JP2013258299A - Wafer ring exchanging device and chip mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer ring exchanging device capable of performing the exchanging operation of a wafer ring stably, and to provide a chip mounting device which can be made compact by using such a wafer ring exchanging device.SOLUTION: A ring changer includes a ring holder for holding a wafer ring vertically in two stages, and a vertical motion mechanism for moving the ring holder vertically. A wafer ring of the ring holder is supplied to an exchange stage by a supply/return mechanism, and the wafer ring on the exchange stage is returned back to the ring holder. A changeover mechanism changes over an upper supply/return position corresponding to a wafer ring on the upper stage of a ring holder in the supply/return mechanism, and a lower supply/return position corresponding to a wafer ring on the lower stage of a ring holder.

Description

    The present invention relates to a wafer ring exchange apparatus and a chip mounting apparatus for bonding a chip (die) such as a semiconductor chip to a substrate such as a lead frame.

  As described in Patent Document 1 or the like, the chip mounting apparatus includes a substrate holding unit 101, a wafer ring holding unit 102, a wafer supply unit 103, and the like as shown in FIG. Is.

  The substrate holding unit 101 includes a substrate transport conveyor 101a disposed along the X direction, and transports the substrate 105 along the X direction. The wafer ring holding unit 102 holds the wafer ring 107 to which the wafer sheet 106 is attached. The wafer sheet 106 is singulated to form chips 108. The wafer supply unit 103 includes a magazine 110 that holds a plurality of stages of wafer rings 107 to which wafer sheets 106 are attached.

  In such an apparatus, the wafer ring 107 held in the magazine 110 is supplied to the wafer ring holder 102 by the transfer means, in this case, the transfer arm 111. The wafer ring holding unit 102 picks up the pick-up means, in this case, the chip 108 of the wafer sheet 106 attached to the wafer ring 107 by the mounting head 112 and pips it up and holds it on the substrate holding unit 101. It is mounted on the substrate 105.

  By the way, in such an apparatus, the substrate holding unit 101, the wafer ring holding unit 102, the wafer supply unit 103, and the like are arranged in a planar manner without being overlapped. For this reason, the arrangement space of the whole apparatus has become large.

  Further, when the chip 108 of the wafer sheet 106 of the wafer ring 107 in the wafer ring holding unit 102 is lost, it is necessary to supply a new wafer ring 107 to the wafer supply unit 103. For this reason, the transfer means provided with the transfer arm 111 constitutes a wafer ring exchanging means. As such replacement means, the used wafer ring 107 is taken out from the wafer ring holding unit 102 and returned to the magazine 110, and a new wafer ring 107 is taken out from the magazine 110 and supplied to the wafer ring holding unit 102. There is a need. For this reason, in order to replace the wafer ring, it is necessary to lift and lower the magazine 110 by elevator means as shown in Patent Document 2 and the like.

JP 2008-258524 A JP 2003-309165 A

  When the magazine 110 is moved up and down by the elevator means for exchanging the wafer ring, since the weight of the magazine 110 is large, it is necessary to increase the lifting force of the elevator means. It was.

  In the apparatus shown in FIG. 13, since the wafer ring holding unit 102 picks up an ejector pin, an expand ring, and the like. That is, during the pickup operation, tension is applied to the wafer sheet 106 by an expand ring, and in this state, the chip to be picked up is pushed up by the ejector pin.

  For this reason, as shown in FIG. 13, if the wafer ring replacement position and the pickup position are the same position, the pickup operation cannot be performed during the wafer ring replacement operation, and the wafer ring replacement operation is performed during the pickup operation. I can't. Therefore, the work time as a whole is long.

  Therefore, as shown in FIG. 14, it can be proposed to make the wafer ring replacement position different from the pickup position. That is, the chip mounting apparatus shown in FIG. 14 includes a wafer ring exchange stage 120, a ring elevator 123 for raising and lowering a magazine 122 that holds the wafer ring 121 in a plurality of stages, and a wafer ring exchange means 124. As the wafer ring exchanging means 124, the transfer arm 111 shown in FIG. 13 can be used.

