Nanosys, Inc. | Nanostructure and nanocomposite based compositions and photovoltaic devices |
AU2003298998A1 (en) * | 2002-09-05 | 2004-04-08 | Nanosys, Inc. | Oriented nanostructures and methods of preparing |
EP1540741B1 (en) * | 2002-09-05 | 2014-10-29 | Nanosys, Inc. | Nanostructure and nanocomposite based compositions and photovoltaic devices |
US7135728B2 (en) * | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
US6974976B2 (en) * | 2002-09-30 | 2005-12-13 | Miasole | Thin-film solar cells |
US7067867B2 (en) * | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
US7051945B2 (en) * | 2002-09-30 | 2006-05-30 | Nanosys, Inc | Applications of nano-enabled large area macroelectronic substrates incorporating nanowires and nanowire composites |
US6872450B2 (en) * | 2002-10-23 | 2005-03-29 | Evident Technologies | Water-stable photoluminescent semiconductor nanocrystal complexes and method of making same |
US20040123896A1 (en) * | 2002-12-31 | 2004-07-01 | General Electric Company | Selective heating and sintering of components of photovoltaic cells with microwaves |
JP2004228333A (ja) * | 2003-01-23 | 2004-08-12 | Canon Inc | 光起電力セル、及びその製造方法 |
US7605327B2 (en) * | 2003-05-21 | 2009-10-20 | Nanosolar, Inc. | Photovoltaic devices fabricated from nanostructured template |
US7462774B2 (en) * | 2003-05-21 | 2008-12-09 | Nanosolar, Inc. | Photovoltaic devices fabricated from insulating nanostructured template |
US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
US20050189015A1 (en) * | 2003-10-30 | 2005-09-01 | Ajeet Rohatgi | Silicon solar cells and methods of fabrication |
KR100552707B1 (ko) * | 2004-04-07 | 2006-02-20 | 삼성전자주식회사 | 나노와이어 발광소자 및 그 제조방법 |
WO2005101510A2 (en) * | 2004-04-16 | 2005-10-27 | The University Of Toledo | Light-assisted electrochemical shunt passivation for photovoltaic devices |
US7622367B1 (en) * | 2004-06-04 | 2009-11-24 | The Board Of Trustees Of The University Of Illinois | Methods and devices for fabricating and assembling printable semiconductor elements |
US7692179B2 (en) * | 2004-07-09 | 2010-04-06 | Hewlett-Packard Development Company, L.P. | Nanowire device with (111) vertical sidewalls and method of fabrication |
US20060024438A1 (en) * | 2004-07-27 | 2006-02-02 | The Regents Of The University Of California, A California Corporation | Radially layered nanocables and method of fabrication |
US20070240757A1 (en) * | 2004-10-15 | 2007-10-18 | The Trustees Of Boston College | Solar cells using arrays of optical rectennas |
WO2007040594A2 (en) | 2005-03-01 | 2007-04-12 | Georgia Tech Research Corporation | Three dimensional multi-junction photovoltaic device |
US20060207647A1 (en) | 2005-03-16 | 2006-09-21 | General Electric Company | High efficiency inorganic nanorod-enhanced photovoltaic devices |
US7686885B2 (en) * | 2005-06-01 | 2010-03-30 | General Electric Company | Patterned nanorod arrays and methods of making same |
EP1750310A3 (en) * | 2005-08-03 | 2009-07-15 | Samsung Electro-Mechanics Co., Ltd. | Omni-directional reflector and light emitting diode adopting the same |
US7871670B2 (en) * | 2005-08-10 | 2011-01-18 | 3M Innovative Properties Company | Microfabrication using replicated patterned topography and self-assembled monolayers |
US7589880B2 (en) * | 2005-08-24 | 2009-09-15 | The Trustees Of Boston College | Apparatus and methods for manipulating light using nanoscale cometal structures |
WO2007086903A2 (en) * | 2005-08-24 | 2007-08-02 | The Trustees Of Boston College | Apparatus and methods for solar energy conversion using nanocoax structures |
EP1917557A4 (en) * | 2005-08-24 | 2015-07-22 | Trustees Boston College | APPARATUS AND METHODS FOR SOLAR ENERGY CONVERSION IMPLEMENTING COMPOSITE METAL STRUCTURES OF NANOMETRIC SCALE |
US7649665B2 (en) * | 2005-08-24 | 2010-01-19 | The Trustees Of Boston College | Apparatus and methods for optical switching using nanoscale optics |
US7635600B2 (en) * | 2005-11-16 | 2009-12-22 | Sharp Laboratories Of America, Inc. | Photovoltaic structure with a conductive nanowire array electrode |
