CN104407729B - 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 - Google Patents

电子装置、触控屏、透明导电膜及透明导电膜的制备方法 Download PDF

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CN104407729B
CN104407729B CN201410540569.7A CN201410540569A CN104407729B CN 104407729 B CN104407729 B CN 104407729B CN 201410540569 A CN201410540569 A CN 201410540569A CN 104407729 B CN104407729 B CN 104407729B
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CN104407729A (zh
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赵天行
吴景扬
陈秋棋
彭世文
曾德仁
庄承鑫
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Interface Optoelectronics Shenzhen Co Ltd
General Interface Solution Ltd
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
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    • G06F3/0412Digitisers structurally integrated in a display
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/1603Process or apparatus coating on selected surface areas
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
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    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
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    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
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    • G06F2203/04112Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Abstract

一种透明导电膜,包括透明的基底及涂布于该基底上表面的透明的压印层,该压印层上开设有相互连通的呈网格状的凹槽,该凹槽底部填充有一油墨层,该油墨层上形成有导电层,该导电层凸伸出该凹槽且该导电层呈网格状。本发明还提供一种上述透明导电膜的制备方法及应用该导电膜的触控屏与电子装置。

Description

电子装置、触控屏、透明导电膜及透明导电膜的制备方法
技术领域
本发明涉及一种透明导电膜及其制备方法、应用该透明导电膜的触控屏及电子装置。
背景技术
