WO2014106503A3 - Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial - Google Patents

Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial Download PDF

Info

Publication number
WO2014106503A3
WO2014106503A3 PCT/DE2013/100412 DE2013100412W WO2014106503A3 WO 2014106503 A3 WO2014106503 A3 WO 2014106503A3 DE 2013100412 W DE2013100412 W DE 2013100412W WO 2014106503 A3 WO2014106503 A3 WO 2014106503A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate material
additive
electrically conductive
conductive structure
producing
Prior art date
Application number
PCT/DE2013/100412
Other languages
English (en)
French (fr)
Other versions
WO2014106503A2 (de
Inventor
Robin Alexander KRÜGER
Bernd Rösener
Wolfgang John
Arne Schnoor
Roman Ostholt
Original Assignee
Lpkf Laser & Electronics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lpkf Laser & Electronics Ag filed Critical Lpkf Laser & Electronics Ag
Priority to EP13836252.0A priority Critical patent/EP2912210A2/de
Priority to JP2015551125A priority patent/JP2016507650A/ja
Priority to CN201380069097.5A priority patent/CN104884670A/zh
Priority to US14/655,056 priority patent/US20160002791A1/en
Priority to KR1020157018645A priority patent/KR20150095834A/ko
Publication of WO2014106503A2 publication Critical patent/WO2014106503A2/de
Publication of WO2014106503A3 publication Critical patent/WO2014106503A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1868—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1642—Substrates other than metallic, e.g. inorganic or organic or non-conductive semiconductor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
    • C23C18/204—Radiation, e.g. UV, laser
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/04—Homopolymers or copolymers of ethene
    • C08J2323/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2323/10—Homopolymers or copolymers of propene
    • C08J2323/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2467/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2467/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2467/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08J2467/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2248—Oxides; Hydroxides of metals of copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung einer elektrisch leitfähigen Struktur, insbesondere einer Leiterbahn, auf einem nichtleitenden Trägermaterial, welches ein Additiv (1) mit zumindest einer Metallverbindung enthält. Das Trägermaterial wird hierzu mittels eines Lasers bestrahlt, um so die in dem Additiv (1) enthaltenen, beispielsweise anorganischen Metallverbindungen selektiv zu aktivieren. Die durch die Aktivierung gebildeten Metallkeime werden anschließend metallisiert, um so die elektrisch leitfähige Struktur auf dem Trägermaterial zu schaffen. Indem das Additiv (1) vor dem Einbringen in das Trägermaterial mit einer insbesondere vollflächigen Beschichtung versehen wird, sodass durch die Laseraktivierung das Additiv (1) reduziert wird und die Beschichtung oxidiert wird, werden die für die erforderliche chemische Reaktion mit dem Additiv (1) notwendigen Reaktionspartner durch die Beschichtung bereitgestellt. Aufgrund der dadurch wesentlich reduzierten Wechselwirkung mit dem Trägermaterial entfällt zugleich auch die Limitierung auf bestimmte Kunststoffe bzw. Kunststoffgruppen.
PCT/DE2013/100412 2013-01-02 2013-12-06 Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial WO2014106503A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP13836252.0A EP2912210A2 (de) 2013-01-02 2013-12-06 Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial
JP2015551125A JP2016507650A (ja) 2013-01-02 2013-12-06 非導電性基板材料上に導電性構造体を製造する方法並びにそのための特定の添加剤及び基板材料
CN201380069097.5A CN104884670A (zh) 2013-01-02 2013-12-06 在非导电性的基底材料上制造导电结构的方法以及用于此的特定添加物和基底材料
US14/655,056 US20160002791A1 (en) 2013-01-02 2013-12-06 Method for producing an electrically conductive structure on a non-conductive substrate material, and additive and substrate material intended therefor
KR1020157018645A KR20150095834A (ko) 2013-01-02 2013-12-06 비전도성 기판재료 상에 전기 전도성 구조를 제조하기 위한 방법, 및 이를 위한 소정 첨가제와 기판재료

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013100016.9 2013-01-02
DE102013100016.9A DE102013100016A1 (de) 2013-01-02 2013-01-02 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einem nichtleitenden Trägermaterial sowie ein hierzu bestimmtes Additiv und Trägermaterial

Publications (2)

Publication Number Publication Date
WO2014106503A2 WO2014106503A2 (de) 2014-07-10
WO2014106503A3 true WO2014106503A3 (de) 2014-10-30

Family

ID=50276878

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2013/100412 WO2014106503A2 (de) 2013-01-02 2013-12-06 Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial

Country Status (7)