KR101533455B1 (ko) * | 2006-04-06 | 2015-07-03 | 삼성전자주식회사 | 나노와이어 복합체 및 그의 제조방법 |
US9508890B2 (en) * | 2007-04-09 | 2016-11-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photovoltaics on silicon |
WO2008150769A2 (en) * | 2007-05-31 | 2008-12-11 | Thinsilicon Corporation | Photovoltaic device and method of manufacturing photovoltaic devices |
MX2010003227A (es) * | 2007-09-25 | 2010-04-07 | First Solar Inc | Dispositivos fotovoltaicos que incluyen una capa interfacial. |
MY165986A (en) * | 2007-09-25 | 2018-05-21 | First Solar Inc | Photovoltaic devices including heterojunctions |
US8759671B2 (en) * | 2007-09-28 | 2014-06-24 | Stion Corporation | Thin film metal oxide bearing semiconductor material for single junction solar cell devices |
US20100319759A1 (en) * | 2009-06-22 | 2010-12-23 | John Fisher | Nanostructure and methods of making the same |
-
2011
- 2011-03-02 US US13/039,208 patent/US9202954B2/en not_active Expired - Fee Related
- 2011-03-03 SG SG2012051934A patent/SG182519A1/en unknown
- 2011-03-03 EP EP15152034.3A patent/EP2887404A1/en not_active Withdrawn
- 2011-03-03 JP JP2012556244A patent/JP2013521662A/ja active Pending
- 2011-03-03 SG SG10201501551WA patent/SG10201501551WA/en unknown
- 2011-03-03 KR KR1020127026038A patent/KR20130084218A/ko not_active Application Discontinuation
- 2011-03-03 EP EP11751375.4A patent/EP2543078A4/en not_active Withdrawn
- 2011-03-03 WO PCT/US2011/027066 patent/WO2011109644A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009507397A (ja) * | 2005-08-22 | 2009-02-19 | キュー・ワン・ナノシステムズ・インコーポレイテッド | ナノ構造およびそれを実施する光起電力セル |
US20080178924A1 (en) * | 2007-01-30 | 2008-07-31 | Solasta, Inc. | Photovoltaic cell and method of making thereof |
US20080202581A1 (en) * | 2007-02-12 | 2008-08-28 | Solasta, Inc. | Photovoltaic cell with reduced hot-carrier cooling |
US20090007956A1 (en) * | 2007-07-03 | 2009-01-08 | Solasta, Inc. | Distributed coax photovoltaic device |
Also Published As
Publication number | Publication date |
---|---|
SG10201501551WA (en) | 2015-04-29 |
EP2887404A1 (en) | 2015-06-24 |
KR20130084218A (ko) | 2013-07-24 |
EP2543078A1 (en) | 2013-01-09 |
US20110214709A1 (en) | 2011-09-08 |
US9202954B2 (en) | 2015-12-01 |
EP2543078A4 (en) | 2014-08-13 |
WO2011109644A1 (en) | 2011-09-09 |
SG182519A1 (en) | 2012-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9202954B2 (en) | Nanostructure and photovoltaic cell implementing same | |
US8877541B2 (en) | Nanostructure and photovoltaic cell implementing same | |
US20100319759A1 (en) | Nanostructure and methods of making the same | |
US20090050204A1 (en) | Photovoltaic device using nanostructured material | |
JP2011511464A (ja) | 薄膜光起電力デバイスおよび関連製造方法 | |
JP5656330B2 (ja) | 光電変換装置の作製方法 | |
US9761752B2 (en) | Solar cell, solar cell module, method for manufacturing solar cell, and method for manufacturing solar cell module | |
JP2012023347A (ja) | 光電変換装置及びその作製方法 | |
KR101036165B1 (ko) | 칼코지나이드계 태양전지의 제조방법 | |
US20120199188A1 (en) | Metal contact formation and window etch stop for photovoltaic devices | |
KR20130030122A (ko) | 태양전지 및 이의 제조방법 | |
Srivastava et al. | Nanostructured black silicon for efficient thin silicon solar cells: potential and challenges | |
TWI405347B (zh) | Cigs太陽能電池 | |
Scheul | Metal-assisted chemically etched black silicon: morphology and light interaction | |
KR102046255B1 (ko) | 나노 텍스쳐링 구조를 갖는 태양전지의 제조방법 | |
Alkhatab | Material studies for flexible 3rd generation solar cells | |
Alkhatab | Docteur en Électronique, microélectronique, nanoélectronique et micro-ondes | |
KR20240087799A (ko) | 실리콘 입자를 사용하는 광전지 디바이스를 위한 방법 및 시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140228 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140228 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140716 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140805 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141104 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150507 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20151020 |