  In this case, the elevator 123 and the wafer ring exchanging means 124 are disposed at 180 ° opposite positions with respect to the wafer ring exchanging position. The magazine 122 is moved up and down by the elevator 123, and the wafer ring 121 (wafer ring before use) having the chip to be picked up is chucked by the transfer arm 111, pulled out from the magazine 122 and placed on the wafer ring exchange stage 120. . Further, the wafer ring 121 (wafer ring after use) for which the chip has been picked up is returned to the wafer ring exchange stage 120, chucked by the transfer arm 111 on the exchange stage 120, and accommodated in the magazine 122.

  In this apparatus, the wafer ring 121 reciprocates between the pickup position and the exchange stage 120 as indicated by an arrow C. Further, the wafer ring 121 reciprocates between the elevator 123 and the exchange stage 120 as indicated by an arrow B.

  The pickup position is disposed obliquely behind the wafer ring replacement position. That is, the expander mechanism 125 reciprocates between the pickup position and the wafer ring replacement position. When the expander mechanism 125 is located at the wafer ring replacement position, the wafer ring 121 is replaced, and the expander mechanism 125 is expanded. When the panda mechanism 125 is located at the pickup position, the expander mechanism 125 applies tension to the wafer sheet, and in this state, the chip to be picked up is pushed up by the ejector pins.

  However, in the mounting apparatus as shown in FIG. 14, the magazine 122, the ring replacement position, and the wafer ring replacement means standby position are arranged on a straight line, and the overall width of the apparatus becomes large.

  Considering the configuration of each member, the center position PO at the pickup position needs to be arranged outside the apparatus with respect to the center position CO at the ring replacement position. For this reason, the overall width of the apparatus is large.

  By the way, such an implementation apparatus is provided with preform means for applying an adhesive to the island of the substrate and bonding means for mounting the chip on the island of the substrate. For this reason, adjustment of the preform operation by the preform means, adjustment of the bonding operation by the bonding means, and the like are required. The bonding operation includes a pickup operation for picking up a chip from the wafer sheet and a bonding operation for bonding the picked-up chip to the island of the substrate, and each operation needs to be adjusted.

  Therefore, in the apparatus shown in FIG. 14 that cannot be made compact as a whole, there are drawbacks in that various parts of the adjustment work are arranged at positions where it is difficult to work, and thus various kinds of work are difficult to perform. Further, the mounting table on which the magazine is mounted is disposed at a relatively high level. For this reason, the operation | work which mounts the magazine which is a heavy article on a high level mounting stand has become heavy labor for the operator.

  Therefore, in view of such circumstances, the present invention provides a wafer ring exchanging apparatus that can stably perform an exchanging operation of a wafer ring and a chip mounting apparatus that can be miniaturized using such a wafer ring exchanging apparatus. .

  A wafer ring exchanging apparatus according to the present invention includes a ring magazine having a plurality of wafer rings holding wafer sheets, a wafer ring before use of the ring magazine to an exchange stage, and a wafer ring after use of the exchange stage. A ring changer including a ring changer for returning the ring holder to the ring magazine, wherein the ring changer includes a ring holder that holds the wafer ring in two upper and lower stages, and a vertical movement mechanism that moves the ring holder up and down. The wafer ring of the ring holder is supplied to the exchange stage, the supply / return mechanism for returning the wafer ring of the exchange stage to the ring holder, and the upper supply corresponding to the upper wafer ring of the ring holder in the supply / return mechanism・ Return position and lower supply / return position corresponding to the lower wafer ring of the ring holder It is obtained by a switching mechanism for switching.

  According to the wafer ring exchanging apparatus of the present invention, the wafer ring can be moved up and down in two stages by the up and down movement by the vertical movement mechanism. Also, if the supply / return mechanism is compatible with the upper wafer ring, the wafer ring supply operation to the replacement stage and the removal of the wafer ring from the replacement stage can be performed with this supply / return mechanism. Become. If the supply / return mechanism corresponds to the lower wafer ring, the wafer ring supply operation to the replacement stage and the removal of the wafer ring from the replacement stage can be performed with this supply / return mechanism. In this way, the wafer ring replacement operation at each stage can be performed stably. In addition, since the vertical movement mechanism is provided, the ring holder can be lowered except during wafer ring replacement work.

