JP2013510422A5 - - Google Patents

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Publication number
JP2013510422A5
JP2013510422A5 JP2012535971A JP2012535971A JP2013510422A5 JP 2013510422 A5 JP2013510422 A5 JP 2013510422A5 JP 2012535971 A JP2012535971 A JP 2012535971A JP 2012535971 A JP2012535971 A JP 2012535971A JP 2013510422 A5 JP2013510422 A5 JP 2013510422A5
Authority
JP
Japan
Prior art keywords
emitting device
light emitting
led die
type layer
underfill material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012535971A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013510422A (ja
Filing date
Publication date
Priority claimed from US12/613,924 external-priority patent/US8471280B2/en
Application filed filed Critical
Publication of JP2013510422A publication Critical patent/JP2013510422A/ja
Publication of JP2013510422A5 publication Critical patent/JP2013510422A5/ja
Pending legal-status Critical Current

Links

JP2012535971A 2009-11-06 2010-10-11 フリップチップｌｅｄのためのシリコーンベースの反射性アンダーフィル及び熱カプラ Pending JP2013510422A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/613,924 2009-11-06
US12/613,924 US8471280B2 (en) 2009-11-06 2009-11-06 Silicone based reflective underfill and thermal coupler
PCT/IB2010/054588 WO2011055249A2 (en) 2009-11-06 2010-10-11 Silicone based reflective underfill and thermal coupler for flip chip led

Publications (2)

Publication Number Publication Date
JP2013510422A JP2013510422A (ja) 2013-03-21
JP2013510422A5 true JP2013510422A5 (https=) 2013-11-28

Family

ID=43398808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012535971A Pending JP2013510422A (ja) 2009-11-06 2010-10-11 フリップチップｌｅｄのためのシリコーンベースの反射性アンダーフィル及び熱カプラ

Country Status (7)

Country Link
US (1) US8471280B2 (https=)
EP (1) EP2497126B1 (https=)
JP (1) JP2013510422A (https=)
KR (1) KR101833786B1 (https=)
CN (1) CN102971877B (https=)
TW (1) TWI504029B (https=)
WO (1) WO2011055249A2 (https=)

