JP2013516656A5 - - Google Patents

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Publication number
JP2013516656A5
JP2013516656A5 JP2012548053A JP2012548053A JP2013516656A5 JP 2013516656 A5 JP2013516656 A5 JP 2013516656A5 JP 2012548053 A JP2012548053 A JP 2012548053A JP 2012548053 A JP2012548053 A JP 2012548053A JP 2013516656 A5 JP2013516656 A5 JP 2013516656A5
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JP
Japan
Prior art keywords
circuit board
flexible circuit
camera module
image capture
module according
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JP2012548053A
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English (en)
Japanese (ja)
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JP2013516656A (ja
JP5934109B2 (ja
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Priority claimed from PCT/US2011/000044 external-priority patent/WO2011084900A1/en
Publication of JP2013516656A publication Critical patent/JP2013516656A/ja
Publication of JP2013516656A5 publication Critical patent/JP2013516656A5/ja
Application granted granted Critical
Publication of JP5934109B2 publication Critical patent/JP5934109B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012548053A 2010-01-11 2011-01-11 成形テープフリップチップ画像装置実装を備えたカメラモジュールおよび製造方法 Expired - Fee Related JP5934109B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29384210P 2010-01-11 2010-01-11
US61/293,842 2010-01-11
PCT/US2011/000044 WO2011084900A1 (en) 2010-01-11 2011-01-11 Camera module with molded tape flip chip imager mount and method of manufacture

Publications (3)

Publication Number Publication Date
JP2013516656A JP2013516656A (ja) 2013-05-13
JP2013516656A5 true JP2013516656A5 (cg-RX-API-DMAC7.html) 2013-12-05
JP5934109B2 JP5934109B2 (ja) 2016-06-15

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Family Applications (1)

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JP2012548053A Expired - Fee Related JP5934109B2 (ja) 2010-01-11 2011-01-11 成形テープフリップチップ画像装置実装を備えたカメラモジュールおよび製造方法

Country Status (5)