  The supply / return mechanism can return the wafer ring to the ring holder after use of the exchange stage at the lower supply / return position, and supply the wafer ring before use of the ring holder to the exchange stage at the upper supply / return position.

  The supply / return mechanism can include a chuck portion with an opening / closing function that enables chucking of the wafer ring and a transport mechanism that transports the wafer ring chucked by the chuck portion along the horizontal direction.

  At the time of ring replacement, the ring magazine may be disposed below the replacement stage, and the ring changer may be disposed on the side of the replacement stage and the ring magazine disposed above and below.

  It is preferable to provide a drawer stage that can be stored under the exchange stage and pulled forward, and the ring magazine is placed on this stage.

  By setting in this way, the magazine can be positioned below the exchange stage. For this reason, in a state where the drawer stage is pulled forward, this stage is positioned at a low position. Moreover, in this pulled out state, there is no other member above the pulling stage.

  The chip mounting apparatus of the present invention is a chip mounting apparatus including the wafer ring replacement device and a bonding device disposed on the rear side of the replacement stage, and the bonding device moves the substrate along its transport direction. Conveying means for pitch-feeding from the upstream side toward the downstream side, preform means for applying the adhesive to the island when the island of the substrate to which the adhesive is to be applied is conveyed to the preform position, and adhesive And a bonding means for bonding a chip to the island when the island is transported to the bonding position.

  According to the chip mounting apparatus, since the preform means and the bonding means are provided, it is possible to apply the adhesive to the island in a state where the island of the substrate to which the adhesive is to be applied is conveyed to the preform position. it can. Further, it is possible to bond the chip to the island in a state where the island to which the adhesive is applied is conveyed to the bonding position.

  In the ring changer of the present invention, in the lifting and lowering operation by the vertical movement mechanism of the ring changer, it is only necessary to raise and lower the wafer ring in two stages, so that the vertical movement mechanism can be downsized. In addition, the wafer ring replacement operation at each stage can be performed stably. In addition, the ring holder can be lowered except during the wafer ring exchange operation, and various adjustments to the apparatus and further improvement in maintainability can be achieved.

  If the supply / return mechanism includes a chuck portion with an opening / closing function and a transfer mechanism, the wafer ring can be exchanged reliably. If it is possible to supply the wafer ring from the ring magazine to the ring holder and return the wafer ring from the ring holder to the ring magazine, the wafer ring can be exchanged between the ring magazine and the exchange stage. This contributes to improvement in workability and downsizing of the apparatus.

  If the ring changer is arranged on the side of the exchange stage and the ring magazine housed below the exchange stage, the entire apparatus can be made compact and the exchange time can be shortened.

  In a case having a drawer stage, the stage is positioned at a low position in a state where the drawer stage is pulled forward, so that the work of placing the magazine on the stage can be reduced. In addition, if the drawer stage is stored, the magazine is stored below the replacement stage, and compactness can be achieved. For this reason, it is possible to improve various adjustments and maintainability of the apparatus. Further, in the pulled-out state of the drawer stage, there is no other member above the drawer stage, so that it is possible to facilitate the magazine placing operation and the removing operation.

  Since the chip mounting apparatus of the present invention includes the preform unit and the bonding unit, the preform operation and the bonding operation can be performed, and if the magazine accommodated in the wafer ring is set on the drawer stage, Wafer ring chips housed in the magazine can be sequentially mounted on the substrate, and the workability is excellent.