近年来,透明导电膜广泛应用于触摸屏、平板显示、光伏器件、电磁屏蔽等领域。中、大尺寸触控屏上的透明导电膜越来越多的采用金属网格,以取代传统的ITO薄膜作为透明导电膜的导电材料。该类金属网格为在透明的基板上成型而获得的网格状的金属导线。在制作金属网格时,需利用压印模仁在附着于基板表面的压印材料上压印出凹槽,并在凹槽中形成金属导电层,而凹槽中的金属导电层的厚度直接影响到透明导电膜的方块电阻值大小,且透明导电膜的方块电阻值越小越好。
发明内容
鉴于上述情况,有必要提供一种的透明导电膜的制备方法。另外,还有必要提供一种由该方法制得的透明导电膜及应用该透明导电膜的触控屏与电子装置。
一种透明导电膜,包括透明的基底及涂布于该基底上表面的透明的压印层,该压印层上开设有相互连通的呈网格状的凹槽,该凹槽底部填充有一油墨层,该油墨层上形成有导电层,该导电层凸伸出该凹槽且该导电层呈网格状。
一种制备如上所述的透明导电膜的方法,其包括如下步骤:提供一透明柔性材料作为基底;提供一透明的压印材料,将该压印材料涂布于基底的一表面;提供一模仁,该模仁上设置有呈网格状的凸起,用该模仁于该压印材料上压印出呈网格状的凹槽并固化从而形成压印层;在该凹槽中形成油墨层;以及在该油墨层上形成导电层,该导电层呈网格状且该导电层凸伸出该凹槽。
一种触控屏,包括保护面板,该触控屏还包括如上所述的透明导电膜,该保护面板覆盖于该导电层的表面。
一种电子装置,包括壳体及电子元件,该电子装置还包括如上所述的触控屏,该触控屏安装于该壳体上,该触控屏与该壳体形成一容置空间,该电子元件安装于该容置空间内。
本发明的透明导电膜,其制作方法简单。该导电层凸伸出凹槽,使得该导电层的方块电阻值减小,从而提高触控屏的灵敏度。
附图说明
图1为本发明较佳实施方式的透明导电膜的示意图。
图2为图1所示的透明导电膜剖面图。
图3为本发明较佳实施方式的电子装置的示意图。
主要元件符号说明
透明导电膜 100
基底 10
压印层 30
凹槽 31
导电层 50
油墨层 60
触控屏 200
保护面板 201
电子装置 300
壳体 301
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参照图1和图2,本发明提供一种透明导电膜100,其包括柔性透明的基底10、涂布于基底10一表面的透明的压印层30及形成于压印层30上的导电层50。压印层30远离基底10的表面上开设有呈网格状的相互连通的凹槽31。该凹槽31的宽度为0.5μm~10μm。凹槽31的底部填充有一油墨层60。该导电层50形成于油墨层60上,且该导电层50呈网格状。该导电层50及油墨层60的厚度之和大于凹槽31深度,更具体的,该导电层50凸伸出凹槽31大致0.01μm~2μm。
基底10为透明柔性材料。该透明柔性材料可选自聚对苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚烯烃类树脂、乙烯基系列树脂、聚醚醚酮(PEEK)、聚砜(PSF)、聚醚砜(PES)、聚碳酸酯(PC)、聚酰胺、聚酰亚胺、丙烯酸树脂及三乙烯基纤维素(TAC)等其中一种。聚烯烃类树脂可选自聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯及乙烯-醋酸乙烯共聚物(EVA)等。乙烯基系列树脂可选自聚氯乙烯、聚偏二氯乙烯等。该基底10的厚度为30μm ~200μm。
压印层30可由热塑性聚合物胶、热固性聚合物胶和紫外固化聚合物胶中的一种固化而成。该压印层30的厚度为1μm~50μm。
导电层50的材料可选自一般的导电金属或合金,例如铜、镍。本实施例中,多条平行的凹槽31与多条垂直的凹槽31相互交叉形成相互连通的方形网格,而导电层50也呈方形网格状布置。在其他实施例中,相互连通的凹槽31可通过不同的排布方式构成各种形成的网格,如六边形网格,而导电层50也相应的形成各种形状的网格。
油墨层60由含金属触媒的油墨固化而成。该金属触媒可为含钯、银、钛、铜或锆等金属元素中的一种或几种。例如该含金属触媒的油墨可为锡钯胶体油墨、钯离子油墨、纳米钯金属粒子油墨等中的一种。该油墨中的金属元素可被还原成金属作为化学镀反应的触媒。