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US8207554B2 (en) 2009-09-11 2012-06-26 Soraa, Inc. System and method for LED packaging
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
US8575642B1 (en) 2009-10-30 2013-11-05 Soraa, Inc. Optical devices having reflection mode wavelength material
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US20110215348A1 (en) * 2010-02-03 2011-09-08 Soraa, Inc. Reflection Mode Package for Optical Devices Using Gallium and Nitrogen Containing Materials
KR101150861B1 (ko) * 2010-08-16 2012-06-13 한국광기술원 멀티셀 구조를 갖는 발광다이오드 및 그 제조방법
US8896235B1 (en) 2010-11-17 2014-11-25 Soraa, Inc. High temperature LED system using an AC power source
US8541951B1 (en) 2010-11-17 2013-09-24 Soraa, Inc. High temperature LED system using an AC power source
USD720310S1 (en) 2011-06-17 2014-12-30 Soraa, Inc. Triangular semiconductor die
US8952402B2 (en) 2011-08-26 2015-02-10 Micron Technology, Inc. Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and associated systems and methods
KR101969334B1 (ko) * 2011-11-16 2019-04-17 엘지이노텍 주식회사 발광 소자 및 이를 구비한 발광 장치
TWI606618B (zh) 2012-01-03 2017-11-21 Ｌｇ伊諾特股份有限公司 發光裝置
CN104205366B (zh) 2012-03-30 2018-08-31 亮锐控股有限公司 密封的半导体发光器件
WO2013182980A1 (en) * 2012-06-07 2013-12-12 Koninklijke Philips N.V. Chip scale light emitting device with metal pillars in a molding compound formed at wafer level
JP6155827B2 (ja) * 2013-05-11 2017-07-05 日亜化学工業株式会社 発光装置の製造方法
JP6155932B2 (ja) * 2013-07-19 2017-07-05 日亜化学工業株式会社 発光装置
JP2015032740A (ja) * 2013-08-05 2015-02-16 豊田合成株式会社 発光装置
JP6303805B2 (ja) * 2014-05-21 2018-04-04 日亜化学工業株式会社 発光装置及びその製造方法
WO2016062359A1 (en) * 2014-10-24 2016-04-28 Hewlett-Packard Indigo B.V. Electrophotographic varnish
JP6447018B2 (ja) * 2014-10-31 2019-01-09 日亜化学工業株式会社 発光装置及び発光装置の製造方法
DE102015108056A1 (de) * 2015-05-21 2016-11-24 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil, optoelektronische Anordnung und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
EP3357097B1 (en) 2015-10-01 2020-12-16 Cree, Inc. Low optical loss flip chip solid state lighting device
WO2018223391A1 (en) * 2017-06-09 2018-12-13 Goertek. Inc Micro-led array transfer method, manufacturing method and display device
CN107437542B (zh) * 2017-07-31 2023-05-05 广东工业大学 一种紫外led芯片及其制备方法
TWI705585B (zh) * 2017-09-25 2020-09-21 致伸科技股份有限公司 光源模組
US11387389B2 (en) 2018-01-29 2022-07-12 Creeled, Inc. Reflective layers for light-emitting diodes
US11923481B2 (en) 2018-01-29 2024-03-05 Creeled, Inc. Reflective layers for light-emitting diodes
US11031527B2 (en) 2018-01-29 2021-06-08 Creeled, Inc. Reflective layers for light-emitting diodes
US10879441B2 (en) 2018-12-17 2020-12-29 Cree, Inc. Interconnects for light emitting diode chips
US10985294B2 (en) 2019-03-19 2021-04-20 Creeled, Inc. Contact structures for light emitting diode chips
US11094848B2 (en) 2019-08-16 2021-08-17 Creeled, Inc. Light-emitting diode chip structures
US11032976B1 (en) 2020-03-16 2021-06-15 Hgci, Inc. Light fixture for indoor grow application and components thereof
USD933872S1 (en) 2020-03-16 2021-10-19 Hgci, Inc. Light fixture
USD933881S1 (en) 2020-03-16 2021-10-19 Hgci, Inc. Light fixture having heat sink
CN112968094B (zh) * 2020-07-13 2022-03-01 重庆康佳光电技术研究院有限公司 一种倒装led芯片及其制备方法、显示面板
US20260076002A1 (en) * 2022-12-16 2026-03-12 Lumileds Llc Thin film led package without substrate carrier

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JP4359201B2 (ja) * 2004-07-26 2009-11-04 シャープ株式会社 光半導体装置、光コネクタおよび電子機器
CN100340008C (zh) * 2004-09-30 2007-09-26 中国科学院半导体研究所 背孔结构氮化镓基发光二极管的制作方法
JP2006169395A (ja) * 2004-12-16 2006-06-29 Nagase Chemtex Corp アンダーフィル樹脂組成物
US7125734B2 (en) * 2005-03-09 2006-10-24 Gelcore, Llc Increased light extraction from a nitride LED
US7754507B2 (en) * 2005-06-09 2010-07-13 Philips Lumileds Lighting Company, Llc Method of removing the growth substrate of a semiconductor light emitting device
JP2007019096A (ja) 2005-07-05 2007-01-25 Toyoda Gosei Co Ltd 発光装置及びその製造方法
CN101028228A (zh) * 2006-03-01 2007-09-05 通用电气公司 含有亚微粒氮化硼颗粒的化妆品组合物
KR20090127344A (ko) * 2007-03-08 2009-12-10 센서즈 포 메드슨 앤드 사이언스 인코포레이티드 가혹한 환경용 발광 다이오드
US7791093B2 (en) * 2007-09-04 2010-09-07 Koninklijke Philips Electronics N.V. LED with particles in encapsulant for increased light extraction and non-yellow off-state color
US7687810B2 (en) * 2007-10-22 2010-03-30 Philips Lumileds Lighting Company, Llc Robust LED structure for substrate lift-off
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CN101878540B (zh) * 2007-11-29 2013-11-06 日亚化学工业株式会社 发光装置及其制造方法
US20090230409A1 (en) * 2008-03-17 2009-09-17 Philips Lumileds Lighting Company, Llc Underfill process for flip-chip leds

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