It is a simplified top view of the chip mounting apparatus of the embodiment of the present invention. FIG. 2 is a simplified overall plan view of the chip mounting apparatus shown in FIG. 1. It is a simplification figure showing operation of a wafer ring exchange device of an embodiment of the present invention. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing the operation of the wafer ring exchange device. It is a simplified diagram showing preform means. It is a simplified diagram showing a bonding means. FIG. 12 is a perspective view of a chip bonded by the bonding means of FIG. 11. It is a simplified top view of the conventional chip mounting apparatus. It is a simplified top view of the other conventional chip mounting apparatus.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  FIG. 1 is a simplified plan view of a chip mounting apparatus according to the present invention. This chip mounting apparatus is for bonding a chip (die) 3 such as a semiconductor chip to a substrate 1 such as a lead frame (see FIG. 10). A lead frame is a thin metal plate used as an internal wiring of a semiconductor package. For this reason, in the present invention, the board 1 includes a board generally called a lead frame and a board (for example, a printed board) on which various electronic components are arranged.

  In this chip mounting apparatus, the substrate 1 (see FIG. 10) on which a plurality of islands are formed at a predetermined pitch along the longitudinal direction is sequentially transferred to the substrate transport means 14 shown in FIG. 2 along the longitudinal direction. The adhesive 4 (see FIG. 11) is applied to the island of the substrate 1 at the upstream preform position, and then the chip 3 is bonded to the island of the substrate 1 at the downstream bonding position. It is.

  As shown in FIG. 2, the entire configuration of the chip mounting apparatus includes a preform unit 12 for applying the adhesive 4 to the island of the substrate 1, and the chip 3 on the island to which the adhesive 4 has been applied by the preform unit 12. The bonding means 13 for bonding, the substrate conveying means 14 for conveying the substrate 1, the ring changer 15 for exchanging the wafer ring 28 holding the wafer sheet 27 shown in FIG. 12 to be described later, and the wafer ring 28 in FIG. And a reciprocating means 16 for conveying from the exchange stage 30 shown to the pickup position.

  The preform unit 12, the bonding unit 13, the substrate transport unit 14, the ring changer 15, and the reciprocating unit 16 are controlled by the control unit 17. The control means 17 is, for example, a microcomputer in which a ROM (Read Only Memory), a RAM (Random Access Memory), and the like are connected to each other via a bus with a central processing unit (CPU) as a center. The control means 17 is provided with a storage device as storage means. The storage device includes an HDD (Hard Disc Drive), a DVD (Digital Versatile Disk) drive, a CD-R (Compact Disc-Recordable) drive, an EEPROM (Electronically Erasable and Programmable Read Only Memory), and the like. The ROM stores programs executed by the CPU and data.

  The transport unit 14 includes, for example, a clamp mechanism that clamps the substrate 1 and a drive mechanism that moves the clamp portion of the clamp mechanism from the upstream side toward the downstream side. For example, a servo motor or the like can be used as the drive mechanism, and the substrate 1 can be sent to the downstream side at an arbitrary pitch (set pitch) under the control of the control means 17. That is, the island of the substrate 1 can be sequentially sent to the preform position and the bonding position.

  The conveying means 14 may be provided with a feeder such as a belt feeder including a driving wheel, a driven wheel, and a belt wound around these, and a driving mechanism for driving the feeder. . In this case, if the board | substrate 1 is supplied to a feeder, it will be arrange | positioned on a feeder in the state positioned by the positioning means (For example, the pin etc. which fit in the through-hole in which a board | substrate is formed). As the drive mechanism, for example, a servo motor or the like can be used. Under the control of the control means 17, the drive wheel of the feeder is driven to the set arbitrary rotation angle, and the substrate 1 is set to any pitch (set pitch). Can be sent downstream.

  At the preform position, a preform process (dispensing process) for applying the adhesive 4 to the island of the substrate 1 is performed. For this reason, as shown in FIG. 10, the preform means 12 includes an adhesive application syringe 21 having a nozzle 20 for discharging the adhesive 4 (see FIG. 11) and the syringe 21 in the X-axis direction (FIG. 1). And an XYZ stage 22 that is driven in the Y-axis direction (Y1, Y2 direction shown in FIG. 1) and the Z-axis direction (vertical direction). That is, the XYZ stage 22 includes an X stage 22a that is driven in the X axis direction, a Y stage 22b that is driven in the Y axis direction, and an X stage 22c that is driven in the Z axis direction.