Country Link
US (1) US20160002791A1 (de)
EP (1) EP2912210A2 (de)
JP (1) JP2016507650A (de)
KR (1) KR20150095834A (de)
CN (1) CN104884670A (de)
DE (1) DE102013100016A1 (de)
WO (1) WO2014106503A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014114987A1 (de) * 2014-10-15 2016-04-21 Lpkf Laser & Electronics Ag Verfahren zur Herstellung einer elektrisch leitfähigen Struktur sowie ein mit diesem Verfahren hergestelltes Trägermaterial
CN109790361B (zh) 2016-09-26 2021-10-01 东丽株式会社 液晶性聚酯树脂组合物、成型品及成型品的制造方法
CN106862564B (zh) * 2017-01-12 2019-11-12 南京航空航天大学 基于激光选区烧结技术的结构电路一体化部件的制作方法
DE102019133955B4 (de) 2019-12-11 2021-08-19 Lpkf Laser & Electronics Aktiengesellschaft Verfahren zur Herstellung einer Verbundstruktur aus mindestens einer leitfähigen Struktur
CN114069196A (zh) * 2020-07-30 2022-02-18 Oppo广东移动通信有限公司 壳体组件及其制备方法、天线组件和电子设备
CN112420300A (zh) * 2020-11-11 2021-02-26 昆山丰景拓电子有限公司 一种新型电阻及其制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050069689A1 (en) * 2003-09-24 2005-03-31 Holger Kliesch Multilayer, oriented film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester, for the production of selectively metallized films
US20080015320A1 (en) * 2005-06-15 2008-01-17 Yueh-Ling Lee Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
US20120276390A1 (en) * 2010-10-26 2012-11-01 Sabic Innovative Plastics Ip B.V. Laser direct structuring materials with all color capability
US20120329933A1 (en) * 2009-12-21 2012-12-27 Bernardus Antonius Gerardus Schrauwen Aromatic polycarbonate composition
WO2013141157A1 (ja) * 2012-03-23 2013-09-26 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132092A1 (de) * 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
DE102004021747A1 (de) * 2004-04-30 2005-11-17 Kickelhain, Jörg, Dr. Leiterbahnstrukturen
FR2944982B1 (fr) * 2009-04-30 2011-10-14 Commissariat Energie Atomique Procede de preparation d'un substrat metallise,ledit substrat et ses utilisations
JP2013544296A (ja) * 2010-10-25 2013-12-12 サビック・イノベーティブ・プラスチックス・アイピー・ベスローテン・フェンノートシャップ レーザダイレクトストラクチャリング材料の改善された無電解メッキ性能
JP5437539B2 (ja) * 2011-03-18 2014-03-12 ミツビシ ケミカル ヨーロッパ ゲーエムベーハー 回路基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050069689A1 (en) * 2003-09-24 2005-03-31 Holger Kliesch Multilayer, oriented film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester, for the production of selectively metallized films
US20080015320A1 (en) * 2005-06-15 2008-01-17 Yueh-Ling Lee Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto
US20120329933A1 (en) * 2009-12-21 2012-12-27 Bernardus Antonius Gerardus Schrauwen Aromatic polycarbonate composition
US20120276390A1 (en) * 2010-10-26 2012-11-01 Sabic Innovative Plastics Ip B.V. Laser direct structuring materials with all color capability
WO2013141157A1 (ja) * 2012-03-23 2013-09-26 三菱エンジニアリングプラスチックス株式会社 熱可塑性樹脂組成物、樹脂成形品、及びメッキ層付樹脂成形品の製造方法
EP2711399A1 (de) * 2012-03-23 2014-03-26 Mitsubishi Engineering-Plastics Corporation Wärmehärtende harzzusammensetzung, harzformprodukt und verfahren zur herstellung eines harzformprodukts mit einer plattierungsschicht

Also Published As

Publication number Publication date
DE102013100016A1 (de) 2014-07-03
WO2014106503A2 (de) 2014-07-10
US20160002791A1 (en) 2016-01-07
CN104884670A (zh) 2015-09-02
EP2912210A2 (de) 2015-09-02
JP2016507650A (ja) 2016-03-10
KR20150095834A (ko) 2015-08-21

Similar Documents

Publication Publication Date Title
WO2014106503A3 (de) Verfahren zur herstellung einer elektrisch leitfähigen struktur auf einem nichtleitenden trägermaterial sowie ein hierzu bestimmtes additiv und trägermaterial
WO2016133571A3 (en) Laser induced graphene hybrid materials for electronic devices
MX2019011516A (es) Método para producir estructuras eléctricamente conductoras en un material portador.
SG10201903484XA (en) Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
WO2012094436A3 (en) Electronic components on paper-based substrates
WO2013036044A3 (ko) 유기 발광 소자 재료 및 이를 이용한 유기 발광 소자
MX2016014785A (es) Disposicion de circuitos para automoviles y uso de una disposicion de circuitos.
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
MY180111A (en) Surface excitation ranging system for sagd application
EP2586893A3 (de) Kupferplattierbad und -verfahren
IN2014DN05725A (de)
SG10201808518RA (en) Bonding electronic components to patterned nanowire transparent conductors
WO2016146323A3 (de) Chipanordnung und verfahren zur ausbildung einer kontaktverbindung
WO2013156162A3 (de) Elektrische heizvorrichtung, bauelement sowie verfahren zu deren herstellung
EP3521925A4 (de) Lichtempfindliche harzzusammensetzung, verfahren zur herstellung eines elektrisch leitfähigen musters, substrat, berührungsbildschirm und anzeige
GB201204670D0 (en) Optoelectronic device
MX2015008414A (es) Portador de componentes.
WO2011057619A3 (de) Verfahren zur herstellung eines kraftfahrzeugtürschlosses und zugehöriges kraftfahrzeugtürschloss
WO2013139470A3 (de) Substrat für einen portablen datenträger
MX2015008415A (es) Portador de componentes para componentes electricos/electronicos.
WO2007136619A3 (en) Solution processible materials and their use in electronic devices
MY195558A (en) Method Of Manufacturing Circuit Boards
WO2017191194A3 (de) Verfahren zum herstellen eines organischen optoelektronischen bauelements und organisches optoelektronisches bauelement
WO2017066338A8 (en) Process of producing electronic component and an electronic component
GB201211278D0 (en) Memristor and method of manufacture thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13836252

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2013836252

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 14655056

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2015551125

Country of ref document: JP

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 20157018645

Country of ref document: KR

Kind code of ref document: A