JP2013510429A5 - - Google Patents

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Publication number
JP2013510429A5
JP2013510429A5 JP2012536885A JP2012536885A JP2013510429A5 JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5 JP 2012536885 A JP2012536885 A JP 2012536885A JP 2012536885 A JP2012536885 A JP 2012536885A JP 2013510429 A5 JP2013510429 A5 JP 2013510429A5
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JP
Japan
Prior art keywords
epoxy resin
goods
composition
dielectric
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012536885A
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English (en)
Japanese (ja)
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JP5716033B2 (ja
JP2013510429A (ja
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Publication date
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Priority claimed from PCT/US2010/053562 external-priority patent/WO2011056455A2/en
Publication of JP2013510429A publication Critical patent/JP2013510429A/ja
Publication of JP2013510429A5 publication Critical patent/JP2013510429A5/ja
Application granted granted Critical
Publication of JP5716033B2 publication Critical patent/JP5716033B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012536885A 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料 Expired - Fee Related JP5716033B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25880909P 2009-11-06 2009-11-06
US61/258,809 2009-11-06
PCT/US2010/053562 WO2011056455A2 (en) 2009-11-06 2010-10-21 Dielectric material with non-halogenated curing agent

Publications (3)

Publication Number Publication Date
JP2013510429A JP2013510429A (ja) 2013-03-21
JP2013510429A5 true JP2013510429A5 (OSRAM) 2013-12-05
JP5716033B2 JP5716033B2 (ja) 2015-05-13

Family

ID=43970641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012536885A Expired - Fee Related JP5716033B2 (ja) 2009-11-06 2010-10-21 非ハロゲン化硬化剤を有する誘電体材料

Country Status (6)

Country Link
US (1) US9247645B2 (OSRAM)
EP (1) EP2497347A4 (OSRAM)
JP (1) JP5716033B2 (OSRAM)
KR (1) KR101770007B1 (OSRAM)
CN (1) CN102598895B (OSRAM)
WO (1) WO2011056455A2 (OSRAM)

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CN103999558B (zh) * 2011-12-21 2017-07-14 3M创新有限公司 树脂组合物，由其制备的介电层和电容器
EP2892950B1 (en) * 2012-09-07 2017-03-08 3M Innovative Properties Company Silicone compositions and related methods
JP2017520656A (ja) * 2014-06-26 2017-07-27 ブルー キューブ アイピー エルエルシー 硬化性組成物
CN104194271B (zh) * 2014-08-29 2016-08-17 天津德高化成新材料股份有限公司 用于指纹传感器感应层的介电复合材料及制备方法
CN104292764A (zh) * 2014-10-31 2015-01-21 常熟市微尘电器有限公司 一种用于高储能电容器的复合介电材料及其制备方法
EP3239218B1 (en) * 2014-12-24 2021-11-24 Kyocera Corporation Dielectric film, film capacitor and combination type capacitor using same, inverter and electric vehicle
KR102660753B1 (ko) * 2018-02-01 2024-04-26 미쓰이금속광업주식회사 수지 조성물, 수지를 구비하는 구리박, 유전체층, 동장 적층판, 커패시터 소자 및 커패시터 내장 프린트 배선판
JP7123786B2 (ja) * 2018-12-27 2022-08-23 三井金属鉱業株式会社 樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
US12351698B2 (en) 2019-03-27 2025-07-08 Mitsui Mining & Smelting Co., Ltd. Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
US20220241003A1 (en) * 2019-03-29 2022-08-04 Conmed Corporation High permittivity electrosurgical electrode coating
CN113156554B (zh) * 2020-01-03 2024-11-15 杭州柔谷科技有限公司 光学功能薄膜及其制备方法及柔性光电子器件
CN111363122B (zh) * 2020-02-17 2022-05-17 西南科技大学 一种三重交联高性能聚合物及其制备方法
WO2025058085A1 (ja) * 2023-09-15 2025-03-20 富士フイルム株式会社 フィルム、積層体、バンドパスフィルタ、及び通信端末

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