JP2013146179A - Electric power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus which achieves high cooling effect with a simple and small structure.SOLUTION: An electric power conversion apparatus 1 includes at least one of a filter capacitor 5, a smoothing capacitor 8, and a snubber capacitor 9 and a semiconductor element 7. The capacitor is formed by a capacitor module having capacitor cells 13, 13a, 13b, 13c and a capacitor case 15. One of or both of a P bus bar 11 and an N bus bar 12, which are connected with the capacitor cells 13, 13a, 13b, 13c, extend, and protrude to the exterior of the capacitor case 15, contact with an internal surface of the capacitor case 15 through an insulation material 16.

Description

  The present invention relates to a power conversion device including a capacitor module having an effective cooling mechanism.

  Power conversion devices such as DC-DC converters and inverters include components that generate heat at high temperatures, such as semiconductor elements, filter capacitors, smoothing capacitors, and snubber capacitors. Various means have been proposed as means for cooling these heated parts.

  For example, Patent Document 1 discloses that heat generated in a capacitor is generated by joining a cooling pipe to a sealing conductor at both ends of a capacitor element or a conductor plate or an electrode plate joined to the sealing conductor and flowing a cooling liquid. The cooling means comprised so that it might guide | induced directly to a cooling pipe by heat conduction from the metal foil used as the thermal radiation path | route is disclosed. According to this technique, a higher cooling efficiency can be obtained compared to the conventional technique in which cooling is performed by heat transfer via air or insulating oil in the capacitor.

  Further, Patent Document 2 discloses that the heat generated by the power semiconductor is transmitted to the surrounding elements through the power transmission bus bar, and the path length through which the heat is transmitted along the longitudinal direction of the bus bar is increased by meandering the bus bar. Thus, a technique for improving the cooling effect is disclosed.

JP 2001-230145 A JP 2005-166983 A

  However, the technique of Patent Document 1 has a problem that it is necessary to join a cooling pipe to the electrode of the capacitor, the structure becomes complicated, and it is difficult to reduce the size and weight. Further, in the technique of Patent Document 2, since the distance between the power semiconductor and the components connected to the power semiconductor is not the shortest but necessary to some extent, the volume of the device is increased, and the electrical resistance and the wiring inductance are increased. The problem arises that performance decreases.

  This invention is made | formed in view of the problem mentioned above, and aims at providing the power converter device which can acquire the high cooling effect with a simple and small structure.

  In order to achieve the above-mentioned object, the invention according to claim 1 includes at least one of a filter capacitor (5), a smoothing capacitor (8) and a snubber capacitor (9), and a semiconductor element (7a, 7b). ) Etc., in the power converter (1), the capacitor includes a capacitor case (15, 21) and one or a plurality of capacitor cells (13, 13a, 13b, 13c) housed therein. P bus bar connected to the capacitor cells (13, 13a, 13b, 13c), extended, protruded to the outside of the capacitor case (15, 21) and connected to the semiconductor elements (7a, 7b), etc. 11) One or both of the N bus bars (12, 12a) are in contact with the inner surface of the capacitor case (15, 21) via an insulating material (16). It is characterized by that.

  According to this configuration, the cooling means can be configured easily, and the calorific value of the capacitor cell is easily conducted to the capacitor case and dissipated from the outer surface of the capacitor case, so that the capacitor cell is effectively cooled. Excellent effect. In addition, the amount of heat that enters the capacitor case by conducting heat through the reactor or the semiconductor device bus bar is easily conducted from the bus bar to the capacitor case and dissipated from the outer surface of the capacitor case, so it does not reach the capacitor cell. The capacitor cell can be protected.

