JP2013171930A5 - - Google Patents
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- Publication number
- JP2013171930A5 JP2013171930A5 JP2012034103A JP2012034103A JP2013171930A5 JP 2013171930 A5 JP2013171930 A5 JP 2013171930A5 JP 2012034103 A JP2012034103 A JP 2012034103A JP 2012034103 A JP2012034103 A JP 2012034103A JP 2013171930 A5 JP2013171930 A5 JP 2013171930A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate
- adhesive
- inorganic film
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 40
- 239000000853 adhesive Substances 0.000 claims description 23
- 230000001070 adhesive effect Effects 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012034103A JP5901991B2 (ja) | 2012-02-20 | 2012-02-20 | 電子部品パッケージ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012034103A JP5901991B2 (ja) | 2012-02-20 | 2012-02-20 | 電子部品パッケージ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013171930A JP2013171930A (ja) | 2013-09-02 |
| JP2013171930A5 true JP2013171930A5 (enrdf_load_stackoverflow) | 2015-03-05 |
| JP5901991B2 JP5901991B2 (ja) | 2016-04-13 |
Family
ID=49265712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012034103A Active JP5901991B2 (ja) | 2012-02-20 | 2012-02-20 | 電子部品パッケージ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5901991B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10508030B2 (en) * | 2017-03-21 | 2019-12-17 | Invensas Bonding Technologies, Inc. | Seal for microelectronic assembly |
| KR102427643B1 (ko) * | 2018-09-27 | 2022-08-01 | 삼성전자주식회사 | 팬-아웃 반도체 패키지 |
| JP2023073684A (ja) * | 2021-11-16 | 2023-05-26 | 株式会社東芝 | センサ及び電子装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4342174B2 (ja) * | 2002-12-27 | 2009-10-14 | 新光電気工業株式会社 | 電子デバイス及びその製造方法 |
| JP2010028025A (ja) * | 2008-07-24 | 2010-02-04 | Toyota Motor Corp | 電子装置 |
| JP2010177435A (ja) * | 2009-01-29 | 2010-08-12 | Yokogawa Electric Corp | 赤外線光源 |
| JP5568786B2 (ja) * | 2009-12-24 | 2014-08-13 | 新光電気工業株式会社 | 半導体パッケージの製造方法及び半導体パッケージ |
| JP5134045B2 (ja) * | 2010-06-23 | 2013-01-30 | 日本電波工業株式会社 | 圧電デバイス及びその製造方法 |
| JP2012028454A (ja) * | 2010-07-21 | 2012-02-09 | Murata Mfg Co Ltd | 部分めっき方法、金属製蓋部材、および電子部品。 |
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2012
- 2012-02-20 JP JP2012034103A patent/JP5901991B2/ja active Active