JP2013147707A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013147707A5 JP2013147707A5 JP2012009423A JP2012009423A JP2013147707A5 JP 2013147707 A5 JP2013147707 A5 JP 2013147707A5 JP 2012009423 A JP2012009423 A JP 2012009423A JP 2012009423 A JP2012009423 A JP 2012009423A JP 2013147707 A5 JP2013147707 A5 JP 2013147707A5
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic plating
- resin
- plated product
- primer composition
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- -1 poly (3,4-disubstituted thiophene Chemical class 0.000 claims 8
- 238000009713 electroplating Methods 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 3
- 229920000647 polyepoxide Polymers 0.000 claims 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 2
- 229930182556 Polyacetal Natural products 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004695 Polyether sulfone Substances 0.000 claims 2
- 239000004697 Polyetherimide Substances 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 2
- 239000004954 Polyphthalamide Substances 0.000 claims 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims 2
- 229920001940 conductive polymer Polymers 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229920001643 poly(ether ketone) Polymers 0.000 claims 2
- 229920002492 poly(sulfone) Polymers 0.000 claims 2
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920001707 polybutylene terephthalate Polymers 0.000 claims 2
- 239000004417 polycarbonate Substances 0.000 claims 2
- 229920000515 polycarbonate Polymers 0.000 claims 2
- 229920006393 polyether sulfone Polymers 0.000 claims 2
- 229920001601 polyetherimide Polymers 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229920006324 polyoxymethylene Polymers 0.000 claims 2
- 229920001955 polyphenylene ether Polymers 0.000 claims 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 2
- 229920006375 polyphtalamide Polymers 0.000 claims 2
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 229920000447 polyanionic polymer Polymers 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012009423A JP2013147707A (ja) | 2012-01-19 | 2012-01-19 | 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物 |
| PCT/JP2013/050378 WO2013108713A1 (ja) | 2012-01-19 | 2013-01-11 | 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物 |
| TW102101451A TW201339376A (zh) | 2012-01-19 | 2013-01-15 | 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012009423A JP2013147707A (ja) | 2012-01-19 | 2012-01-19 | 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013147707A JP2013147707A (ja) | 2013-08-01 |
| JP2013147707A5 true JP2013147707A5 (https=) | 2015-02-26 |
Family
ID=48799139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012009423A Pending JP2013147707A (ja) | 2012-01-19 | 2012-01-19 | 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013147707A (https=) |
| TW (1) | TW201339376A (https=) |
| WO (1) | WO2013108713A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6346183B2 (ja) * | 2013-08-02 | 2018-06-20 | 株式会社トクヤマ | 光学物品用光硬化性プライマー組成物の硬化体を含むフォトクロミック積層体及び該積層体の製造方法 |
| JP6607832B2 (ja) * | 2016-08-05 | 2019-11-20 | 信越ポリマー株式会社 | 導電性高分子分散液及びその製造方法、並びに導電性フィルム及びその製造方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2575672B2 (ja) * | 1986-11-14 | 1997-01-29 | 清蔵 宮田 | 非導電性物質のメツキ法 |
| EP0440957B1 (de) * | 1990-02-08 | 1996-03-27 | Bayer Ag | Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung |
| DE4227836C2 (de) * | 1992-08-20 | 1997-09-25 | Atotech Deutschland Gmbh | Verfahren zur Metallisierung von Nichtleitern |
| JPH0681190A (ja) * | 1992-09-02 | 1994-03-22 | Bridgestone Corp | 絶縁体のめっき方法 |
| JP4010657B2 (ja) * | 1997-07-18 | 2007-11-21 | 富士フイルム株式会社 | 金属化材料の製造方法 |
| US7118690B2 (en) * | 2000-11-22 | 2006-10-10 | H. C. Starck Gmbh | Dispersible polymer powders |
| DE10058116A1 (de) * | 2000-11-22 | 2002-05-23 | Bayer Ag | Polythiophene |
| JP5181231B2 (ja) * | 2007-01-12 | 2013-04-10 | アキレス株式会社 | めっき物及びその製造方法 |
| WO2009112573A2 (de) * | 2008-03-13 | 2009-09-17 | Basf Se | Verfahren und dispersion zum aufbringen einer metallschicht auf einem substrat sowie metallisierbare thermoplastische formmasse |
| JP2011153372A (ja) * | 2010-01-04 | 2011-08-11 | Daiso Co Ltd | 金属多層積層電気絶縁体とその製造方法 |
-
2012
- 2012-01-19 JP JP2012009423A patent/JP2013147707A/ja active Pending
-
2013
- 2013-01-11 WO PCT/JP2013/050378 patent/WO2013108713A1/ja not_active Ceased
- 2013-01-15 TW TW102101451A patent/TW201339376A/zh unknown
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ojstršek et al. | Metallisation of textiles and protection of conductive layers: an overview of application techniques | |
| Konda et al. | Soft microreactors for the deposition of conductive metallic traces on planar, embossed, and curved surfaces | |
| JP2014074161A5 (https=) | ||
| JP2013510429A5 (https=) | ||
| CN104476847A (zh) | 一种高剥离强度挠性覆铜板及其制作方法 | |
| JP2017005280A5 (https=) | ||
| WO2011149295A3 (ko) | 용융 가공 수지 성형품 | |
| CN107001813A (zh) | 激光直接结构化材料及其制备方法 | |
| CN104407729B (zh) | 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 | |
| HK1217772A1 (zh) | 具有不同的初级和/或次级结构的两个区域的层或者三维成型体、生产其的方法以及进行这种方法的材料 | |
| EP2842763A3 (en) | Image formation method, decorative sheet, decorative sheet molding, process for producing in-mold molded product, in-mold molded product, and ink set | |
| PH12015500899B1 (en) | Coverplay film, flexible printed circuit board using same, and production method therefor | |
| Tengsuthiwat et al. | 3D-MID technology for surface modification of polymer-based composites: a comprehensive review | |
| JP2013065675A5 (https=) | ||
| JP2015500899A5 (https=) | ||
| CN104376899A (zh) | 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 | |
| Yu et al. | Silver-nanowire-based elastic conductors: Preparation processes and substrate adhesion | |
| WO2012083003A3 (en) | Methods of multi-shot injection molding and metal-plated multi-layered polymeric articles made therefrom | |
| Romani et al. | Metallization of thermoplastic polymers and composites 3D printed by fused filament fabrication | |
| JP2015193812A5 (https=) | ||
| JP2013147707A5 (https=) | ||
| JP2012248370A5 (https=) | ||
| JP2013046996A (ja) | プラスチック製品及びその製造方法 | |
| US20160085326A1 (en) | Conductive laminate, touch panel and electronic device using the conductive laminate, and method for making the conductive laminate | |
| EP3594259A4 (en) | EPOXY POLYMER, EPOXY RESIN, COMPOSITION OF EPOXY RESIN, RESIN SHEET, STAGE B SHEET, CURED PRODUCT, STAGE C SHEET, METAL SHEET CONTAINING RESIN, METAL SUBSTRATE AND PROCESS FOR THE MANUFACTURE OF EPOXY RESIN |