Country Link
US (1) US8430579B2 (cg-RX-API-DMAC7.html)
EP (1) EP2524264A4 (cg-RX-API-DMAC7.html)
JP (1) JP5934109B2 (cg-RX-API-DMAC7.html)
CN (1) CN102782574B (cg-RX-API-DMAC7.html)
WO (1) WO2011084900A1 (cg-RX-API-DMAC7.html)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825985B2 (en) * 2007-07-19 2010-11-02 Flextronics Ap, Llc Camera module back-focal length adjustment method and ultra compact components packaging
JP5830684B2 (ja) * 2011-01-18 2015-12-09 パナソニックＩｐマネジメント株式会社 カメラ本体
WO2012161802A2 (en) * 2011-02-24 2012-11-29 Flextronics Ap, Llc Autofocus camera module packaging with circuitry-integrated actuator system
US9178093B2 (en) 2011-07-06 2015-11-03 Flextronics Ap, Llc Solar cell module on molded lead-frame and method of manufacture
US20130128106A1 (en) * 2011-11-23 2013-05-23 Flextronics Ap, Llc Camera module housing having molded tape substrate with folded leads
US9826641B2 (en) 2012-05-31 2017-11-21 Kyocera Corporation Electronic device mounting board and electronic apparatus
TWI547161B (zh) * 2012-08-16 2016-08-21 鴻海精密工業股份有限公司 影像感測器模組及取像模組
TW201410007A (zh) * 2012-08-16 2014-03-01 Hon Hai Prec Ind Co Ltd 影像感測器模組及取像模組
TWI558196B (zh) * 2012-08-16 2016-11-11 鴻海精密工業股份有限公司 影像感測器模組及取像模組
US9060111B2 (en) * 2012-09-06 2015-06-16 Apple Inc. Electronic device with compact camera module
TW201426081A (zh) * 2012-12-28 2014-07-01 Hon Hai Prec Ind Co Ltd 影像感測器模組及取像模組
TWI650016B (zh) * 2013-08-22 2019-02-01 新力股份有限公司 成像裝置、製造方法及電子設備
US9167161B1 (en) 2013-08-30 2015-10-20 Amazon Technologies, Inc. Camera module package with a folded substrate and laterally positioned components
US9241097B1 (en) * 2013-09-27 2016-01-19 Amazon Technologies, Inc. Camera module including image sensor die in molded cavity substrate
CN104319264A (zh) * 2014-10-14 2015-01-28 江西盛泰光学有限公司 一种玻璃上芯片封装摄像头模组
KR102276325B1 (ko) 2015-01-13 2021-07-13 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
CN104796588B (zh) * 2015-03-10 2018-11-27 南昌欧菲光电技术有限公司 摄像头模组
US9848111B1 (en) 2015-03-17 2017-12-19 Amazon Technologies, Inc. Imager module with molded packaging
US9681032B1 (en) 2015-03-17 2017-06-13 Amazon Technologies, Inc. Imager module with molded packaging
EP3355113B1 (en) 2015-09-24 2020-08-12 LG Innotek Co., Ltd. Camera module
KR101701060B1 (ko) * 2015-11-03 2017-01-31 삼성전기주식회사 카메라 모듈
KR102116623B1 (ko) * 2015-11-13 2020-05-28 닝보 써니 오포테크 코., 엘티디. 비디오 카메라 모듈 및 그의 전기적 지지체와 조립 방법
EP3419275A4 (en) 2016-02-18 2019-12-18 Ningbo Sunny Opotech Co., Ltd. CAMERA MODULE BASED ON INTEGRAL PACKING METHOD, INTEGRAL BASE COMPONENT THEREOF AND PRODUCTION METHOD THEREFOR
KR102320911B1 (ko) * 2016-02-18 2021-11-02 닝보 써니 오포테크 코., 엘티디. 어레이 이미징 모듈 및 성형된 감광성 어셈블리, 회로 보드 어셈블리 및 전자 장치용 그 제조 방법
US9781324B2 (en) * 2016-02-18 2017-10-03 Ningbo Sunny Opotech Co., Ltd. Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device
CN109547680A (zh) * 2016-02-18 2019-03-29 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组及其模塑线路板组件及制造方法
CN105721749B (zh) * 2016-02-24 2020-07-24 宁波舜宇光电信息有限公司 摄像模组及其电气支架和线路板组件及制造方法
EP3429181B1 (en) * 2016-03-12 2024-10-16 Ningbo Sunny Opotech Co., Ltd. Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
US10194064B2 (en) * 2016-04-21 2019-01-29 Ningbo Sunny Opotech Co., Ltd. Array camera module based on integral packaging technology
JP6952052B2 (ja) 2016-04-21 2021-10-20 ニンボー サニー オプテック カンパニー，リミテッドＮｉｎｇｂｏ Ｓｕｎｎｙ Ｏｐｏｔｅｃｈ Ｃｏ．，Ｌｔｄ． 統合パッケージング技術に基づいたカメラモジュールおよびアレイカメラモジュール
CN110708454B (zh) * 2016-04-21 2021-10-08 宁波舜宇光电信息有限公司 基于模塑工艺的摄像模组
CN107466159B (zh) * 2016-06-06 2022-07-19 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
CN107466160B (zh) * 2016-06-06 2022-04-29 宁波舜宇光电信息有限公司 摄像模组的模塑电路板的制造设备及其制造方法
US10925160B1 (en) 2016-06-28 2021-02-16 Amazon Technologies, Inc. Electronic device with a display assembly and silicon circuit board substrate
CN206136071U (zh) * 2016-07-03 2017-04-26 宁波舜宇光电信息有限公司 感光组件和摄像模组
KR20190020096A (ko) * 2016-07-03 2019-02-27 닝보 써니 오포테크 코., 엘티디. 감광성 부품과 카메라 모듈 및 그 제조방법
