TWI583278B - 電子裝置、觸控屏、透明導電膜及透明導電膜之製備方法 - Google Patents
電子裝置、觸控屏、透明導電膜及透明導電膜之製備方法 Download PDFInfo
- Publication number
- TWI583278B TWI583278B TW103140328A TW103140328A TWI583278B TW I583278 B TWI583278 B TW I583278B TW 103140328 A TW103140328 A TW 103140328A TW 103140328 A TW103140328 A TW 103140328A TW I583278 B TWI583278 B TW I583278B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- groove
- ink
- conductive film
- transparent
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 22
- 239000000463 material Substances 0.000 claims description 21
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 239000003054 catalyst Substances 0.000 claims description 9
- 238000004049 embossing Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 9
- -1 polyethylene terephthalate Polymers 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 5
- 229920002530 polyetherether ketone Polymers 0.000 claims description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 5
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 5
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 150000002923 oximes Chemical class 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920002098 polyfluorene Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004634 thermosetting polymer Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 238000007790 scraping Methods 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- FVJFRFUSHCIRKP-UHFFFAOYSA-N disodium;hydrogen borate Chemical compound [Na+].[Na+].OB([O-])[O-] FVJFRFUSHCIRKP-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacture Of Switches (AREA)
- Position Input By Displaying (AREA)
Description
本發明涉及一種透明導電膜及其製備方法、應用該透明導電膜之觸控屏及電子裝置。
近年來,透明導電膜廣泛應用於觸控式螢幕、平板顯示、光伏器件、電磁遮罩等領域。中、大尺寸觸控屏上之透明導電膜越來越多的採用金屬網格,以取代傳統之ITO薄膜作為透明導電膜之導電材料。該類金屬網格為於透明基板上成型而獲得的網格狀之金屬導線。於製作金屬網格時,需利用壓印模仁於附著於基板表面之壓印材料上壓印出凹槽,並於凹槽中形成金屬導電層,而凹槽中之金屬導電層之厚度直接影響到透明導電膜之方塊電阻值大小,且透明導電膜之方塊電阻值越小越好。
鑒於上述情況,有必要提供一種透明導電膜之製備方法。另,還有必要提供一種由該方法製得之透明導電膜及應用該透明導電膜之觸控屏與電子裝置。
一種透明導電膜,包括透明之基底及塗布於該基底上表面之透明之壓印層,該壓印層上開設有相互連通之呈網格狀之凹槽,該凹
槽底部填充有一油墨層,該油墨層上形成有導電層,該導電層凸伸出該凹槽且該導電層呈網格狀。