FIG. 3 is a cross-sectional side view taken along the line II of FIG. 2 showing the capacitor of one embodiment of the present invention. It is a front view which shows the capacitor | condenser of one Embodiment of this invention. It is a bottom view which shows the capacitor | condenser of one Embodiment of this invention. It is IV-IV side surface sectional drawing of FIG. 5 which shows the capacitor | condenser of other embodiment of this invention. It is a front view which shows the capacitor | condenser of other embodiment of this invention. It is a bottom view which shows the capacitor | condenser of other embodiment of this invention. It is a VII-VII side surface sectional view of Drawing 8 showing modification (1) of a capacitor of other embodiments of the present invention. It is a front view which shows the deformation | transformation aspect (1) of the capacitor | condenser of other embodiment of this invention. It is a bottom view which shows the deformation | transformation aspect (1) of the capacitor | condenser of other embodiment of this invention. It is a front view which shows the deformation | transformation aspect (2, 3) of the capacitor | condenser of other embodiment of this invention. It is XI-XI side surface sectional drawing of FIG. 10 which shows the deformation | transformation aspect (2) of the capacitor | condenser of other embodiment of this invention. It is XI-XI side surface sectional drawing of FIG. 10 which shows the deformation | transformation aspect (3) of the capacitor | condenser of other embodiment of this invention. It is XIII-XIII side sectional drawing of FIG. 14 which shows the deformation | transformation aspect (4) of the capacitor | condenser of one Embodiment of this invention. It is a front view which shows the deformation | transformation aspect (4) of the capacitor | condenser of one Embodiment of this invention. It is a bottom view which shows the deformation | transformation aspect (4) of the capacitor | condenser of one Embodiment of this invention. It is side surface sectional drawing which shows the aspect of the capacitor | condenser of one Embodiment of this invention. It is front sectional drawing which shows the aspect of the capacitor | condenser of one Embodiment of this invention. It is side surface sectional drawing which shows the other deformation | transformation aspect (5) of the capacitor | condenser of one Embodiment of this invention. It is front sectional drawing which shows the other deformation | transformation aspect (5) of the capacitor | condenser of one Embodiment of this invention. FIG. 22 is a side cross-sectional view taken along the line XX-XX of FIG. 21 showing another modification (6) of the capacitor of one embodiment of the present invention. It is a front view which shows the other deformation | transformation aspect (6) of the capacitor | condenser of one Embodiment of this invention. It is a bottom view which shows the other deformation | transformation aspect (6) of the capacitor | condenser of one Embodiment of this invention. It is a schematic sectional drawing which shows the capacitor | condenser of one Embodiment of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic sectional drawing which shows the capacitor | condenser of one Embodiment of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic sectional drawing which shows the capacitor | condenser of the deformation | transformation aspect (7) of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic sectional drawing which shows the capacitor | condenser of the deformation | transformation aspect (8) of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic sectional drawing which shows the capacitor | condenser of the deformation | transformation aspect (9) of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic sectional drawing which shows the capacitor | condenser of the deformation | transformation aspect (10) of this invention with the semiconductor element etc. which were attached to the cooler. It is a schematic circuit diagram which shows the outline | summary of the power converter device which implements this invention by a circuit example. It is a graph which shows the simulation result of embodiment shown in FIG. 4 thru | or FIG.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, in all the drawings in this specification, parts corresponding to each other or parts having the same function are denoted by the same reference numerals, and description of the overlapping parts will be omitted as appropriate.

  The schematic circuit diagram shown in FIG. 29 shows a form in which a DC-DC converter 2 and an inverter 3 as a power conversion apparatus for carrying out the present invention are connected in series. The DC-DC converter 2 and the inverter 3 are respectively connected. Of course, it can be used alone.

  The DC-DC converter 2 includes a filter capacitor 5 that smoothes the voltage of the DC power supply 4, a semiconductor element 7a that boosts the voltage of the DC power supply 4 by switching the current of the reactor 6, and a smoothing capacitor that smoothes the chopped current. 8.

  The inverter 3 converts the DC power output from the DC-DC converter 2 into three-phase AC power by switching with six semiconductor elements 7b connected in series for each of the three phases. The smoothing capacitor 8 bypasses the ripple current generated by the switching of the semiconductor element 7b to generate a good alternating current, and is also shared with the DC-DC converter 2. The snubber capacitor 9 absorbs noise generated by switching of the semiconductor element 7b and prevents damage to the semiconductor element 7b and surrounding electronic components or electromagnetic interference.

  The filter capacitor 5, the smoothing capacitor 8, and the snubber capacitor 9 all generate heat due to a large energizing current and become high temperature. The cooling structure of the capacitor that has reached a high temperature will be described with reference to FIGS.