US10321028B2 (en) * 2016-07-03 2019-06-11 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly and camera module and manufacturing method thereof
CN114845014B (zh) * 2016-07-03 2024-12-31 宁波舜宇光电信息有限公司 感光组件和摄像模组及其制造方法
US10659664B2 (en) * 2016-08-01 2020-05-19 Ningbo Sunny Opotech Co., Ltd. Camera module and molded circuit board assembly and manufacturing method thereof
KR102352901B1 (ko) * 2016-08-01 2022-01-19 닝보 써니 오포테크 코., 엘티디. 촬영 모듈과 그 몰딩 회로기판 컴포넌트 및 몰딩 감광 컴포넌트와 제조방법
US10602039B2 (en) 2016-09-19 2020-03-24 Microsoft Technology Licensing, Llc Ultra-compact image sensor assembly for thin profile devices
CN207010790U (zh) * 2017-04-17 2018-02-13 三赢科技（深圳）有限公司 成像模组
TWI635348B (zh) * 2017-05-12 2018-09-11 海華科技股份有限公司 可攜式電子裝置及其影像擷取模組與承載組件
WO2018210337A1 (zh) 2017-05-18 2018-11-22 宁波舜宇光电信息有限公司 摄像模组及其模塑电路板组件和阵列摄像模组以及电子设备
CN108323207B (zh) 2018-02-06 2021-02-26 深圳市汇顶科技股份有限公司 屏下生物特征识别装置、生物特征识别组件和终端设备
CN110648980A (zh) * 2018-06-26 2020-01-03 三赢科技（深圳）有限公司 芯片封装结构及相机装置
US12088898B2 (en) * 2018-07-26 2024-09-10 Ningbo Sunny Opotech Co., Ltd. Molding assembly, camera module, molding assembly jointed board and manufacturing method
CN111767890B (zh) * 2018-08-02 2021-07-23 深圳市汇顶科技股份有限公司 屏下生物特征识别装置和电子设备
CN110839124A (zh) * 2018-08-16 2020-02-25 三赢科技（深圳）有限公司 镜头模组及该镜头模组的组装方法
WO2020082369A1 (zh) * 2018-10-26 2020-04-30 深圳市汇顶科技股份有限公司 屏下生物特征识别装置和电子设备
CN111158099B (zh) * 2018-11-08 2021-12-31 三赢科技（深圳）有限公司 相机模组及其镜头支架
CN112637448B (zh) * 2019-10-08 2022-11-15 宁波舜宇光电信息有限公司 感光组件、摄像模组和终端设备
KR20220023162A (ko) * 2020-08-20 2022-03-02 엘지이노텍 주식회사 카메라 모듈 및 이의 제조 방법
CN114827389A (zh) * 2021-01-18 2022-07-29 三赢科技（深圳）有限公司 摄像头模组及电子设备
CN117750172A (zh) * 2022-09-09 2024-03-22 信扬科技(佛山)有限公司 感光组件、摄像模组及电子装置
TWI848545B (zh) * 2023-02-06 2024-07-11 大陸商信揚科技(佛山)有限公司 鏡頭封裝模組及其製作方法
TWI853702B (zh) * 2023-09-07 2024-08-21 群光電子股份有限公司 攝像裝置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5866949A (en) * 1996-12-02 1999-02-02 Minnesota Mining And Manufacturing Company Chip scale ball grid array for integrated circuit packaging
JP2001203913A (ja) * 2000-01-21 2001-07-27 Sony Corp 撮像装置、カメラモジュール及びカメラシステム
TW548843B (en) * 2001-02-28 2003-08-21 Fujitsu Ltd Semiconductor device and method for making the same
JP3614840B2 (ja) * 2002-11-28 2005-01-26 沖電気工業株式会社 半導体装置
JP4395859B2 (ja) * 2003-01-07 2010-01-13 三星電機株式会社 携帯端末機用カメラモジュール
US7233737B2 (en) * 2003-08-12 2007-06-19 Micron Technology, Inc. Fixed-focus camera module and associated method of assembly
US7796187B2 (en) 2004-02-20 2010-09-14 Flextronics Ap Llc Wafer based camera module and method of manufacture
US6979902B2 (en) * 2004-03-10 2005-12-27 Micron Technology, Inc. Chip size image sensor camera module
US7714931B2 (en) * 2004-06-25 2010-05-11 Flextronics International Usa, Inc. System and method for mounting an image capture device on a flexible substrate
TWI329234B (en) * 2004-12-10 2010-08-21 Hon Hai Prec Ind Co Ltd Auromatic focusing lens module
JP2006171248A (ja) * 2004-12-15 2006-06-29 Renesas Technology Corp 光学モジュールの製造方法
KR100724885B1 (ko) * 2005-03-23 2007-06-04 삼성전자주식회사 카메라 렌즈 모듈
JP4806970B2 (ja) * 2005-06-01 2011-11-02 ソニー株式会社 固体撮像装置
TWI295845B (en) * 2006-02-22 2008-04-11 Advanced Semiconductor Eng Punch type substrate strip
JP2007281151A (ja) * 2006-04-06 2007-10-25 Matsushita Electric Ind Co Ltd 撮像装置および撮像装置製造方法
KR100810284B1 (ko) * 2006-09-28 2008-03-06 삼성전자주식회사 카메라 모듈과 그 제조 방법
JP4840114B2 (ja) * 2006-12-11 2011-12-21 パナソニック株式会社 カメラモジュールとその製造方法
JP2008153881A (ja) * 2006-12-15 2008-07-03 Hitachi Maxell Ltd カメラモジュール及び撮像装置
US20080170141A1 (en) 2007-01-11 2008-07-17 Samuel Waising Tam Folded package camera module and method of manufacture
JP4182253B2 (ja) * 2007-08-10 2008-11-19 富士通マイクロエレクトロニクス株式会社 カメラモジュール
CN100592131C (zh) * 2007-10-24 2010-02-24 鸿富锦精密工业（深圳）有限公司 摄像模组
US8248523B2 (en) * 2009-11-05 2012-08-21 Flextronics Ap, Llc Camera module with fold over flexible circuit and cavity substrate

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