一種製備如上所述之透明導電膜之方法,其包括如下步驟:提供一透明柔性材料作為基底;提供一透明之壓印材料,將該壓印材料塗布於基底之一表面;提供一模仁,該模仁上設置有呈網格狀之凸起,用該模仁於該壓印材料上壓印出呈網格狀之凹槽並固化從而形成壓印層;於該凹槽中形成油墨層;及於該油墨層上形成導電層,該導電層呈網格狀且該導電層凸伸出該凹槽。
一種觸控屏,包括保護面板,該觸控屏還包括如上所述之透明導電膜,該保護面板覆蓋於該導電層之表面。
一種電子裝置,包括殼體及電子組件,該電子裝置還包括如上所述之觸控屏,該觸控屏安裝於該殼體上,該觸控屏與該殼體形成一容置空間,該電子組件安裝於該容置空間內。
本發明之透明導電膜,其製作方法簡單。該導電層凸伸出該凹槽,使得該導電層之方塊電阻值減小,從而提高觸控屏之靈敏度。
100‧‧‧透明導電膜
10‧‧‧基底
30‧‧‧壓印層
31‧‧‧凹槽
50‧‧‧導電層
60‧‧‧油墨層
200‧‧‧觸控屏
201‧‧‧保護面板
300‧‧‧電子裝置
301‧‧‧殼體
圖1為本發明較佳實施方式之透明導電膜之示意圖。
圖2為圖1所示之透明導電膜之剖面圖。
圖3為本發明較佳實施方式之電子裝置之示意圖。
請參照圖1及圖2,本發明提供一種透明導電膜100,其包括柔性透明之基底10、塗布於基底10一表面之透明壓印層30及形成於壓印層30上之導電層50。壓印層30遠離基底10之表面上開設有呈網
格狀之相互連通之凹槽31。該凹槽31之寬度為0.5μm~10μm。凹槽31之底部填充有一油墨層60。該導電層50形成於油墨層60上,且該導電層50呈網格狀。該導電層50及油墨層60之厚度之和大於凹槽31深度,更具體的,該導電層50凸伸出凹槽31大致0.01μm~2μm。
基底10為透明柔性材料。該透明柔性材料可選自聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚烯烴類樹脂、乙烯基系列樹脂、聚醚醚酮(PEEK)、聚碸(PSF)、聚醚碸(PES)、聚碳酸酯(PC)、聚醯胺、聚醯亞胺、丙烯酸樹脂及三乙烯基纖維素(TAC)等其中一種。聚烯烴類樹脂可選自聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯及乙烯-醋酸乙烯共聚物(EVA)等。
乙烯基系列樹脂可選自聚氯乙烯、聚偏二氯乙烯等。該基底10之厚度為30μm~200μm。
壓印層30可由熱塑性聚合物膠、熱固性聚合物膠與紫外固化聚合物膠中之一種固化而成。該壓印層30之厚度為1μm~50μm。
導電層50之材料可選自一般導電金屬或合金,例如銅、鎳等。本實施例中,多條平行的凹槽31與多條垂直的凹槽31相互交叉形成相互連通的方形網格,而導電層50亦呈方形網格狀佈置。於其他實施例中,相互連通之凹槽31可通過不同的排佈方式構成各種形狀之網格,如六邊形網格,而導電層50亦相應的形成各種相應形狀之網格。
油墨層60由含金屬觸媒之油墨固化而成。該金屬觸媒可為含鈀、銀、鈦、銅或鋯等金屬元素中之一種或幾種。例如該含金屬觸媒之油墨可為錫鈀膠體油墨、鈀離子油墨、納米鈀金屬粒子油墨等
中之一種。該油墨中之金屬元素可被還原成金屬作為化學鍍反應之觸媒。
本發明一較佳實施方式中之透明導電膜100之製備方法,其包括如下步驟:提供一基底10,該基底10為透明柔性材料。該透明柔性材料可選自聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚烯烴類樹脂、乙烯基系列樹脂、聚醚醚酮(PEEK)、聚碸(PSF)、聚醚碸(PES)、聚碳酸酯(PC)、聚醯胺、聚醯亞胺、丙烯酸樹脂及三乙烯基纖維素(TAC)等中之一種。聚烯烴類樹脂可選自聚乙烯(PE)、聚丙烯(PP)、聚苯乙烯及乙烯-醋酸乙烯共聚物(EVA)等。乙烯基系列樹脂可選自聚氯乙烯、聚偏二氯乙烯等。該基底10之厚度為30μm~200μm。
提供一透明之壓印材料,將壓印材料塗布於基底10之一表面。該透明之壓印材料可選自熱塑性聚合物膠、熱固性聚合物膠與紫外固化聚合物膠中之一種。塗布於基底10上未固化之壓印材料之厚度為1μm~50μm。
提供一模仁,該模仁上設置有呈網格狀之凸起。凸起之寬度為0.5μm~10μm。用該模仁於透明之壓印材料遠離該基底10之表面上壓印出呈網格狀之凹槽31,並將該壓印後之壓印材料藉由烘烤或紫外光照射固化形成壓印層30。其中,該壓印層之厚度為1μm~50μm,該凹槽31之寬度為0.5μm~10μm。
提供一含有金屬觸媒之油墨,用該油墨填充至凹槽31中並固化油墨得到油墨層60。本實施例中,將油墨塗布於壓印層30形成有凹
槽31之表面上,再利用刮刀將凹槽31外之油墨刮除,僅留下凹槽31內之油墨。對凹槽31中之油墨進行烘烤或紫外光照射,從而固化形成油墨層60,得到帶有油墨層60之中間體。該金屬觸媒可為含鈀、銀、鈦、銅或鋯等金屬元素中之一種或幾種。例如該油墨可為錫鈀膠體油墨、鈀離子油墨、納米鈀金屬粒子油墨等中之一種。