  For this reason, the syringe 21 can move along the X-axis direction, move along the Y-axis direction, and move along the Z-axis direction. Thus, the adhesive 4 is discharged onto the island in a state where the nozzle 20 corresponds to the position of the island during preforming and the discharge amount (application amount) is controlled from the nozzle 20. Note that an island detection camera 23 is attached to the XYZ stage 22.

  At the bonding position, bonding is performed in which the chip (die) 3 is transported to the island to which the adhesive 4 has been applied and placed on the adhesive 4. For this reason, the bonding means 13 includes a bonding arm (not shown) having a collet 26 that attracts the chip 3 of the wafer ring 28 disposed at the pickup position 25, and a confirmation camera (not shown) that observes the chip 3 of the wafer ring 28. And a confirmation camera (not shown) for observing the island of the lead frame (substrate) 1 at the bonding position.

  The wafer sheet 27 is divided into a large number of chips 3. That is, the wafer sheet 27 is attached to an adhesive sheet (dicing sheet), and this dicing sheet is held by an annular frame. The wafer sheet 27 on the dicing sheet is separated into pieces using a circular blade (dicing saw) or the like to form the chips 3. Further, the bonding arm holding the collet 26 can be moved between the pickup position and the bonding position via a conveying means (not shown).

  Further, the chip 3 is vacuum-sucked through the suction hole opened in the lower end surface of the collet 26, and the chip 3 is adsorbed on the lower end surface of the collet 26. If this vacuum suction (evacuation) is released, the chip 3 is detached from the collet 26.

  Next, a bonding method using this bonding means will be described. First, the chip 3 to be picked up is observed with a confirmation camera arranged above the supply unit 25, the collet 26 is positioned above the chip 3 to be picked up, and then the collet 26 as indicated by an arrow Z1. Is lowered to pick up the chip 3. Thereafter, the collet 26 is raised as indicated by the arrow Z2.

  Next, the island of the lead frame 1 to be bonded is observed with a confirmation camera disposed above the bonding position, and the collet 26 is moved in the direction of the arrow Y3 to be positioned above the island. The collet 26 is moved downward as indicated by an arrow Z3 to supply the chip 3 to this island. After supplying the chip 3 to the island, the collet 26 is raised as indicated by the arrow Z4 and then returned to the standby position above the pip-up position as indicated by the arrow Y4.

  That is, by moving the collet 26 sequentially as indicated by arrows Z1, Z2, Y3, Z3, Z4, and Y4, the chip 3 positioned based on the observation of the pickup confirmation camera is picked up by the collet 26. The chip 3 is mounted on the island.

  By the way, the wafer ring 28 reciprocates between the exchange stage 30 and the pip-up position as indicated by an arrow C by the reciprocating means 16. For example, the reciprocating means 16 can be constituted by an XY table or the like. An expander 19 (see FIG. 3) having a pressure ring 18 is disposed on the XY table.

  Below the exchange stage 30, a drawer stage 32 on which a ring magazine 31 (see FIG. 3 and the like) in which the wafer rings 28 are accommodated in a plurality of stages is placed. The drawer stage 32 includes a substrate table 33 on which the ring magazine 31 is placed and fixed, and a guide mechanism for guiding the extraction and storage of the substrate table 33.

  For example, the guide mechanism can include a pair of left and right guide long recesses provided on the side surface of the substrate base 33 and a pair of guide rollers provided on the frame side of the apparatus and facing each other. In this case, each guide long recess extends in the front-rear direction of the substrate base 33, and each guide roller is fitted in each guide long recess. The guide mechanism may include a guide rail.

  For this reason, as shown by the phantom line in FIG. 1, if the substrate stage 33 is pulled out from the storage state in which the substrate stage 33 is stored in the lower position of the exchange stage 30, as shown by the solid line in FIG. It can be pulled forward from the exchange stage 30. Further, when the substrate stage 33 is pushed backward from this pulled out state, the substrate stage 33 is stored in a lower position of the exchange stage 30 as shown by a solid line in FIG.