  As shown in FIGS. 1 to 27, the capacitor is composed of a capacitor case 15 which is a rectangular box made of aluminum or the like having good thermal conductivity, and a capacitor 14 inserted from one opening surface of the capacitor case 15 with a filler 14. It is composed of one or a plurality of capacitor cells 13, 13 a, 13 b, 13 c as a capacitor body that is fixed away from the inner surface of the case 15. 4 to 12 show an example in which three capacitor cells 13a, 13b, and 13c are accommodated in one capacitor case 15. FIG. A P bus bar 11 is fixedly connected to one end face of each of the capacitor cells 13, 13a, 13b, 13c. The N bus bar 12 is fixedly connected to the other end faces of the capacitor cells 13, 13a, 13b, 13c. The P bus bar 11 and the N bus bar 12 extend through the opening 24 provided on the front surface, which is a surface facing the opening surface of the capacitor case 15, and extend outward from the capacitor case 15. The opening 24 may be disposed at the front end portion of the capacitor case 15 as shown in FIGS. 1 to 3 or at the front center portion of the capacitor case 15 as shown in FIGS. (Deformation mode (4)). As shown in FIGS. 23 to 28, the P bus bar 11 and the N bus bar 12 are connected to heat generating components such as the semiconductor elements 7a and 7b and the reactor 6. The semiconductor elements 7a and 7b are attached to the cooler 18 and cooled. The reactor 6 may not be attached to the cooler.

  As shown in FIGS. 1 to 28, one or both of the P bus bar 11 and the N bus bar 12 are in contact with the inner surface of the capacitor case 15 via an insulating material 16 made of a synthetic resin sheet or the like. The part where one or both of the P bus bar 11 and the N bus bar 12 are in contact with the inner surface of the capacitor case 15 via the insulating material 16 is the capacitor cell 13 of either one or both of the P bus bar 11 and the N bus bar 12, It includes both the part extended from 13a, 13b, 13c and the part connected to one or both of the capacitor cells 13, 13a, 13b, 13c of the P bus bar 11 and the N bus bar 12.

  As shown in FIGS. 19, 21, and 22, the portion that contacts the inner surface of one or both of the P bus bar 11 and the N bus bar 12 via the insulating material 16 is the inside of the capacitor case 15. The width of the P bus bar 11 and the N bus bar 12 that do not come into contact with the inner surface of the capacitor case 15 is maximized with all inner surfaces of the surface where the other bus bar does not exist as a maximum. That is, as shown in FIG. 19, the portion of the N bus bar 12 that contacts the front inner surface of the capacitor case 15 via the insulating material 16 can be understood from FIG. 17 showing the original width of the N bus bar 12. The N bus bar 12a is expanded to substantially the entire front inner surface 15 (deformation mode (5)). Further, as shown in FIGS. 21 and 22, the N bus bar 12 connected to the lower end surface of the capacitor cell 13 extends to substantially the entire lower inner surface of the capacitor case 15, and both end portions thereof are left and right of the capacitor case 15. It stands up to almost the entire surface of both sides and is expanded. Further, the P bus bar 11 connected to the upper inner surface of the capacitor cell 13 is extended to substantially the entire upper inner surface of the capacitor case 15. 20 to 22 show that one of the P bus bar 11 and the N bus bar 12 is in contact with the upper and lower inner surfaces and the front inner surface of the capacitor case 15 via the insulating material 16 (see FIG. 20). Modification (6)).

  7 to 9 show a modification (1) to the configuration shown in FIGS. 4 to 6. The P bus bar 11 connected to one end face of each of the capacitor cells 13a, 13b, 13c is integrally connected to one end side of the capacitor cells 13a, 13b, 13c to form a rectangle. The N bus bar 12 connected to the other end face of each of the capacitor cells 13a, 13b, 13c is integrally connected to the other end side of the capacitor cells 13a, 13b, 13c to form a rectangle. Thus, the heat conductive plate 26 is provided in the rectangular portion formed by the P bus bar 11 and the N bus bar 12. The heat conductive plate 26 is formed by causing a cut portion from a cut 25 provided in a rectangular portion of the P bus bar 11 and the N bus bar 12, and standing up in a gap where the capacitor cells 13a, 13b, and 13c face each other. . The heat conductive plate 26 is preferably provided on both the P bus bar 11 and the N bus bar 12, but may be provided only on one of the P bus bar 11 or the N bus bar 12. The heat conduction plate 26 is provided between the capacitor cells 13a, 13b, and 13c where heat generation is likely to be accumulated. The heat conduction plate 26 effectively conducts heat in the space to the P bus bar 11 and the N bus bar 12, thereby improving the cooling effect. To contribute.