將帶有油墨層60之中間體浸泡於含有還原劑之溶液中進行還原處理,使得表面之油墨層60中包括之金屬元素還原為金屬。該金屬可作為化學鍍反應之觸媒。例如,用含鈀離子之油墨形成油墨層60,將該帶有鈀離子之油墨層60浸泡於含有氫氧化鈉或硼酸氫鈉之溶液中進行還原,還原出金屬鈀。
將上述浸泡過之中間體浸泡於化鍍液中進行化學鍍,使得導電金屬沉積於油墨層60上從而形成導電層50。例如,將油墨層60表面帶有金屬鈀之中間體浸泡於含甲醛與硫酸銅之化鍍液中,還原形成金屬銅沉積於油墨層60上從而形成導電層50。另,控制浸泡化鍍液之時間以控制該導電層50凸伸出凹槽31大致0.01μm~2μm。上述方法得到之透明導電膜100除了不透明之導電層50外其餘部分均為透明,以便光線透過。
本實施例中所得到之透明導電膜100表面之導電層50大致呈長方形網格狀。於其他實施例中,相互連通之凹槽31可構成其他任意形狀,使得導電層50為其他任意形狀之網格,如六邊形網格。
請一併參閱圖2及3,一種應用上述透明導電膜100之觸控屏200,其包括透明導電膜100、覆蓋於該透明導電膜100形成有該導電層50之表面之保護面板201、電性連接於透明導電膜100之導電層50
之電極引線(圖未示)、及電性連接於該電極引線之導電線路(圖未示)。
請一併參閱圖3,一種應用所述觸控屏200之電子裝置300,其可為手機、平板電腦、電子閱讀器等任一應用觸控屏200之電子產品。該電子裝置300包括殼體301、收容於殼體301中之電子組件(圖未示)、及連接於該殼體301之觸控屏200。該觸控屏200與殼體301配合形成一容置空間,所述電子組件安裝於該容置空間內。
上述透明導電膜100,其製作方法簡單。該導電層50及油墨層60之厚度之和大於凹槽31深度,使得該導電層50之方塊電阻值減小,從而提高觸控屏200之靈敏度。
綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上該者僅為本發明之較佳實施例,舉凡熟悉本案技藝之人士,於爰依本發明精神所作之等效修飾或變化,皆應涵蓋於以下之如申請專利範圍內。
100‧‧‧透明導電膜
10‧‧‧基底
30‧‧‧壓印層
31‧‧‧凹槽
50‧‧‧導電層
60‧‧‧油墨層
Claims (12)
- 一種透明導電膜,包括透明之基底及形成於該基底上表面之透明之壓印層,其改良在於:該壓印層上開設有相互連通之呈網格狀之凹槽,該凹槽底部形成有一油墨層,該油墨層上形成有導電層,所述導電層為金屬,該導電層凸伸出該凹槽且該導電層呈網格狀。
- 如申請專利範圍第1項所述之透明導電膜,其中該導電層凸伸出該凹槽大致0.01μm~2μm。
- 如申請專利範圍第1項所述之透明導電膜,其中該基底為透明柔性材料,該透明柔性材料選自聚對苯二甲酸乙二酯、聚萘二甲酸乙二酯、聚烯烴類樹脂、乙烯基系列樹脂、聚醚醚酮、聚碸、聚醚碸、聚碳酸酯、聚醯胺、聚醯亞胺、丙烯酸樹脂及三乙烯基纖維素等中之一種,該基底之厚度為30μm~200μm。
- 如申請專利範圍第1項所述之透明導電膜,其中該壓印層由熱塑性聚合物膠、熱固性聚合物膠與紫外固化聚合物膠中之一種固化而成,該壓印層之厚度為1μm~50μm。
- 如申請專利範圍第1項所述之透明導電膜,其中該凹槽之寬度為0.5μm~10μm。
- 如申請專利範圍第1項所述之透明導電膜,其中該油墨層之材質為含金屬觸媒之油墨,該金屬觸媒為含鈀、銀、鈦、銅或鋯等金屬元素中之一種或幾種。
- 如申請專利範圍第6項所述之透明導電膜,其中該導電層係將該油墨層之金屬元素還原成金屬並進行化學鍍形成的。
- 一種製備如權利要求1至7所述之透明導電膜之方法,其包括如下步驟: 提供一透明柔性材料作為基底;提供一透明之壓印材料,將該壓印材料塗布於基底之一表面;提供一模仁,該模仁上設置有呈網格狀之凸起,用該模仁於該壓印材料上壓印出呈網格狀之凹槽並固化從而形成壓印層;於該凹槽中形成油墨層;及於該油墨層上形成導電層,所述導電層為金屬,該導電層呈網格狀且該導電層凸伸出該凹槽。
- 如申請專利範圍第8項所述之透明導電膜之製備方法,其中於該凹槽中形成油墨層之步驟包括:將油墨塗布於該壓印層形成有該凹槽之表面上,將油墨填充於凹槽中;將該凹槽外之油墨刮除,留下該凹槽內之油墨;及固化該凹槽中之油墨形成油墨層。
- 如申請專利範圍第9項所述之透明導電膜之製備方法,其中於該油墨層上形成導電層之步驟包括:將油墨層浸泡於含有還原劑之溶液中進行還原處理,還原該油墨層所含之金屬元素;及於化鍍液中進行化學鍍,並控制浸泡化鍍液之時間,使得導電金屬沉積於該油墨層上從而形成導電層,且該導電層之厚度大於凹槽之深度。
- 一種觸控屏,包括保護面板,其改良在於:該觸控屏還包括如權利要求1~7任意一項所述之透明導電膜,該保護面板覆蓋於該導電層之表面。
