JP2013171907A5 - - Google Patents
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- Publication number
- JP2013171907A5 JP2013171907A5 JP2012033809A JP2012033809A JP2013171907A5 JP 2013171907 A5 JP2013171907 A5 JP 2013171907A5 JP 2012033809 A JP2012033809 A JP 2012033809A JP 2012033809 A JP2012033809 A JP 2012033809A JP 2013171907 A5 JP2013171907 A5 JP 2013171907A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- lid
- sealing
- sealing material
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003566 sealing material Substances 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 6
- 238000002844 melting Methods 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 3
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033809A JP5900006B2 (ja) | 2012-02-20 | 2012-02-20 | 電子デバイスの封止方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033809A JP5900006B2 (ja) | 2012-02-20 | 2012-02-20 | 電子デバイスの封止方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013171907A JP2013171907A (ja) | 2013-09-02 |
JP2013171907A5 true JP2013171907A5 (enrdf_load_stackoverflow) | 2015-03-19 |
JP5900006B2 JP5900006B2 (ja) | 2016-04-06 |
Family
ID=49265691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012033809A Expired - Fee Related JP5900006B2 (ja) | 2012-02-20 | 2012-02-20 | 電子デバイスの封止方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5900006B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015119378A (ja) * | 2013-12-19 | 2015-06-25 | 日本電波工業株式会社 | 高安定発振器 |
WO2016111038A1 (ja) * | 2015-01-08 | 2016-07-14 | 株式会社村田製作所 | 圧電振動部品及びその製造方法 |
JP6499886B2 (ja) * | 2015-03-11 | 2019-04-10 | 田中貴金属工業株式会社 | 電子部品封止用キャップ |
JP6862681B2 (ja) * | 2016-05-23 | 2021-04-21 | 日本電気硝子株式会社 | 気密パッケージの製造方法及び気密パッケージ |
CN106304827B (zh) * | 2016-10-08 | 2021-03-05 | 西安西光精细化工有限公司 | 一种抗高过载电子部件灌封工艺 |
JP2020036179A (ja) * | 2018-08-30 | 2020-03-05 | 日本電波工業株式会社 | 圧電デバイス |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11191601A (ja) * | 1997-12-26 | 1999-07-13 | Sumitomo Metal Smi Electron Devices Inc | 半導体パッケージ気密封止用リッド |
JP3960156B2 (ja) * | 2002-07-19 | 2007-08-15 | 千住金属工業株式会社 | 板状基板封止用リッドの製造方法 |
JP2009295780A (ja) * | 2008-06-05 | 2009-12-17 | Daishinku Corp | 表面実装型電子部品の製造方法 |
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2012
- 2012-02-20 JP JP2012033809A patent/JP5900006B2/ja not_active Expired - Fee Related