WO2014106503A3 - Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial - Google Patents

Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial Download PDF

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Publication number
WO2014106503A3
WO2014106503A3 PCT/DE2013/100412 DE2013100412W WO2014106503A3 WO 2014106503 A3 WO2014106503 A3 WO 2014106503A3 DE 2013100412 W DE2013100412 W DE 2013100412W WO 2014106503 A3 WO2014106503 A3 WO 2014106503A3
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WIPO (PCT)
Prior art keywords
substrate material
additive
electrically conductive
conductive structure
producing
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PCT/DE2013/100412
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English (en)
French (fr)
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WO2014106503A2 (de
Inventor
Robin Alexander KRÜGER
Bernd Rösener
Wolfgang John
Arne Schnoor
Roman Ostholt
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Lpkf Laser & Electronics Ag
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Application filed by Lpkf Laser & Electronics Ag filed Critical Lpkf Laser & Electronics Ag
Priority to EP13836252.0A priority Critical patent/EP2912210A2/de
Priority to CN201380069097.5A priority patent/CN104884670A/zh
Priority to US14/655,056 priority patent/US20160002791A1/en
Priority to KR1020157018645A priority patent/KR20150095834A/ko
Priority to JP2015551125A priority patent/JP2016507650A/ja
Publication of WO2014106503A2 publication Critical patent/WO2014106503A2/de
Publication of WO2014106503A3 publication Critical patent/WO2014106503A3/de

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    • C—CHEMISTRY; METALLURGY
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1868—Radiation, e.g. UV, laser
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    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
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    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/1601—Process or apparatus
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    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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    • C23C18/1601—Process or apparatus
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    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
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Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung einer elektrisch leitfähigen Struktur, insbesondere einer Leiterbahn, auf einem nichtleitenden Trägermaterial, welches ein Additiv (1) mit zumindest einer Metallverbindung enthält. Das Trägermaterial wird hierzu mittels eines Lasers bestrahlt, um so die in dem Additiv (1) enthaltenen, beispielsweise anorganischen Metallverbindungen selektiv zu aktivieren. Die durch die Aktivierung gebildeten Metallkeime werden anschließend metallisiert, um so die elektrisch leitfähige Struktur auf dem Trägermaterial zu schaffen. Indem das Additiv (1) vor dem Einbringen in das Trägermaterial mit einer insbesondere vollflächigen Beschichtung versehen wird, sodass durch die Laseraktivierung das Additiv (1) reduziert wird und die Beschichtung oxidiert wird, werden die für die erforderliche chemische Reaktion mit dem Additiv (1) notwendigen Reaktionspartner durch die Beschichtung bereitgestellt. Aufgrund der dadurch wesentlich reduzierten Wechselwirkung mit dem Trägermaterial entfällt zugleich auch die Limitierung auf bestimmte Kunststoffe bzw. Kunststoffgruppen.
PCT/DE2013/100412 2013-01-02 2013-12-06 Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial WO2014106503A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP13836252.0A EP2912210A2 (de) 2013-01-02 2013-12-06 Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial
CN201380069097.5A CN104884670A (zh) 2013-01-02 2013-12-06 在非导电性的基底材料上制造导电结构的方法以及用于此的特定添加物和基底材料
US14/655,056 US20160002791A1 (en) 2013-01-02 2013-12-06 Method for producing an electrically conductive structure on a non-conductive substrate material, and additive and substrate material intended therefor
KR1020157018645A KR20150095834A (ko) 2013-01-02 2013-12-06 비전도성 기판재료 상에 전기 전도성 구조를 제조하기 위한 방법, 및 이를 위한 소정 첨가제와 기판재료
JP2015551125A JP2016507650A (ja) 2013-01-02 2013-12-06 非導電性基板材料上に導電性構造体を製造する方法並びにそのための特定の添加剤及び基板材料

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CN106862564B (zh) * 2017-01-12 2019-11-12 南京航空航天大学 基于激光选区烧结技术的结构电路一体化部件的制作方法
DE102019133955B4 (de) * 2019-12-11 2021-08-19 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Herstellung einer Verbundstruktur aus mindestens einer leitfähigen Struktur
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US20160002791A1 (en) 2016-01-07
WO2014106503A2 (de) 2014-07-10
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CN104884670A (zh) 2015-09-02
KR20150095834A (ko) 2015-08-21
EP2912210A2 (de) 2015-09-02

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