  10 and 11 show a modified mode (2) with respect to the configuration shown in FIGS. The N bus bar 12 extends through the opening 24 provided on the front surface, which is the surface facing the opening surface of the capacitor case 15, and extends to the outside of the capacitor case 15, and the capacitor cells 13a, 13b, and 13c, respectively. A rectangular portion formed integrally connected to the other end surface of the capacitor, and a portion connecting the two and contacting the front inner surface of the capacitor case 15 via the insulating material 16. On both sides of the portion in contact with the front inner surface of the capacitor case 15 via the insulating material 16, extending portions 12b to 12g that are bent and extended along the outer surfaces of the capacitor cells 13a, 13b, and 13c are provided. ing. Since the extension part 12b and the extension part 12g are for the capacitor cells 13a and 13c at both ends, the extension part 12b and the extension part 12g are extended to reach the vicinity of the upper and lower inner surfaces of the capacitor case 15. On the other hand, the extending portion 12c and the extending portion 12d are shaped so as to be cut out from a single plate for the capacitor cell 13a and the capacitor cell 13b, respectively. Further, the extending portion 12e and the extending portion 12f are shaped so that each can be cut out from a single plate for the capacitor cell 13b and the capacitor cell 13c. The extending portion can be formed in an arbitrary shape as long as it is a shape that can be cut out from a single plate even if adjacent extending portions are alternately arranged. Further, in this modification (2), the P bus bar 11 is on one side of the capacitor cells 13a, 13b, 13c, and the N bus bar 12 provided on the other side of the capacitor cells 13a, 13b, 13c is extended to 12g to 12g. However, the N bus bar is provided on one side of the capacitor cells 13a, 13b, and 13c, and the extension portion is provided on the P bus bar 11 provided on the other side of the capacitor cells 13a, 13b, and 13c. There may be. Further, as shown in FIGS. 13 to 15, the P bus bar 11 and the N bus bar 12 are provided so as to protrude from the opening portion 24 provided in the central portion of the front surface facing the opening surface of the capacitor case 15. You may make it provide the expansion | extension part in both 11 and the N bus-bar 12. FIG. Moreover, although this deformation | transformation aspect (2) demonstrated the case where it has the three capacitor | condenser cells 13a, 13b, 13c, it is applicable even when it has a single capacitor | condenser cell.

  10 and 12 show a modification (3) to the configuration shown in FIGS. The extending portions 12b to 12g are the same as those of the modification (2) shown in FIGS. Therefore, the application range and conditions of the modification mode (3) are the same as those of the modification mode (2). The capacitor case 15 has a protruding portion 27 that is processed in accordance with the shape of the back side of the extending portions 12b to 12g including one or both of the P bus bar 11 and the N bus bar 12. The protrusion 27 is formed by cutting the thick surface of the capacitor case 15 provided with the protrusion 27 or attaching only a separately prepared protrusion to the surface of the flat capacitor case 15. An insulating material 16 is interposed between the protruding portion 27 and the extending portions 12b to 12g. In this way, the calorific value of the capacitor cells 13a, 13b, 13c is easily conducted to the extension portions 12b-12g provided near the outer periphery of the capacitor cells 13a, 13b, 13c, and the protruding portion 27 that contacts through the insulating material 16 is provided. To the capacitor case 15 more easily, so that cooling is performed very effectively.

  FIG. 25 shows a modification (7) to the configuration shown in FIGS. The capacitor case 15 in FIG. 25 is installed in a cooler 19 to which the semiconductor elements 7a and 7b or the reactor 6 are attached and cooled. In addition, the cooler which attaches the capacitor | condenser case 15 may be the cooler for exclusive use of the capacitor | condenser case 15 prepared independently instead of the cooler 19, and the cooling system may be either air cooling or water cooling. By configuring in this way, the cooling effect can be further enhanced.

