JP2013147707A5 - - Google Patents

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Publication number
JP2013147707A5
JP2013147707A5 JP2012009423A JP2012009423A JP2013147707A5 JP 2013147707 A5 JP2013147707 A5 JP 2013147707A5 JP 2012009423 A JP2012009423 A JP 2012009423A JP 2012009423 A JP2012009423 A JP 2012009423A JP 2013147707 A5 JP2013147707 A5 JP 2013147707A5
Authority
JP
Japan
Prior art keywords
electrolytic plating
resin
plated product
primer composition
poly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012009423A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013147707A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012009423A priority Critical patent/JP2013147707A/ja
Priority claimed from JP2012009423A external-priority patent/JP2013147707A/ja
Priority to PCT/JP2013/050378 priority patent/WO2013108713A1/ja
Priority to TW102101451A priority patent/TW201339376A/zh
Publication of JP2013147707A publication Critical patent/JP2013147707A/ja
Publication of JP2013147707A5 publication Critical patent/JP2013147707A5/ja
Pending legal-status Critical Current

Links

JP2012009423A 2012-01-19 2012-01-19 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物 Pending JP2013147707A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012009423A JP2013147707A (ja) 2012-01-19 2012-01-19 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物
PCT/JP2013/050378 WO2013108713A1 (ja) 2012-01-19 2013-01-11 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物
TW102101451A TW201339376A (zh) 2012-01-19 2013-01-15 電鍍用底漆組成物、鍍敷物之製造方法及鍍敷物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012009423A JP2013147707A (ja) 2012-01-19 2012-01-19 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物

Publications (2)

Publication Number Publication Date
JP2013147707A JP2013147707A (ja) 2013-08-01
JP2013147707A5 true JP2013147707A5 (OSRAM) 2015-02-26

Family

ID=48799139

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012009423A Pending JP2013147707A (ja) 2012-01-19 2012-01-19 電解メッキ用プライマー組成物、メッキ物の製造方法及びメッキ物

Country Status (3)

Country Link
JP (1) JP2013147707A (OSRAM)
TW (1) TW201339376A (OSRAM)
WO (1) WO2013108713A1 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6346183B2 (ja) * 2013-08-02 2018-06-20 株式会社トクヤマ 光学物品用光硬化性プライマー組成物の硬化体を含むフォトクロミック積層体及び該積層体の製造方法
JP6607832B2 (ja) * 2016-08-05 2019-11-20 信越ポリマー株式会社 導電性高分子分散液及びその製造方法、並びに導電性フィルム及びその製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2575672B2 (ja) * 1986-11-14 1997-01-29 清蔵 宮田 非導電性物質のメツキ法
DE59010247D1 (de) * 1990-02-08 1996-05-02 Bayer Ag Neue Polythiophen-Dispersionen, ihre Herstellung und ihre Verwendung
DE4227836C2 (de) * 1992-08-20 1997-09-25 Atotech Deutschland Gmbh Verfahren zur Metallisierung von Nichtleitern
JPH0681190A (ja) * 1992-09-02 1994-03-22 Bridgestone Corp 絶縁体のめっき方法
JP4010657B2 (ja) * 1997-07-18 2007-11-21 富士フイルム株式会社 金属化材料の製造方法
DE10058116A1 (de) * 2000-11-22 2002-05-23 Bayer Ag Polythiophene
KR20030053529A (ko) * 2000-11-22 2003-06-28 바이엘 악티엔게젤샤프트 분산성 중합체 분말
JP5181231B2 (ja) * 2007-01-12 2013-04-10 アキレス株式会社 めっき物及びその製造方法
CN101970720B (zh) * 2008-03-13 2014-10-15 巴斯夫欧洲公司 施加金属层至基质的方法和分散体及可金属化热塑性模塑组合物
JP2011153372A (ja) * 2010-01-04 2011-08-11 Daiso Co Ltd 金属多層積層電気絶縁体とその製造方法

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