  A ring exchanging device having a ring changer 15 is disposed on the side of the exchanging stage 30. As shown in FIG. 3, the ring changer 15 includes a ring holder 41 that holds the wafer ring 28 in two upper and lower stages, a vertical movement mechanism 42 that moves the ring holder 41 up and down, and a wafer ring of the ring holder 41. 28 is chucked and supplied to the replacement stage 30, and the wafer ring 28 of the replacement stage 30 is chucked and returned to the ring holder, and the upper wafer ring of the ring holder 41 in the supply / return mechanism And a switching mechanism 44 for switching between an upper supply / return position corresponding to 28 and a lower supply / return position corresponding to the lower wafer ring 28 of the ring holder 41.

  The ring holding body 41 includes a first cradle 41 a disposed above and a second cradle 41 b disposed below. The pair of upper and lower cradles 41 a and 41 b are moved up and down by the switching mechanism 44. To do. Therefore, the switching mechanism 44 can be configured by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  In this case, a reciprocating mechanism as the switching mechanism 44 is attached to the vertical movement mechanism 42, and the switching mechanism 44 and the ring holding body 41 are moved up and down (lifted) by driving the vertical movement mechanism 42. The vertical movement mechanism 42 can also be constituted by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  The supply / return mechanism 43 transports the chuck part 43a having an opening / closing function that enables chucking of the wafer ring 28 and the wafer ring 28 chucked by the chuck part 43a along the horizontal direction as indicated by an arrow B. It can be configured with the mechanism 43b. The chuck portion 43a has a pair of swinging pieces 45 and 45 that swing about the base side, and a swinging mechanism (not shown) that swings the swinging pieces 45 and 45. As the swing mechanism, various existing mechanisms such as a gear mechanism, a link mechanism, and a toggle mechanism can be used. Then, by driving a drive source (motor) (not shown), the swinging pieces 45 and 45 are swung through the swinging mechanism to perform an opening / closing operation.

  The transport mechanism 43b can be configured by a reciprocating mechanism connected to the chuck portion 43a. Also in this case, it can be configured by an existing reciprocating mechanism such as a cylinder mechanism, a ball / nut mechanism, or a linear guide mechanism.

  By the way, in this apparatus, as shown in FIG. 1, the center position PO of the wafer ring 28 at the pickup position is arranged inside the apparatus with respect to the center position CO of the wafer ring 28 on the exchange stage 30. That is, the center position PO at the pickup position is set to be located closer to the ring changer 15 than the center position CO of the exchange stage 30.

  On the other hand, in the conventional apparatus shown in FIG. 14, if the configuration of each member is taken into consideration, the center position PO at the pickup position needs to be arranged outside the apparatus from the center position CO at the ring replacement position. there were. For this reason, the overall width of the apparatus is large.

  Next, using the ring changer 15 configured as described above, the exchange operation of the wafer ring 28 on the exchange stage 30 will be described with reference to FIGS. In the state shown in FIG. 3A, the uppermost wafer ring 28 (28a) of the magazine 31 is located at the pickup position, and the second wafer ring 28 (28b) from the top of the magazine 31 is This is a state in which the ring holder 41 of the changer 15 is placed on the first cradle 41a. In this state, the wafer ring 28 is not placed on the first cradle 41 b of the ring holder 41.

  As shown in FIG. 3B from the state shown in FIG. 3A, the wafer ring 28a located at the pickup position is driven on the exchange stage 30 by driving the reciprocating means 16, that is, the XY table. To be located. In this state, as shown in FIG. 3C, the pressure ring 18 on the XY table is raised in the direction of the arrow E1, and the ring holding body 41 is raised by the vertical movement mechanism 42 as shown by the arrow D1.

  Thereafter, as shown in FIG. 4A, the chuck is released from the wafer ring 28b received by the first receiving base 41a to the supply / return mechanism 43, and the chuck portion 43a of the supply / return mechanism 43 is released. Retreat as shown by arrow A2. This backward movement retracts the supply / return mechanism 43 to the limit position (maximum backward position). Next, as shown in FIG. 4B, the holding mechanism 41 is raised by the switching mechanism 44 as indicated by the arrow D2, and the supply / return mechanism 43 is provided between the first receiving base 41a and the second receiving base 41b. Is in a state of being interposed. Thereafter, as shown in FIG. 4C, the supply / return mechanism 43 is advanced as indicated by an arrow A1 to escape from the limit position.