- 一種電子裝置,包括殼體及電子組件,其改良在於:該電子裝置還包括如權利要求11所述之觸控屏,該觸控屏安裝於該殼體上,該觸控屏與該殼體配合形成一容置空間,該電子組件安裝於該容置空間內。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410540569.7A CN104407729B (zh) | 2014-10-14 | 2014-10-14 | 电子装置、触控屏、透明导电膜及透明导电膜的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201615069A TW201615069A (en) | 2016-04-16 |
TWI583278B true TWI583278B (zh) | 2017-05-11 |
Family
ID=52645365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103140328A TWI583278B (zh) | 2014-10-14 | 2014-11-20 | 電子裝置、觸控屏、透明導電膜及透明導電膜之製備方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160103508A1 (zh) |
CN (1) | CN104407729B (zh) |
TW (1) | TWI583278B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105589599A (zh) * | 2015-12-24 | 2016-05-18 | 无锡格菲电子薄膜科技有限公司 | 一种石墨烯触控传感器的制造方法 |
CN107072039A (zh) * | 2016-12-23 | 2017-08-18 | 中国科学院深圳先进技术研究院 | 制备导电线路的方法 |
CN108319400A (zh) * | 2018-03-20 | 2018-07-24 | 江西蓝沛泰和新材料有限公司 | 一种单层双面导电膜结构、制作工艺及触控屏 |
CN108829295B (zh) * | 2018-06-12 | 2021-04-13 | 业成科技(成都)有限公司 | 触控面板 |
WO2020177737A1 (zh) * | 2019-03-06 | 2020-09-10 | 苏州蓝沛光电科技有限公司 | 种子层的制备方法 |
CN111949153B (zh) * | 2019-11-29 | 2022-07-26 | 合肥微晶材料科技有限公司 | 一种可解决蚀刻痕的纳米银线触控电极及其制作方法 |
CN111158521B (zh) * | 2019-12-30 | 2022-03-11 | 合肥微晶材料科技有限公司 | 一种抗干扰触控感应层及基于其的触摸屏 |
CN113161039B (zh) * | 2020-01-07 | 2022-12-02 | 苏州维业达触控科技有限公司 | 一种新型导电膜及其制作方法 |
JP7482240B2 (ja) * | 2021-03-12 | 2024-05-13 | 株式会社東芝 | 透明電極およびその作製方法、ならびに透明電極を用いた電子デバイス |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103235660A (zh) * | 2013-04-12 | 2013-08-07 | 深圳欧菲光科技股份有限公司 | 双层触摸屏及其制备方法 |
TW201435921A (zh) * | 2013-03-01 | 2014-09-16 | Nanchang O Film Tech Co Ltd | 導電玻璃基板及其製作方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050241951A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US8012567B2 (en) * | 2006-01-12 | 2011-09-06 | 3M Innovative Properties Company | Light-collimating film |
CN104636016B (zh) * | 2008-02-28 | 2018-12-18 | 3M创新有限公司 | 触屏传感器 |
CN101604558A (zh) * | 2009-07-23 | 2009-12-16 | 山东天诺光电材料有限公司 | 一种导电图形及制备方法和用途 |
US8941395B2 (en) * | 2010-04-27 | 2015-01-27 | 3M Innovative Properties Company | Integrated passive circuit elements for sensing devices |
CN103408993B (zh) * | 2013-03-30 | 2014-11-26 | 深圳欧菲光科技股份有限公司 | 导电油墨、透明导电体及其制备方法 |
