JP2013515363A - 部品搭載機械 - Google Patents

部品搭載機械 Download PDF

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Publication number
JP2013515363A
JP2013515363A JP2012545165A JP2012545165A JP2013515363A JP 2013515363 A JP2013515363 A JP 2013515363A JP 2012545165 A JP2012545165 A JP 2012545165A JP 2012545165 A JP2012545165 A JP 2012545165A JP 2013515363 A JP2013515363 A JP 2013515363A
Authority
JP
Japan
Prior art keywords
nozzle
mounting head
component
component mounting
picking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012545165A
Other languages
English (en)
Japanese (ja)
Inventor
アクセルソン ロベルト
スンドストレーム ペテル
エスコング エリック
ヨナソン ロゲル
ニグレン ラルス
Original Assignee
マイデータ オートメーション アクチボラグ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マイデータ オートメーション アクチボラグ filed Critical マイデータ オートメーション アクチボラグ
Publication of JP2013515363A publication Critical patent/JP2013515363A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2012545165A 2009-12-30 2010-12-30 部品搭載機械 Pending JP2013515363A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US29132309P 2009-12-30 2009-12-30
US61/291,323 2009-12-30
PCT/EP2010/007983 WO2011079956A1 (en) 2009-12-30 2010-12-30 A component mounting machine

Publications (1)

Publication Number Publication Date
JP2013515363A true JP2013515363A (ja) 2013-05-02

Family

ID=43858347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012545165A Pending JP2013515363A (ja) 2009-12-30 2010-12-30 部品搭載機械

Country Status (5)

Country Link
EP (1) EP2520143A1 (ko)
JP (1) JP2013515363A (ko)
KR (1) KR20120120933A (ko)
CN (1) CN102742378A (ko)
WO (1) WO2011079956A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015052832A1 (ja) * 2013-10-11 2017-03-09 富士機械製造株式会社 吸着ノズル及び部品装着機
WO2020090114A1 (ja) * 2018-11-02 2020-05-07 株式会社Ｆｕｊｉ 作業機
US20220132698A1 (en) * 2020-10-22 2022-04-28 Continental Automotive Gmbh Electronic housing element comprising a radiator, and associated adjustment method

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103210483B (zh) 2010-09-15 2016-06-29 麦克罗尼克迈达塔有限责任公司 用于在工件上生成图案的设备
EP2695506A1 (en) 2011-04-08 2014-02-12 Micronic Mydata AB Method and fluid transfer unit having squeegees for providing a smooth surface of fluid
JP6168591B2 (ja) * 2013-03-08 2017-07-26 国立大学法人横浜国立大学 実装装置
JP6019409B2 (ja) 2013-11-13 2016-11-02 パナソニックＩｐマネジメント株式会社 電子部品実装装置及び電子部品実装方法
WO2015080857A1 (en) 2013-11-26 2015-06-04 Kla-Tencor Corporation Pick-and-place head and method for picking workpieces
EP3668301A1 (en) * 2018-12-11 2020-06-17 Mycronic AB Component mounting arrangement and related methods
EP3687271A1 (en) 2019-01-25 2020-07-29 Mycronic AB Eletrical verification of electronic components
TWI744850B (zh) * 2019-04-15 2021-11-01 日商新川股份有限公司 封裝裝置
KR20210104967A (ko) * 2020-02-18 2021-08-26 (주)테크윙 전자부품 파지용 픽킹장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04239200A (ja) * 1991-01-11 1992-08-27 Sanyo Electric Co Ltd 電子部品自動装着装置
JP2002307360A (ja) * 2001-04-13 2002-10-23 Juki Corp 電子部品実装機の装着ヘッド
JP2006245239A (ja) * 2005-03-02 2006-09-14 Juki Corp ワイドレンジ加圧装着ヘッド
JP2010087446A (ja) * 2008-10-03 2010-04-15 Panasonic Corp 部品実装機

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5029383A (en) * 1990-06-07 1991-07-09 Universal Instruments Corporation Articulating tip for pick and place head
US7281739B2 (en) * 2004-09-01 2007-10-16 Delaware Capital Formation, Inc. Adjustable mount for vacuum cup with offset mounting post and swivel
US7302755B2 (en) * 2005-02-07 2007-12-04 Samsung Techwin Co., Ltd. Head assembly for a component mounter
JP4730139B2 (ja) * 2006-03-03 2011-07-20 パナソニック株式会社 電子部品実装装置および電子部品実装方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04239200A (ja) * 1991-01-11 1992-08-27 Sanyo Electric Co Ltd 電子部品自動装着装置
JP2002307360A (ja) * 2001-04-13 2002-10-23 Juki Corp 電子部品実装機の装着ヘッド
JP2006245239A (ja) * 2005-03-02 2006-09-14 Juki Corp ワイドレンジ加圧装着ヘッド
JP2010087446A (ja) * 2008-10-03 2010-04-15 Panasonic Corp 部品実装機

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015052832A1 (ja) * 2013-10-11 2017-03-09 富士機械製造株式会社 吸着ノズル及び部品装着機
WO2020090114A1 (ja) * 2018-11-02 2020-05-07 株式会社Ｆｕｊｉ 作業機
JPWO2020090114A1 (ja) * 2018-11-02 2021-09-02 株式会社Ｆｕｊｉ 作業機
JP7303214B2 (ja) 2018-11-02 2023-07-04 株式会社Fuji 作業機
US20220132698A1 (en) * 2020-10-22 2022-04-28 Continental Automotive Gmbh Electronic housing element comprising a radiator, and associated adjustment method
US11844196B2 (en) * 2020-10-22 2023-12-12 Continental Automotive Gmbh Electronic housing element comprising a radiator, and associated adjustment method

Also Published As

Publication number Publication date
WO2011079956A4 (en) 2011-09-15
EP2520143A1 (en) 2012-11-07
CN102742378A (zh) 2012-10-17
WO2011079956A1 (en) 2011-07-07
KR20120120933A (ko) 2012-11-02

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Effective date: 20131112