  FIG. 26 shows a modification (8) to the configuration shown in FIGS. The capacitor case 15 in FIG. 26 includes fins 20 on the outer surface thereof. The position where the fin 20 is provided is that either one or both of the P bus bar 11 and the N bus bar 12 is on the outer surface of the capacitor case 15 corresponding to the inner surface of the capacitor case 15 in contact with the insulating material 16. Although it is preferable in terms of enhancing the cooling effect, the position may be other than that.

  FIG. 27 shows a modification (9) to the configuration shown in FIGS. In FIG. 27, the plate thickness T of one surface of the capacitor case 21 where one or both of the P bus bar 11 and the N bus bar 12 are in contact with each other through the insulating material 16 is a surface where neither the P bus bar 11 nor the N bus bar 12 is in contact. It is formed to be larger than the plate thickness. By comprising in this way, the heat capacity of the part which requires cooling can increase, and the cooling effect can be heightened.

  FIG. 28 shows a modification (10) to the configuration shown in FIGS. In FIG. 28, the surface of the capacitor case where one or both of the P bus bar 11 and the N bus bar 12 are in contact with each other through the insulating material 16 is formed of a heat conductive member 23, and both the P bus bar 11 and the N bus bar 12 are The surface of the capacitor case that does not contact is formed of a non-thermally conductive member 22 such as synthetic resin.

  As is clear from the above detailed description, according to the power conversion device of the present embodiment, the semiconductor cells 7a, 7b, etc. are connected to the capacitor cells 13, 13a, 13b, 3c, extend and project outside the capacitor case 15. One or both of the P bus bar 11 and the N bus bars 12, 12 a connected to the heat generating component are in contact with the inner surface of the capacitor case 15 via the insulating material 16. Even with such a simple configuration, the calorific values of the capacitor cells 13, 13a, 13b, 13c are easily conducted to the capacitor case 15 as indicated by the broken arrows in FIGS. Since the heat is radiated from the outer surface of the capacitor 15, the capacitor cells 13, 13a, 13b and 13c are effectively cooled. In addition, the amount of heat generated by the reactor 6 and the semiconductor elements 7a and 7b enters the capacitor case 15 through heat conduction through the bus bar as shown by the broken arrows in FIGS. 23 to 28. This is easy from the bus bar to the capacitor case 15. Therefore, it does not reach the capacitor cells 13, 13a, 13b, 13c, and can protect the capacitor cells 13, 13a, 13b, 13c.

  Further, the portion of the inner surface of the capacitor case 15 that is in contact with the inner surface of one or both of the P bus bar 11 and the N bus bar 12 via the insulating material 16 does not have the other bus bar. Since all the inner surfaces are maximized, the width of the P bus bar 11 and the N bus bar 12 that do not come into contact with the inner surface of the capacitor case 15 is expanded, so that the amount of heat conduction is increased and the cooling effect is enhanced. it can.

  Further, since the capacitor case 15 is installed in a cooler or other cooler for cooling the semiconductor element, heat radiation from the capacitor case 15 is promoted, and the cooling effect is improved.

  In addition, since the capacitor case 15 includes the fins 20 on the outer surface thereof, heat radiation from the capacitor case 15 is promoted, and the cooling effect is improved.

  In addition, the plate thickness of the surface of the capacitor case 15 in which one or both of the P bus bar 11 and the N bus bar 12 are in contact with each other through the insulating material is the same for both the P bus bar 11 and the N bus bar 12. Since it is larger than the plate thickness of the surface of the capacitor case 15, the heat capacity of the capacitor case 15 increases and the cooling effect is improved.

  In addition, since only one or both of the P bus bar 11 and the N bus bar 12 of the capacitor case 15 are in contact with each other via the insulating material 16 is formed by the heat conductive member 23, the P of the capacitor case 15 A surface other than the surface where one or both of the bus bar 11 and the N bus bar 12 are in contact with each other through the insulating material 16 can be formed of a synthetic resin or the like, so that the weight can be reduced and the insulating material 16 is not required. Is reduced.

  In addition, one or both of the P bus bar 11 and the N bus bar 12 are connected to the capacitor cases 15 and 21 through the insulating material 16 from the capacitor cells 13, 13a, 13b, and 13c. Since the extending portions 12b to 12g that bend and extend along the surface are provided, the cooling effect is improved.