本发明一较佳实施方式中的透明导电膜100的制备方法,其包括如下步骤:
提供一基底10,该基底10为透明柔性材料。该透明柔性材料可选自聚对苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚烯烃类树脂、乙烯基系列树脂、聚醚醚酮(PEEK)、聚砜(PSF)、聚醚砜(PES)、聚碳酸酯(PC)、聚酰胺、聚酰亚胺、丙烯酸树脂及三乙烯基纤维素(TAC)等中的一种。聚烯烃类树脂可选自聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯及乙烯-醋酸乙烯共聚物(EVA)等。乙烯基系列树脂可选自聚氯乙烯、聚偏二氯乙烯等。该基底10的厚度为30μm~200μm。
提供一透明的压印材料,将压印材料涂布于基底10的一表面。该透明的压印材料可选自热塑性聚合物胶、热固性聚合物胶和紫外固化聚合物胶中的一种。
提供一模仁,该模仁上设置有呈网格状的凸起。凸起的宽度为0.5μm~10μm。用该模仁于透明的压印材料远离该基底10的表面上压印出呈网格状的凹槽31,并将该压印后的压印材料通过烘烤或紫外光照射固化形成压印层30。其中,该压印层30的厚度为1μm~50μm,该凹槽31的宽度为0.5μm~10μm。
提供一含有金属触媒的油墨,用该油墨填充至凹槽31中并固化油墨得到油墨层60。本实施例中,将油墨涂布于压印层30形成有凹槽31的表面上,再利用刮刀将凹槽31外的油墨刮除,仅留下凹槽31内的油墨。对凹槽31中的油墨进行烘烤或紫外光照射,从而固化形成油墨层60,得到带有油墨层60的中间体。该金属触媒可为含钯、银、钛、铜或锆等金属元素中的一种或几种。例如该油墨可为锡钯胶体油墨、钯离子油墨、纳米钯金属粒子油墨等中的一种。
将带有油墨层60的中间体浸泡于含有还原剂的溶液中进行还原处理,使得表面的油墨层60中包括的金属元素还原为金属。该金属可作为化学镀反应的触媒。例如,用含钯离子的油墨形成油墨层60,将该带有钯离子的油墨层60浸泡于含有氢氧化钠或硼酸氢钠的溶液中进行还原,还原出金属钯。
将上述浸泡过的中间体浸泡于化镀液中进行化学镀,使得导电金属沉积于油墨层60上从而形成导电层50。例如,将油墨层60表面带有金属钯的中间体浸泡于含甲醛和硫酸铜的化镀液中,还原形成金属铜沉积于油墨层60上从而形成导电层50。同时,控制浸泡化镀液的时间以控制该导电层50凸伸出凹槽31大致0.01μm~2μm。上述方法得到的透明导电膜100除了不透明的导电层50外其余部分均为透明,以便光线透过。
本实施例中所得到的透明导电膜100表面的导电层50大致呈方形网格状。在其他实施例中,相互连通的凹槽31可构成其他任意形状,使得导电层50为其他任意形状的网格,如六边形网格。
请同时参阅图2及3,一种应用上述透明导电膜100的触控屏200,其包括透明导电膜100、覆盖于该透明导电膜100形成有该导电层50的表面的保护面板201、电性连接于透明导电膜100的导电层50的电极引线(图未示)、及电性连接于该电极引线的导电线路(图未示)。
请同时参阅图3,一种应用所述触控屏200的电子装置300,其可为手机、平板电脑、电子阅读器等任一应用触控屏200的电子产品。该电子装置300包括壳体301、收容于壳体301中的电子元件(图未示)、及连接于该壳体301的触控屏200。该触控屏200与壳体301配合形成一容置空间,所述电子元件安装于该容置空间内。
上述透明导电膜100,其制作方法简单。该导电层50及油墨层60的厚度之和大于凹槽31深度,使得该导电层50的方块电阻值减小,从而提高触控屏200的灵敏度。
另外,对于本领域的普通技术人员来说,可以根据本发明的技术构思做出其它各种相应的改变与变形,而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (12)