  Next, as shown by an arrow B <b> 1 in FIG. 5A, the chuck portion 43 a of the supply / return mechanism 43 is positioned on the replacement stage 30. Then, the wafer ring 28a on the exchange stage 30 is chucked by the chuck portion 43a. Thereafter, the chuck portion 43a is retracted while being chucked, and is returned to the ring changer 15 side as indicated by an arrow B2 in FIG. 5B, and the switching mechanism 44 is adjusted to adjust the wafer on the second cradle 41b. The ring 28a is adjusted to the replaceable height position of the replacement stage 30 as indicated by an arrow D3 in FIG.

  Thereafter, as shown in FIG. 6A, the chuck portion 43a of the supply / return mechanism 43 is opened and retracted to the limit position in the arrow A2 direction. Thereafter, the ring holder 41 is lowered as indicated by an arrow D4, and the height position of the wafer ring 28b on the first cradle 41a is changed to the replaceable height position of the exchange stage 30 as shown in FIG. 6B. Adjust to. Thereafter, as indicated by an arrow A1 in FIG. 6C, the chuck portion 43a is advanced to return to the origin.

  Next, as indicated by an arrow A1 in FIG. 7A, the chuck portion 43a is advanced to chuck the wafer ring 28b on the first cradle 41a. Thereafter, as indicated by an arrow B1 in FIG. 7B, the chuck portion 43a is advanced, and the wafer ring 28b is transferred onto the XY stage. Then, the chuck portion 43a is opened, and the chuck portion 43a shown in FIG. Retract as shown by arrow B2.

  Thereafter, as shown in FIG. 8A, the chuck portion 43a is retracted to the limit position in the direction of arrow A2, and the pressure ring 18 is lowered as shown by arrow E2 to obtain the state shown in FIG. 8B. Then, the ring holder 41 is raised as shown by the arrow D5. Next, as indicated by an arrow A1 in FIG. 8C, the chuck portion 43a is advanced to return to the origin.

  Thereafter, as indicated by an arrow A1 in FIG. 9A, the chuck portion 43a is advanced to chuck the wafer ring 28a on the second receiving base 41b of the ring holder 41, and then the arrow in FIG. 9B. As shown in D6, the ring holder 41 is lowered. Then, as shown in FIG. 9C, the wafer ring 28b on the XY table is transferred in the direction of the arrow C2 by the XY table and is conveyed to the pickup position.

  In this manner, on the exchange stage 30, the exchange operation between the wafer ring 28 (pipe wafer 28a after use) for which pip-up has been completed and the wafer ring 28 (peg wafer ring 28b before use) that has not been pip-up is completed. To do.

  In the present invention, the stage 32 is positioned at a low position in a state where the drawer stage 32 is pulled forward, so that the work of placing the magazine on the stage 32 can be reduced. In addition, if the drawer stage 32 is stored, the magazine 31 is stored below the replacement stage 30 and compactness can be achieved. For this reason, it is possible to improve various adjustments and maintainability of the apparatus. Further, in the pulled-out state of the drawer stage 32, there is no other member above the drawer stage 32. Therefore, it is possible to facilitate the work of placing and removing the magazine 31.

  By disposing the center position PO of the wafer ring 28 at the pickup position inside the apparatus relative to the center position CO of the wafer ring 28 on the exchange stage 30, the entire apparatus can be made compact.

  In the raising / lowering operation by the vertical movement mechanism 42 of the ring changer 15, it is only necessary to raise / lower the wafer rings 28, 28 in two stages, so that the vertical movement mechanism 42 can be downsized. In the case where the ring changer 15 is provided, the exchange operation of the wafer rings 28 and 28 at each stage can be stably performed. In addition, the ring holder 41 can be lowered except during wafer ring replacement work, and various adjustments to the apparatus and further improved maintainability can be achieved.