WO2014190790A1 (zh) * | 2013-05-30 | 2014-12-04 | 南昌欧菲光科技有限公司 | 单层多点式触控导电膜及其制备方法 |
TWI557622B (zh) * | 2014-03-31 | 2016-11-11 | Sensing circuit structure and manufacturing method thereof |
-
2014
- 2014-10-14 CN CN201410540569.7A patent/CN104407729B/zh not_active Expired - Fee Related
- 2014-11-20 TW TW103140328A patent/TWI583278B/zh not_active IP Right Cessation
- 2014-11-28 US US14/555,717 patent/US20160103508A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201435921A (zh) * | 2013-03-01 | 2014-09-16 | Nanchang O Film Tech Co Ltd | 導電玻璃基板及其製作方法 |
CN103235660A (zh) * | 2013-04-12 | 2013-08-07 | 深圳欧菲光科技股份有限公司 | 双层触摸屏及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104407729B (zh) | 2018-01-09 |
CN104407729A (zh) | 2015-03-11 |
TW201615069A (en) | 2016-04-16 |
US20160103508A1 (en) | 2016-04-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI583278B (zh) | 電子裝置、觸控屏、透明導電膜及透明導電膜之製備方法 | |
TWI565831B (zh) | 電子裝置、觸控屏、透明導電膜及透明導電膜之製備方法 | |
TWI510993B (zh) | 觸摸屏感應模組及其製作方法和顯示器 | |
TWI541838B (zh) | 透明導電膜中之導電結構、透明導電膜及製作方法 | |
TWI556699B (zh) | 導電膜及其製造方法 | |
CA2826027C (en) | Patterned flexible transparent conductive sheet and manufacturing method thereof | |
CN104024994B (zh) | 带装饰触摸传感器及其制造方法、以及其使用的触摸传感器 | |
TW201438031A (zh) | 透明導電膜及其製備方法 | |
CN108848660B (zh) | 一种电磁屏蔽膜及其制作方法 | |
US20140353003A1 (en) | Touch-screen conductive film and manufacturing method thereof | |
JP2013151158A (ja) | 封止型電子装置の製造方法及び封止型電子装置 | |
KR100957487B1 (ko) | 플라스틱 전극필름 제조방법 | |
TW201622496A (zh) | 導電膜及其製備方法、應用該導電膜之觸控屏及電子裝置 | |
US20150068789A1 (en) | Multi-layer micro-wire substrate structure | |
CN104615304B (zh) | 一种高导电率低反射率金属网格的制作方法及其制品 | |
CN203179571U (zh) | 透明导电膜 | |
CN107148701A (zh) | 电子产品及制造电子产品的方法 | |
CN203038679U (zh) | 透明导电膜中的导电结构、透明导电膜 | |
CN103889159A (zh) | 一种填埋式导电线路制备工艺 | |
CN203178965U (zh) | 触摸屏盖板 | |
CN210519207U (zh) | 电子设备及其盖板 | |
CN114222460A (zh) | 电子设备外框及制备方法、中框以及电子设备 | |
CN106659107B (zh) | 一种纳米压印屏蔽玻璃及其制作方法 | |
CN104319211A (zh) | 电极板的制造方法 | |
WO2014071669A1 (zh) | 透明导电体及其制备方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |