JP2021175201A - Electric power conversion system - Google Patents

Abstract

To provide an electric power conversion system capable of efficiently cooling a noise elimination capacitor and a noise elimination core when a water passage cannot be formed due to request for reduction in size.SOLUTION: An electric power conversion system comprises a power semiconductor circuit part for converting DC power to AC power, a smooth capacitor for smoothing the DC power, a filter circuit part disposed on the opposite side of the power semiconductor circuit part while holding the smooth capacitor therebetween, and a coolant passage for cooling the power semiconductor circuit part. The filter circuit part includes a noise elimination capacitor and a noise elimination core. The smooth capacitor includes a first smooth capacitor part and a second smooth capacitor part. A heat conductive first barrier is provided between the noise elimination capacitor and the noise elimination core, and between the first smooth capacitor part and the second smooth capacitor part. The first barrier is thermally connected with the coolant passage.SELECTED DRAWING: Figure 3

Description

The present invention relates to a power converter.

With the increase in output, high frequency, and miniaturization of inverters that convert DC power to AC power, suppression of electromagnetic noise is required, and a noise removal filter consisting of a noise removal capacitor and noise removal core on the input side of the DC voltage of the inverter. Has been added. The noise reduction filter has a configuration in which a bus bar is inserted through the noise removal core, and the cross-sectional area of the bus bar becomes small around the noise removal core, resulting in a large amount of heat generation. This heat generation flows into the noise reduction capacitor, and the noise reduction capacitor receives heat. Therefore, it is necessary to efficiently cool the periphery of the noise reduction filter and reduce the influence of heat from the inverter.

Patent Document 1 discloses a power conversion device capable of improving heat dissipation performance and increasing the output of an inverter by arranging a cooling unit on the lower surface of the noise filter module.

International Publication WO2018 / 116667 Gazette

In the above-mentioned device described in Patent Document 1, the noise reduction capacitor and the noise removal core cannot be efficiently cooled when the cooling unit cannot be arranged on the lower surface of the noise filter module due to the demand for miniaturization of the device. ..

The power conversion device according to the present invention is arranged on the opposite side of the power semiconductor circuit unit that converts DC power into AC power, the smoothing capacitor that smoothes the DC power, and the power semiconductor circuit unit with the smoothing capacitor interposed therebetween. The filter circuit unit includes a filter circuit unit and a refrigerant flow path for cooling the power semiconductor circuit unit. The filter circuit unit includes a noise removing capacitor and a noise removing core, and the smoothing capacitor is the first smoothing capacitor. A capacitor portion and a second smoothing capacitor portion are included, and thermal conductivity is provided between the noise removing capacitor and the noise removing core, and between the first smoothing capacitor portion and the second smoothing capacitor portion. A first partition is provided, and the first partition is thermally connected to the refrigerant flow path.

According to the present invention, the noise reduction capacitor and the noise reduction core can be efficiently cooled while satisfying the demand for miniaturization of the apparatus.

It is a circuit block diagram of the power conversion apparatus which concerns on 1st Embodiment. It is a perspective view of the power conversion apparatus which concerns on 1st Embodiment. It is a development view of the power conversion apparatus which concerns on 1st Embodiment. It is a perspective view of the bottom surface of the power conversion apparatus which concerns on 1st Embodiment. It is a perspective view which shows the 1st DC bus bar and the 2nd DC bus bar which concerns on 1st Embodiment. It is a top view of the power conversion apparatus which concerns on 1st Embodiment. (A) (B) is a top view and a side view of the power conversion device according to the first embodiment. (A) (B) is a top view and a side view of the power conversion device according to the first embodiment. It is a perspective view of the power conversion apparatus which concerns on 2nd Embodiment. It is a development view of the power conversion apparatus which concerns on 2nd Embodiment. It is a top view of the power conversion apparatus which concerns on 2nd Embodiment. (A) (B) is a top view and a side view of the power conversion device according to the second embodiment. It is a perspective view of the power conversion apparatus which concerns on 3rd Embodiment. It is a development view of the power conversion apparatus which concerns on 3rd Embodiment. (A) (B) is a top view and a side view of the power conversion device according to the third embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The following description and drawings are examples for explaining the present invention, and are appropriately omitted and simplified for the sake of clarification of the description. The present invention can also be implemented in various other forms. Unless otherwise specified, each component may be singular or plural.

The position, size, shape, range, etc. of each component shown in the drawings may not represent the actual position, size, shape, range, etc., in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the position, size, shape, range and the like disclosed in the drawings.

[First Embodiment]
FIG. 1 is a circuit configuration diagram of the power conversion device 1.
DC power is input to the power conversion device 1 from the DC power supply 2. The power conversion device 1 drives the motor generator 5 by converting the input DC power into AC power and outputting it to the motor generator 5. Further, when the motor generator 5 is rotated by an external force, the power conversion device 1 converts AC power into DC power, stores the AC power in the DC power supply 2, and regenerates the power.

The power conversion device 1 includes an inverter main circuit 3 that converts DC power into AC power, and a filter circuit unit 20 that suppresses electromagnetic noise generated when the inverter main circuit 3 performs power conversion operation.

The inverter main circuit 3 is composed of a power semiconductor circuit unit 4 constituting the inverter and a smoothing capacitor 50 for smoothing DC power.

The power semiconductor circuit unit 4 is composed of a power semiconductor module including a switching element and a diode element that recirculates the current from the motor generator 5, and the diode element also has a function of converting AC power into DC power at the time of regeneration.

The power semiconductor circuit unit 4 includes power semiconductor modules 4a, 4b, and 4c. The power semiconductor module 4a is connected to the U phase of the motor generator 5. The power semiconductor module 4b is connected to the V phase of the motor generator 5. The power semiconductor module 4c is connected to the W phase of the motor generator 5.

The smoothing capacitor 50 is connected between the power semiconductor circuit unit 4 and the filter circuit unit 20, smoothes when converting DC power into AC power, and supplies the smoothed DC power to the power semiconductor circuit unit 4. ..
The second DC bus bar 11 is a power transmission path connected between the smoothing capacitor 50, the power semiconductor circuit unit 4, and the filter circuit unit 20.

The filter circuit unit 20 is arranged between the DC power supply terminal 6 and the smoothing capacitor 50, and the power semiconductor circuit unit 4 removes electromagnetic noise generated during the power conversion operation, that is, normal mode noise and common mode noise. The filter circuit unit 20 includes a noise reduction capacitor 21 and a noise removal core 26. The first DC bus bar 10 is electrically connected to the noise removing capacitor 21, is inserted through the through hole of the noise removing core 26, and is connected to the second DC bus bar 11.

The noise reduction capacitor 21 is composed of an X capacitor 22 and Y capacitors 23 and 24. The X capacitor 22 is connected between the positive electrode side conductor and the negative electrode side conductor of the first DC bus bar 10 and smoothes power having a frequency higher than the power frequency smoothed by the smoothing capacitor 50. The X capacitor 22 removes normal mode noise.

The Y capacitor 23 is connected between the positive electrode side conductor of the first DC bus bar 10 and the GND terminal 25. The GND terminal 25 is a ground terminal in the circuit of the power conversion device 1. The Y capacitor 24 is connected between the negative electrode side conductor of the first DC bus bar 10 and the GND terminal 25. The Y capacitors 23 and 24 remove common mode noise.

The noise reduction core 26 is a core member that suppresses electromagnetic noise by absorbing fluctuations in the current flowing through the first DC bus bar 10. The first DC bus bar 10 is connected to the DC power supply 2 via the DC power supply terminal 6.

FIG. 2 is a perspective view of the power conversion device 1.
The metal case 7 is a case of the power conversion device 1, and houses the inverter main circuit 3 and the filter circuit unit 20.
The filter circuit unit 20 is arranged on the side opposite to the power semiconductor circuit unit 4 with the smoothing capacitor 50 interposed therebetween. The Y capacitors 23 and 24 (see FIG. 1) are connected to the GND terminal 25. The first DC bus bar 10 is connected to the DC power supply 2 via the DC power supply terminal 6.

The first DC bus bar 10 is arranged on the noise removing capacitor 21, is inserted into the noise removing core 26 arranged in parallel with the noise removing capacitor 21, and then is connected to the second DC bus bar 11.
The second DC bus bar 11 is arranged on the smoothing capacitor 50 and is connected to the power semiconductor circuit unit 4. The AC bus bar 12 is a power transmission path for outputting AC power from the power semiconductor circuit unit 4, and is connected to the motor generator 5 (see FIG. 1).

FIG. 3 is a developed view of the power conversion device 1.
The first DC bus bar 10 is composed of a positive electrode side conductor 10p and a negative electrode side conductor 10n, and is covered with a mold resin material 10m for insulation and fixing. The second DC bus bar 11 is composed of a positive electrode side conductor 11p and a negative electrode side conductor 11n, and is covered with a mold resin material 11m for insulation and fixing.

The AC bus bar 12 is a power transmission path connected between the power semiconductor circuit unit 4 and the motor generator 5. Of the AC bus bars 12, the AC bus bar 12a is connected to the U phase of the power semiconductor module 4a and the motor generator 5. The AC bus bar 12b is connected to the V phase of the power semiconductor module 4b and the motor generator 5. The AC bus bar 12c is connected to the W phase of the power semiconductor module 4b and the motor generator 5.

The smoothing capacitor 50 is composed of a first smoothing capacitor section 51 and a second smoothing capacitor section 52. The X capacitor 22, the Y capacitor 23, and 24 are arranged on the opposite sides of the power semiconductor modules 4a, 4b, and 4c with the smoothing capacitor 50 interposed therebetween.

The metal case 7 is provided with a refrigerant flow path 8, and the power semiconductor modules 4a, 4b, and 4c are thermally connected to the refrigerant flow path 8 and cooled by the refrigerant flowing through the refrigerant flow path 8.
Further, in the metal case 7, a first partition wall 60 having thermal conductivity is provided between the noise removing capacitor 21 and the noise removing core 26, and between the first smoothing capacitor portion 51 and the second smoothing capacitor portion 52. The first partition 60 is thermally connected to the refrigerant flow path. The first partition wall 60 may be formed integrally with the metal case 7 or may be formed separately from the metal case 7.

The first DC bus bar 10 is in contact with the first partition wall 60 via the first heat conductive member 61. The first heat conductive member 61 is a heat conductive member such as a heat radiating sheet or a heat radiating grease, and heat generated by the first DC bus bar 10 is transferred to the first partition wall 60 via the first heat conductive member 61, and further. Heat is dissipated from the first partition wall 60 to the refrigerant flow path 8.

The second DC bus bar 11 is in contact with the first partition wall 60 via the second heat conductive member 62. The second heat conductive member 62 is a heat conductive member such as a heat radiating sheet or heat radiating grease, and heat generated by the second DC bus bar 11 is transferred to the first partition 60 via the second heat conductive member 62, and further to the first partition wall 60. 1 Heat is dissipated from the partition 60 to the refrigerant flow path 8.

FIG. 4 is a perspective view of the bottom surface of the power conversion device 1.
A refrigerant flow path 8 for cooling the power semiconductor modules 4a, 4b, and 4c is provided on the bottom surface of the metal case 7. The power semiconductor modules 4a, 4b, and 4c are cooled by the refrigerant flowing through the refrigerant flow path 8.

FIG. 5 is a perspective view showing the first DC bus bar 10 and the second DC bus bar 11.
The first DC bus bar 10 is configured by insulating and superimposing the positive electrode side conductor 10p and the negative electrode side conductor 10n from each other, and is covered with a mold resin material for insulation and fixing. The second DC bus bar 11 is configured by insulating and superimposing the positive electrode side conductor 11p and the negative electrode side conductor 11n from each other, and is covered with a mold resin material for insulation and fixing. The positive electrode side conductor 10p of the first DC bus bar 10 is connected to the positive electrode side conductor 11p of the second DC bus bar 11. The negative electrode side conductor 10n of the first DC bus bar 10 is connected to the negative electrode side conductor 11n of the second DC bus bar 11.

FIG. 6 is a top view of the power conversion device 1. In FIG. 6, the path of heat conduction is indicated by an arrow Z with the first DC bus bar 10 and the second DC bus bar 11 removed.
The heat generated by the first smoothing capacitor section 51 and the second smoothing capacitor section 52 is dissipated to the refrigerant flow path 8 of the power semiconductor circuit section 4 via the heat conductive first partition wall 60. Further, the heat generated by the noise removing capacitor 21 and the noise removing core 26 is dissipated to the refrigerant flow path 8 of the power semiconductor circuit unit 4 via the heat conductive first partition wall 60.

When this embodiment is not applied, the central portion of the mounting portion of the smoothing capacitor 50 tends to retain heat and becomes a thermal bottleneck. On the other hand, in the present embodiment, since the heat dissipation path is formed by providing the first partition wall 60 between the first smoothing capacitor section 51 and the second smoothing capacitor section 52, the temperature distribution of the smoothing capacitor 50 is local. It does not easily become high and can be made uniform. Further, when this embodiment is not applied, the device is enlarged by providing a cooling unit on the lower surface of the filter circuit unit 20 (noise removal capacitor 21, noise removal core 26). On the other hand, in the present embodiment, since the heat dissipation path is formed by providing the first partition wall 60 between the noise removing capacitor 21 and the noise removing core 26, the apparatus can be miniaturized, and then the noise removing capacitor 21 In addition, the temperature distribution of the noise removing core 26 is unlikely to be locally high and can be made uniform.

FIG. 7A is a top view of the power conversion device 1, and FIG. 7B is a side view of the power conversion device 1. In FIG. 7A, with the first DC bus bar 10 and the second DC bus bar 11 removed, the heat conduction path of the noise removing capacitor 21 and the noise removing core 26 is indicated by an arrow X. In FIG. 7B, with the first DC bus bar 10 and the second DC bus bar 11 attached, the heat conduction paths of the noise removing capacitor 21 and the noise removing core 26 are indicated by arrows X.

As shown in FIG. 7B, the first DC bus bar 10 is in contact with the first partition wall 60 via the first heat conductive member 61. Therefore, as shown in FIGS. 7 (A) and 7 (B), the heat generated from the noise removing capacitor 21 and the noise removing core 26 to the first DC bus bar 10 and the heat generated by the first DC bus bar 10 are the first heat. It conducts heat to the first partition wall 60 via the conductive member 61 and dissipates heat to the refrigerant flow path 8.

FIG. 8A is a top view of the power conversion device 1, and FIG. 8B is a side view of the power conversion device 1. In FIG. 8A, the heat conduction paths of the first smoothing capacitor section 51 and the second smoothing capacitor section 52 are indicated by arrows Y with the first DC bus bar 10 and the second DC bus bar 11 removed. In FIG. 7B, with the first DC bus bar 10 and the second DC bus bar 11 attached, the heat conduction paths of the first smoothing capacitor section 51 and the second smoothing capacitor section 52 are indicated by arrows Y.

The second DC bus bar 11 is in contact with the first partition wall 60 via the second heat conductive member 62. Therefore, as shown in FIGS. 8A and 8B, heat generated by the first smoothing capacitor section 51 and the second smoothing capacitor section 52 is generated from the second DC bus bar 11 via the second heat conductive member 62. Then, it is conducted to the first partition wall 60 and radiated to the refrigerant flow path 8.

[Second Embodiment]
FIG. 9 is a perspective view of the power conversion device 1 according to the second embodiment. In the second embodiment, in addition to the configuration of the first embodiment, a second partition wall 70 is provided. The circuit configuration diagram of the power conversion device 1 shown in FIG. 1 of the first embodiment, the perspective view of the bottom surface of the power conversion device 1 shown in FIG. 4, and the first DC bus bar 10 and the second DC bus bar 10 shown in FIG. Since the perspective view showing the DC bus bar 11 is the same in the second embodiment, the illustration is omitted. Further, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 9, a second partition wall 70 having thermal conductivity is provided between the filter circuit unit 20 (noise removing capacitor 21, noise removing core 26) and the smoothing capacitor 50. Other configurations are the same as the perspective view of the power conversion device 1 shown in FIG. 2 of the first embodiment.

FIG. 10 is a development view of the power conversion device 1 according to the second embodiment.
The heat conductive second partition wall 70 is a part of the metal case 7 and is arranged between the filter circuit unit 20 and the smoothing capacitor 50. The second partition wall 70 is provided with a third heat conductive member 71, and the second DC bus bar 11 comes into contact with the second partition wall 70 via the third heat conductive member 71. Although FIG. 10 shows an example in which the second DC bus bar 11 contacts the second partition wall 70 via the third heat conductive member 71, the first DC bus bar 10 is the third heat conductive member 71. It may be configured to come into contact with the second partition wall 70 via the above. In this case, the connection portion between the first DC bus bar 10 and the second DC bus bar 11 is provided on the side of the second DC bus bar 11 with respect to the second partition wall 70, and the second partition wall 70 is directly below the first DC bus bar 10. It shall be located. The third heat conductive member 71 is a heat conductive member such as a heat radiating sheet or heat radiating grease. The second partition wall 70 may be formed integrally with the metal case 7 or may be formed separately from the metal case 7. Other configurations are the same as the development view of the power conversion device 1 shown in FIG. 3 of the first embodiment.

FIG. 11 is a top view of the power conversion device 1 according to the second embodiment. In FIG. 11, with the first DC bus bar 10 and the second DC bus bar 11 removed, the heat conduction path of the filter circuit unit 20 (noise removing capacitor 21, noise removing core 26) is indicated by an arrow P.

The heat generated by the noise removing capacitor 21 and the noise removing core 26 is conducted to the first partition wall 60 via the second partition wall 70 having thermal conductivity, or the heat generated by the filter circuit unit 20 is transmitted to the noise removing capacitor 21 and the noise removing core 26. It conducts to the first partition wall 60 between the two, and dissipates heat to the refrigerant flow path 8.

FIG. 12A is a top view of the power conversion device 1 according to the second embodiment, and FIG. 12B is a side view of the power conversion device 1 according to the second embodiment. In FIG. 12A, the heat conduction path of the second DC bus bar 11 is indicated by an arrow Q with the first DC bus bar 10 and the second DC bus bar 11 removed. In FIG. 12B, with the first DC bus bar 10 and the second DC bus bar 11 attached, the heat conduction path of the second DC bus bar 11 is indicated by an arrow Q.

As shown in FIGS. 12A and 12B, the heat generated by the second DC bus bar 11 is conducted to the second partition wall 70 via the third heat conductive member 71, passes through the first partition wall 60, and then passes through the first partition wall 60. Heat is dissipated to the refrigerant flow path 8. When the first DC bus bar 10 is in contact with the second partition wall 70 via the third heat conductive member 71, the heat generated by the first DC bus bar 10 is generated via the third heat conductive member 71. It conducts heat to the second partition wall 70, passes through the first partition wall 60, and dissipates heat to the refrigerant flow path 8.

[Third Embodiment]
FIG. 13 is a perspective view of the power conversion device 1 according to the third embodiment. FIG. 14 is a development view of the power conversion device 1 according to the third embodiment. In the third embodiment, in addition to the configuration of the second embodiment, the second partition wall 70 is provided with the shield portion 72. The circuit configuration diagram of the power conversion device 1 shown in FIG. 1 of the first embodiment, the perspective view of the bottom surface of the power conversion device 1 shown in FIG. 4, and the first DC bus bar 10 and the second DC bus bar 10 shown in FIG. Since the perspective view showing the DC bus bar 11 is the same in the third embodiment, the illustration is omitted. Further, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIGS. 13 and 14, the second partition wall 70 includes a shield portion 72 that stands upright in the height direction of the second partition wall 70, and the height including the second partition wall 70 and the shield portion 72 is the first. 1 Corresponds to the height to the surface of the second DC bus bar 11 arranged on the smoothing capacitor portion 51. The second partition wall 70 may be set to a height up to the surface of the second DC bus bar 11 arranged on the first smoothing capacitor portion 51 without providing the shield portion 72.

15 (A) is a top view of the power conversion device 1, and FIG. 15 (B) is a side view of the power conversion device 1.

As shown in FIG. 15B, the height including the second partition wall 70 and the shield portion 72 corresponds to the height to the surface of the second DC bus bar 11 arranged on the first smoothing capacitor portion 51. do. In FIG. 15B, the height to the surface of the second DC bus bar 11 is slightly higher than the height to the surface of the second DC bus bar 11, but it may be equal to or slightly lower than the height to the surface of the second DC bus bar 11. The height may be such that a stray capacitance Cb2g, which will be described later, is formed between the shield portion 72 and the second DC bus bar 11.

As shown in FIG. 15A, a stray capacitance Cb2g is formed between the shield portion 72 and the second DC bus bar 11. In this stray capacitance Cb2g, the generated noise current is passed through the metal case 7 (GND) by using the switching operation (voltage change) of the power semiconductor modules 4a, 4b, and 4c as the noise source NS. The noise current I flowing through the stray capacitance Cb2g is represented by the following equation (1).
I = Cb2g * (Δv / Δt) ・ ・ ・ (1)
Here, Δv is the voltage between the shield portion 72 and the second DC bus bar 11, and Δt is the time.

Similarly, when the second partition wall 70 is set to the height to the surface of the second DC bus bar 11 arranged on the first smoothing capacitor portion 51 without providing the shield portion 72, the second partition wall 70 is similarly provided. A stray capacitance Cb2g is formed between the and the second DC bus bar 11.
According to this embodiment, it is possible to suppress the outflow of noise current from the DC power supply terminal 6.

According to the embodiment described above, the following effects can be obtained.
(1) The power conversion device 1 has a power semiconductor circuit unit 4 that converts DC power into AC power, a smoothing capacitor 50 that smoothes DC power, and a side opposite to the power semiconductor circuit unit 4 with the smoothing capacitor 50 interposed therebetween. The filter circuit unit 20 includes a filter circuit unit 20 arranged in the above and a refrigerant flow path 8 for cooling the power semiconductor circuit unit 4, and the filter circuit unit 20 includes a noise removing capacitor 21 and a noise removing core 26, and is a smoothing capacitor. Reference numeral 50 denotes a first smoothing capacitor portion 51 and a second smoothing capacitor portion 52, between the noise removing capacitor 21 and the noise removing core 26, and between the first smoothing capacitor portion 51 and the second smoothing capacitor portion 52. A thermally conductive first partition 60 is provided between them, and the first partition 60 is thermally connected to the refrigerant flow path 8.

The present invention is not limited to the above-described embodiments, and other embodiments that can be considered within the scope of the technical idea of the present invention are also included within the scope of the present invention as long as the features of the present invention are not impaired. Is done. Further, the configuration may be a combination of the above-described embodiments.

1 ... Power converter, 2 ... DC power supply, 3 ... Inverter main circuit, 4 ... Power semiconductor circuit, 4a, 4b, 4c ... Power semiconductor module, 5 ... Motor generator , 6 ... DC power supply terminal, 7 ... Metal case, 8 ... Coolant flow path, 10 ... 1st DC bus bar, 10p ... Positive conductor, 10n ... Negative conductor, 10m ... Mold resin material, 11 ... 2nd DC bus bar, 11p ... Positive side conductor, 11n ... Negative side conductor, 11m ... Mold resin material, 12 ... AC bus bar, 20 ... -Filter circuit unit, 21 ... noise removal capacitor, 22 ... X capacitor, 23, 24 ... Y capacitor, 26 ... noise removal core, 50 ... smoothing capacitor, 51 ... 1st Smoothing capacitor part, 52 ... 2nd smoothing capacitor part, 60 ... 1st partition wall, 61 ... 1st thermal conductive member, 62 ... 2nd thermal conductive member, 70 ... 2nd Capacitor, 71 ... Third thermal conductive member, 72 ... Shield part.

Claims (7)

Power semiconductor circuit section that converts DC power to AC power,
A smoothing capacitor that smoothes the DC power,
A filter circuit unit arranged on the opposite side of the power semiconductor circuit unit with the smoothing capacitor in between,
A refrigerant flow path for cooling the power semiconductor circuit unit is provided.
The filter circuit unit includes a noise reduction capacitor and a noise reduction core.
The smoothing capacitor includes a first smoothing capacitor portion and a second smoothing capacitor portion.
A heat-conducting first partition wall is provided between the noise reduction capacitor and the noise reduction core, and between the first smoothing capacitor section and the second smoothing capacitor section, and the first partition wall is formed by the first partition wall. A power conversion device that is thermally connected to the refrigerant flow path. The power conversion device according to claim 1.
The filter circuit unit includes a first DC bus bar.
The first DC bus bar is connected to the noise reduction capacitor and is inserted through a through hole of the noise reduction core.
The first DC bus bar is a power conversion device that contacts the first partition wall via a first heat conductive member. The power conversion device according to claim 1.
A second DC bus bar connected to the first smoothing capacitor section and the second smoothing capacitor section is provided.
The second DC bus bar is a power conversion device that contacts the first partition wall via a second heat conductive member. The power conversion device according to claim 1.
A power conversion device in which a second partition wall having thermal conductivity is provided between the filter circuit unit and the smoothing capacitor. The power conversion device according to claim 4.
The filter circuit unit includes a first DC bus bar.
Further, a second DC bus bar connected to the first smoothing capacitor portion and the second smoothing capacitor portion is provided.
The first DC bus bar or the second DC bus bar is a power conversion device that contacts the second partition wall via a third heat conductive member. The power conversion device according to claim 4.
A second DC bus bar connected to the first smoothing capacitor section and the second smoothing capacitor section is provided.
The second partition wall is a power conversion device having a height corresponding to the height to the surface of the second DC bus bar arranged on the first smoothing capacitor portion. The power conversion device according to claim 4.
A second DC bus bar connected to the first smoothing capacitor section and the second smoothing capacitor section is provided.
The second partition wall includes a shield portion that stands upright in the height direction of the second partition wall, and the height including the second partition wall and the shield portion is arranged on the first smoothing capacitor portion. A power conversion device corresponding to the height to the surface of the second DC bus bar.

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