JP2013215804A - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP2013215804A
JP2013215804A JP2013056572A JP2013056572A JP2013215804A JP 2013215804 A JP2013215804 A JP 2013215804A JP 2013056572 A JP2013056572 A JP 2013056572A JP 2013056572 A JP2013056572 A JP 2013056572A JP 2013215804 A JP2013215804 A JP 2013215804A
Authority
JP
Japan
Prior art keywords
laser light
laser
light source
processing apparatus
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013056572A
Other languages
English (en)
Japanese (ja)
Inventor
Hong Ki Kim
キ キム、ホン
Do Yeong Yoon
イーオン ヨーン、ド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2013215804A publication Critical patent/JP2013215804A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)
JP2013056572A 2012-04-05 2013-03-19 レーザ加工装置 Pending JP2013215804A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2012-0035515 2012-04-05
KR1020120035515A KR101497763B1 (ko) 2012-04-05 2012-04-05 레이저 가공 장치

Publications (1)

Publication Number Publication Date
JP2013215804A true JP2013215804A (ja) 2013-10-24

Family

ID=49210037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013056572A Pending JP2013215804A (ja) 2012-04-05 2013-03-19 レーザ加工装置

Country Status (3)

Country Link
JP (1) JP2013215804A (ko)
KR (1) KR101497763B1 (ko)
DE (1) DE102013103063A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2910971A1 (en) 2014-02-24 2015-08-26 Ricoh Company, Ltd. Object recognition apparatus and object recognition method
EP2921992A2 (en) 2014-03-18 2015-09-23 Ricoh Company, Ltd. Image processing device, drive support system, image processing method, and program

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101825922B1 (ko) * 2015-08-28 2018-03-22 주식회사 이오테크닉스 레이저 가공장치 및 방법
KR101872441B1 (ko) * 2017-01-26 2018-06-28 주식회사 이오테크닉스 마스크 세정 장치 및 레이저 어닐링 장치

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10315425A (ja) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd レーザ製版装置
JPH11500962A (ja) * 1995-11-29 1999-01-26 バーゼル−シェール ラーゼルグラフィックス ゲーエムベーハー レーザ彫刻機
JP2001023920A (ja) * 1999-07-08 2001-01-26 Sumitomo Heavy Ind Ltd レーザ加工装置
JP2003203874A (ja) * 2002-01-10 2003-07-18 Sharp Corp レーザ照射装置
US20030141288A1 (en) * 2002-01-16 2003-07-31 Mayer Hans Juergen Laser machining device
JP2010115670A (ja) * 2008-11-11 2010-05-27 Olympus Corp レーザリペア装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141030A (en) * 1997-04-24 2000-10-31 Konica Corporation Laser exposure unit including plural laser beam sources differing in wavelength
JP5080009B2 (ja) * 2005-03-22 2012-11-21 日立ビアメカニクス株式会社 露光方法
KR101262457B1 (ko) 2010-10-05 2013-05-08 엘지이노텍 주식회사 태양광 발전장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11500962A (ja) * 1995-11-29 1999-01-26 バーゼル−シェール ラーゼルグラフィックス ゲーエムベーハー レーザ彫刻機
JPH10315425A (ja) * 1997-05-20 1998-12-02 Dainippon Screen Mfg Co Ltd レーザ製版装置
JP2001023920A (ja) * 1999-07-08 2001-01-26 Sumitomo Heavy Ind Ltd レーザ加工装置
JP2003203874A (ja) * 2002-01-10 2003-07-18 Sharp Corp レーザ照射装置
US20030141288A1 (en) * 2002-01-16 2003-07-31 Mayer Hans Juergen Laser machining device
JP2005514212A (ja) * 2002-01-16 2005-05-19 シーメンス　アクチエンゲゼルシヤフト レーザ加工装置
JP2010115670A (ja) * 2008-11-11 2010-05-27 Olympus Corp レーザリペア装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2910971A1 (en) 2014-02-24 2015-08-26 Ricoh Company, Ltd. Object recognition apparatus and object recognition method
EP2921992A2 (en) 2014-03-18 2015-09-23 Ricoh Company, Ltd. Image processing device, drive support system, image processing method, and program

Also Published As

Publication number Publication date
KR101497763B1 (ko) 2015-03-02
KR20130113154A (ko) 2013-10-15
DE102013103063A1 (de) 2013-10-10

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