  Further, since the capacitor cases 15 and 21 have the protruding portions 27 with which the extending portions 12b to 12g including one or both of the P bus bar 11 and the N bus bar 12 are in contact with each other through the insulating material 16. The cooling effect is greatly improved.

  Further, since a heat conduction plate 26 connected to one or both of the P bus bar 11 and the N bus bars 12, 12a is provided in the gap between the capacitor cells 13a, 13b, 13c facing each other, a cooling effect is obtained. improves.

  FIG. 30 shows a case where the present invention is carried out in the capacitor of the embodiment shown in FIGS. 4 to 6 and bus bar cooling is performed, and a case where the present invention is not carried out with the capacitor having the shape shown in FIGS. It is a graph which shows the result of having simulated the temperature of each measurement position with the case where it does not perform. According to this, it can be understood that the effect of the present invention appears at all the measurement points 1 to 9, and in particular, the measurement point 3 has an excellent effect of lowering the temperature by 8.15 ° C.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Power converter 5 Filter capacitor 7a, 7b Semiconductor element 8 Smoothing capacitor 9 Snubber capacitor 11 P bus bar 12, 12a N bus bar 12b-12g Extension part 13,13a, 13b, 13c Capacitor cell 15,21 Capacitor case 16 Insulating material 18, 19 Cooler 20 Fin 23 Thermal Conductive Member 26 Thermal Conductive Plate 27 Protrusion T Thickness

Claims (9)

In the power conversion device (1) including a heat generating component such as at least one of a filter capacitor (5), a smoothing capacitor (8), and a snubber capacitor (9) and a semiconductor element (7a, 7b),
The capacitor includes a capacitor case (15, 21) and one or a plurality of capacitor cells (13, 13a, 13b, 13c) housed therein,
P bus bars (11) and N connected to the capacitor cells (13, 13a, 13b, 13c) and extending to the outside of the capacitor case (15, 21) and connected to the semiconductor elements (7a, 7b) and the like Either or both of the bus bars (12, 12a) are in contact with the inner surface of the capacitor case (15, 21) via an insulating material (16).   The portion of the P bus bar (11) and the N bus bar (12, 12a), or both of which is in contact with the inner surface of the capacitor case (15, 21) via an insulating material (16) is a capacitor case (15 , 21) of the inner surfaces of the capacitor case (15, 21) and the P bus bar (11) and the N bus bars (12, 12a) not contacting the inner surface of the capacitor case (15, 21). The power conversion device according to claim 1, wherein the power conversion device is extended from the width of the portion.   The power converter according to claim 1 or 2, wherein the capacitor case (15, 21) is installed in a cooler or other cooler for cooling the semiconductor element (7a, 7b).   The power converter according to any one of claims 1 to 3, wherein the capacitor case (15, 21) includes a fin (20) on an outer surface thereof.   The plate thickness (T) of the surface of the capacitor case (15, 21) in which one or both of the P bus bar (11) and the N bus bar (12, 12a) are in contact via the insulating material (16) is 5. The thickness of the capacitor case (15, 21) where neither the P bus bar (11) nor the N bus bar (12, 12 a) contacts is greater than the plate thickness of the capacitor case (15, 21). The power converter according to item.   Only the surface of the capacitor case (15, 21) with which one or both of the P bus bar (11) and the N bus bar (12, 12a) are in contact with each other via the insulating material (16) is applied to the heat conductive member ( 23. The power conversion device according to claim 1, wherein the power conversion device is formed in step 23).   From either one or both of the P bus bar (11) and the N bus bar (12) from the portion that contacts the capacitor case (15, 21) through the insulating material (16), the capacitor cell (13, 13. The power conversion device according to claim 1, further comprising an extension portion (12 b to 12 g) that bends and extends along the outer surface of 13 a, 13 b, and 13 c).   The capacitor case (15, 21) is in contact with the extending portion (12b-12g) including one or both of the P bus bar (11) and the N bus bar (12) via the insulating material (16). The power converter according to claim 7, further comprising a protruding portion (27).   A heat conduction plate (26) connected to one or both of the P bus bar (11) and the N bus bar (12, 12a) is provided in the gap between the opposing capacitor cells (13a, 13b, 13c). The power conversion device according to claim 1, wherein the power conversion device is a power conversion device.

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