1.一种透明导电膜,包括透明的基底及形成于该基底一表面的透明的压印层,其特征在于:该压印层上开设有相互连通的呈网格状的凹槽,该凹槽底部形成有一油墨层,该油墨层上形成有导电层,该导电层凸伸出该凹槽且该导电层呈网格状。
2.如权利要求1所述的透明导电膜,其特征在于:该导电层凸伸出该凹槽0.01μm~2μm。
3.如权利要求1所述的透明导电膜,其特征在于:该基底为透明柔性材料,该透明柔性材料选自聚对苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚烯烃类树脂、乙烯基系列树脂、聚醚醚酮、聚砜、聚醚砜、聚碳酸酯、聚酰胺、聚酰亚胺、丙烯酸树脂及三乙烯基纤维素等中的一种该基底的厚度为30μm~200μm。
4.如权利要求1所述的透明导电膜,其特征在于:该压印层由热塑性聚合物胶、热固性聚合物胶和紫外固化聚合物胶中的一种固化而成,该压印层的厚度为1μm~50μm。
5.如权利要求1所述的透明导电膜,其特征在于:该凹槽的宽度为0.5μm~10μm。
6.如权利要求1所述的透明导电膜,其特征在于:该油墨层的材质为含金属触媒的油墨,该金属触媒为含钯、银、钛、铜或锆等金属元素中的一种或几种。
7.如权利要求6所述的透明导电膜,其特征在于:该导电层是将该油墨层中的金属元素还原成金属并进行化学镀形成的。
8.一种制备如权利要求1至7所述的透明导电膜的方法,其包括如下步骤:
提供一透明柔性材料作为基底;
提供一透明的压印材料,将该压印材料涂布于基底的一表面;
提供一模仁,该模仁上设置有呈网格状的凸起,用该模仁于该压印材料上压印出呈网格状的凹槽并固化从而形成压印层;
在该凹槽中形成油墨层;以及
在该油墨层上形成导电层,该导电层呈网格状且该导电层凸伸出该凹槽。
9.如权利要求8所述的透明导电膜的制备方法,其特征在于:在该凹槽中形成油墨层的步骤包括:
将油墨涂布于该压印层形成有该凹槽的表面上,将油墨填充在凹槽中;
将该凹槽外的油墨刮除,留下该凹槽内的油墨;以及
固化该凹槽中的油墨形成油墨层。
10.如权利要求9所述的透明导电膜的制备方法,其特征在于:在该油墨层上形成导电层的步骤包括:
将油墨层浸泡于含有还原剂的溶液中进行还原处理,还原该油墨层所含的金属元素;以及
在化镀液中进行化学镀,并控制浸泡化镀液的时间,使得导电金属沉积于该油墨层上从而形成导电层,且该导电层与该油墨层的厚度之和大于凹槽的深度。
11.一种触控屏,包括保护面板,其特征在于:该触控屏还包括如权利要求1~7任意一项所述的透明导电膜,该保护面板覆盖于该导电层的表面。
12.一种电子装置,包括壳体及电子元件,其特征在于:该电子装置还包括如权利要求11所述的触控屏,该触控屏安装于该壳体上,该触控屏与该壳体配合形成一容置空间,该电子元件安装于该容置空间内。
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CN105589599A (zh) * 2015-12-24 2016-05-18 无锡格菲电子薄膜科技有限公司 一种石墨烯触控传感器的制造方法
CN107072039A (zh) * 2016-12-23 2017-08-18 中国科学院深圳先进技术研究院 制备导电线路的方法
CN108319400A (zh) * 2018-03-20 2018-07-24 江西蓝沛泰和新材料有限公司 一种单层双面导电膜结构、制作工艺及触控屏
CN108829295B (zh) * 2018-06-12 2021-04-13 业成科技(成都)有限公司 触控面板
WO2020177737A1 (zh) * 2019-03-06 2020-09-10 苏州蓝沛光电科技有限公司 种子层的制备方法
CN111949153B (zh) * 2019-11-29 2022-07-26 合肥微晶材料科技有限公司 一种可解决蚀刻痕的纳米银线触控电极及其制作方法
CN111158521B (zh) * 2019-12-30 2022-03-11 合肥微晶材料科技有限公司 一种抗干扰触控感应层及基于其的触摸屏
CN113161039B (zh) * 2020-01-07 2022-12-02 苏州维业达触控科技有限公司 一种新型导电膜及其制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103235660A (zh) * 2013-04-12 2013-08-07 深圳欧菲光科技股份有限公司 双层触摸屏及其制备方法
TW201435921A (zh) * 2013-03-01 2014-09-16 Nanchang O Film Tech Co Ltd 導電玻璃基板及其製作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US8012567B2 (en) * 2006-01-12 2011-09-06 3M Innovative Properties Company Light-collimating film
EP4071785A1 (en) * 2008-02-28 2022-10-12 3M Innovative Properties Company Touch screen sensor
CN101604558A (zh) * 2009-07-23 2009-12-16 山东天诺光电材料有限公司 一种导电图形及制备方法和用途
US8941395B2 (en) * 2010-04-27 2015-01-27 3M Innovative Properties Company Integrated passive circuit elements for sensing devices
CN103408993B (zh) * 2013-03-30 2014-11-26 深圳欧菲光科技股份有限公司 导电油墨、透明导电体及其制备方法
WO2014190790A1 (zh) * 2013-05-30 2014-12-04 南昌欧菲光科技有限公司 单层多点式触控导电膜及其制备方法
TWI557622B (zh) * 2014-03-31 2016-11-11 Sensing circuit structure and manufacturing method thereof

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201435921A (zh) * 2013-03-01 2014-09-16 Nanchang O Film Tech Co Ltd 導電玻璃基板及其製作方法
CN103235660A (zh) * 2013-04-12 2013-08-07 深圳欧菲光科技股份有限公司 双层触摸屏及其制备方法

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