  Since the supply / return mechanism 43 includes the chuck portion 43a with an opening / closing function and the transport mechanism 43b, the wafer ring 28 can be exchanged reliably. Since the supply of the wafer ring 28 from the ring magazine 31 to the ring holder 41 and the return of the wafer ring 28 from the ring holder 41 to the ring magazine 31 are possible, the space between the ring magazine 31 and the exchange stage 30 is possible. Thus, the wafer ring 28 can be replaced, which contributes to the improvement of workability and the compactness of the apparatus.

  If the ring changer 15 is arranged on the side of the exchange stage 30 and the ring magazine 31 stored below the exchange stage 30, the entire apparatus can be made compact and the exchange work time can be shortened. it can.

  Since the preform means 12 and the bonding means 13 are provided, the preform operation and the bonding operation can be performed. If the magazine 31 accommodated in the wafer ring 28 is set on the drawer stage 32, the magazine 31 The chips 3 of the accommodated wafer ring 28 can be sequentially mounted on the substrate, and the workability is excellent.

  As described above, the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made. The wafer ring 28 of the first receiving table 41a is transferred to the exchange stage by returning to the table 41b. Conversely, the used wafer ring 28 is returned to the first receiving table 41a and the second receiving table 41b. The wafer ring 28 may be transferred onto an exchange stage. Moreover, in the said embodiment, although the ring changer 41 was arrange | positioned on the left side seeing from the front, the ring changer 41 may be arrange | positioned on the right side seeing from the front. Although the chuck mechanism is used as the supply / return mechanism 43 in the above-described embodiment, a mechanism that presses the wafer ring without using such a chuck mechanism may be used.

1 Board (lead frame)
3 Chip 12 Preform means 13 Bonding means 14 Substrate transport means 15 Ring changer 16 Reciprocating means 27 Wafer sheet 28 Wafer ring 30 Exchange stage 31 Ring magazine 32 Draw stage 41 Ring holder 42 Vertical movement mechanism 43 Supply / return mechanism 43a Chuck Part 43b transport mechanism 44 switching mechanism

Claims (6)

A ring magazine having a plurality of wafer rings for holding wafer sheets, and a ring changer for supplying wafer rings before use of the ring magazine to the exchange stage and returning the wafer ring to the ring magazine after use of the exchange stage. A wafer ring exchange apparatus comprising:
The ring changer includes a ring holder that holds the wafer ring in two upper and lower stages, a vertical movement mechanism that moves the ring holder up and down, and supplies the wafer ring of the ring holder to the exchange stage. Supply / return mechanism for returning the ring holder to the ring holder, an upper supply / return position corresponding to the upper wafer ring of the ring holder in the supply / return mechanism, and a lower supply / return corresponding to the lower wafer ring of the ring holder A wafer ring exchanging apparatus comprising a switching mechanism for switching between positions.   The supply / return mechanism returns the wafer ring to the ring holder after use of the exchange stage at the lower supply / return position, and supplies the wafer ring before use of the ring holder to the exchange stage at the upper supply / return position. The wafer ring exchange apparatus according to claim 1.   The supply / return mechanism includes a chuck portion with an opening / closing function that enables chucking of the wafer ring, and a transport mechanism that transports the wafer ring chucked by the chuck portion along the horizontal direction. The wafer ring exchange apparatus according to claim 1 or 2.   The ring magazine is arranged below the exchange stage when the ring is exchanged, and the ring changer is arranged on the side of the exchange stage and the ring magazine arranged above and below. The wafer ring exchange device according to any one of the above.   5. The wafer ring exchanging apparatus according to claim 4, further comprising a drawer stage that can be stored under the exchange stage and pulled forward, and the ring magazine is placed on the stage. A chip mounting apparatus comprising the wafer ring exchanging apparatus according to any one of claims 1 to 5 and a bonding apparatus disposed on a rear side of the exchanging stage,
The bonding apparatus includes a conveyance means for pitch-feeding the substrate from the upstream side to the downstream side in the conveyance direction, and the island of the substrate to which the adhesive is to be applied when the island is conveyed to the preform position. A chip mounting apparatus comprising: a preforming unit for applying an adhesive to the island; and a bonding unit for bonding a chip to the island when the island to which the adhesive is applied is conveyed to a bonding position.

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