JP2013258188A5 - - Google Patents
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- Publication number
- JP2013258188A5 JP2013258188A5 JP2012131857A JP2012131857A JP2013258188A5 JP 2013258188 A5 JP2013258188 A5 JP 2013258188A5 JP 2012131857 A JP2012131857 A JP 2012131857A JP 2012131857 A JP2012131857 A JP 2012131857A JP 2013258188 A5 JP2013258188 A5 JP 2013258188A5
- Authority
- JP
- Japan
- Prior art keywords
- phosphorus
- doped silicon
- film
- single crystal
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 48
- 229910052710 silicon Inorganic materials 0.000 claims 48
- 239000010703 silicon Substances 0.000 claims 48
- 239000013078 crystal Substances 0.000 claims 20
- 239000000758 substrate Substances 0.000 claims 17
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 15
- 229910052698 phosphorus Inorganic materials 0.000 claims 15
- 239000011574 phosphorus Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000010438 heat treatment Methods 0.000 claims 6
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000003672 processing method Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012131857A JP2013258188A (ja) | 2012-06-11 | 2012-06-11 | 基板処理方法と半導体装置の製造方法、および基板処理装置 |
| KR1020130060848A KR101455251B1 (ko) | 2012-06-11 | 2013-05-29 | 기판 처리 방법과 반도체 장치의 제조 방법 및 기판 처리 장치 |
| TW102120506A TWI497610B (zh) | 2012-06-11 | 2013-06-10 | Semiconductor device manufacturing method and substrate processing device |
| US13/915,054 US20130344689A1 (en) | 2012-06-11 | 2013-06-11 | Method for processing substrate, method for manufacturing semiconductor device, and substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012131857A JP2013258188A (ja) | 2012-06-11 | 2012-06-11 | 基板処理方法と半導体装置の製造方法、および基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013258188A JP2013258188A (ja) | 2013-12-26 |
| JP2013258188A5 true JP2013258188A5 (enExample) | 2015-07-30 |
Family
ID=49774780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012131857A Pending JP2013258188A (ja) | 2012-06-11 | 2012-06-11 | 基板処理方法と半導体装置の製造方法、および基板処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130344689A1 (enExample) |
| JP (1) | JP2013258188A (enExample) |
| KR (1) | KR101455251B1 (enExample) |
| TW (1) | TWI497610B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6338904B2 (ja) | 2014-03-24 | 2018-06-06 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置 |
| JP6560991B2 (ja) * | 2016-01-29 | 2019-08-14 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | 半導体装置の製造方法、基板処理装置およびプログラム |
| JP7199286B2 (ja) * | 2019-03-29 | 2023-01-05 | 東京エレクトロン株式会社 | 基板処理装置 |
| US11245044B2 (en) * | 2020-01-14 | 2022-02-08 | Hoon Kim | Plasmonic field-enhanced photodetector and image sensor |
| KR102824349B1 (ko) * | 2022-04-28 | 2025-06-23 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 방법, 반도체 장치의 제조 방법, 프로그램 및 기판 처리 장치 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6158879A (ja) * | 1984-08-29 | 1986-03-26 | Nec Corp | シリコン薄膜結晶の製造方法 |
| JPH05226657A (ja) * | 1992-02-10 | 1993-09-03 | Nippondenso Co Ltd | 薄膜トランジスタおよびその製造方法 |
| JP3009979B2 (ja) * | 1993-07-05 | 2000-02-14 | シャープ株式会社 | 半導体装置及びその製造方法 |
| JPH0982651A (ja) * | 1995-09-14 | 1997-03-28 | Toshiba Corp | 半導体装置の製造方法 |
| TW328650B (en) * | 1996-08-27 | 1998-03-21 | United Microelectronics Corp | The MOS device and its manufacturing method |
| US5908307A (en) * | 1997-01-31 | 1999-06-01 | Ultratech Stepper, Inc. | Fabrication method for reduced-dimension FET devices |
| JPH10326837A (ja) * | 1997-03-25 | 1998-12-08 | Toshiba Corp | 半導体集積回路装置の製造方法、半導体集積回路装置、半導体装置、及び、半導体装置の製造方法 |
| US6068928A (en) * | 1998-02-25 | 2000-05-30 | Siemens Aktiengesellschaft | Method for producing a polycrystalline silicon structure and polycrystalline silicon layer to be produced by the method |
| US6346732B1 (en) * | 1999-05-14 | 2002-02-12 | Kabushiki Kaisha Toshiba | Semiconductor device with oxide mediated epitaxial layer |
| JP3886085B2 (ja) * | 1999-05-14 | 2007-02-28 | 株式会社東芝 | 半導体エピタキシャル基板の製造方法 |
| JP3492973B2 (ja) * | 2000-03-30 | 2004-02-03 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2001291850A (ja) * | 2000-04-10 | 2001-10-19 | Hitachi Cable Ltd | 結晶シリコン薄膜の製造方法 |
| KR100770460B1 (ko) * | 2000-05-31 | 2007-10-26 | 인터내셔널 비지네스 머신즈 코포레이션 | 컨택 스터드 형성 방법 |
| EP1296361A1 (en) * | 2001-09-13 | 2003-03-26 | STMicroelectronics S.r.l. | A process of forming an interface free layer of silicon on a substrate of monocrystalline silicon |
| KR100680946B1 (ko) * | 2004-04-28 | 2007-02-08 | 주식회사 하이닉스반도체 | 반도체 소자의 콘택 플러그 형성방법 |
| US7361563B2 (en) * | 2004-06-17 | 2008-04-22 | Samsung Electronics Co., Ltd. | Methods of fabricating a semiconductor device using a selective epitaxial growth technique |
| JP2007329200A (ja) * | 2006-06-06 | 2007-12-20 | Toshiba Corp | 半導体装置の製造方法 |
| US7776698B2 (en) * | 2007-10-05 | 2010-08-17 | Applied Materials, Inc. | Selective formation of silicon carbon epitaxial layer |
| JP5023004B2 (ja) * | 2008-06-30 | 2012-09-12 | 株式会社日立国際電気 | 基板処理方法及び基板処理装置 |
| JP2010141079A (ja) * | 2008-12-11 | 2010-06-24 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法 |
| US8313999B2 (en) * | 2009-12-23 | 2012-11-20 | Intel Corporation | Multi-gate semiconductor device with self-aligned epitaxial source and drain |
-
2012
- 2012-06-11 JP JP2012131857A patent/JP2013258188A/ja active Pending
-
2013
- 2013-05-29 KR KR1020130060848A patent/KR101455251B1/ko active Active
- 2013-06-10 TW TW102120506A patent/TWI497610B/zh active
- 2013-06-11 US US13/915,054 patent/US20130344689A1/en not_active Abandoned
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