JP2006253544A - Capacitor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small capacitor device mounted in a vehicle system. <P>SOLUTION: The capacitor device 10 includes multiple capacitor elements 20, multiple heat pipes 30, and a case 40 that houses the multiple capacitor elements 20 and the multiple heat pipes 30. The multiple heat pipes 30 are so disposed in the case 40 that the heat pipes are positioned in the gaps between the multiple capacitor elements 20 bedded in a matrix pattern in tight contact with one another, and between the capacitor elements and the case; and, at the same time, they are positioned at the four corners of each of the multiple capacitor elements 20. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a capacitor device, and more particularly to a heat dissipation technique for a capacitor device.

  Japanese Laid-Open Patent Publication No. 2-28910 (Patent Document 1) discloses a molded capacitor that can be made small and lightweight. The mold capacitor includes a plurality of capacitor elements and heat pipes provided corresponding to the plurality of capacitor elements, respectively. And the heat absorption part of a heat pipe is inserted in the center part of each capacitor | condenser element, and the thermal radiation part of each heat pipe is derived | led-out outside the mold resin.

  In this molded capacitor, the heat generated in the capacitor element is absorbed from the heat absorbing portion of the heat pipe as the vaporization energy of the working fluid in the heat pipe. Then, the absorbed heat is released to the outside of the mold capacitor from the heat radiating portion of the heat pipe led out of the mold resin. Thereby, even when the capacitor element is covered with the mold resin, heat generated from the capacitor element is prevented from being accumulated inside the mold capacitor. (See Patent Document 1).

  Japanese Patent Laying-Open No. 2001-326131 (Patent Document 2) discloses a capacitor capable of forming a better heat dissipation state of a capacitor element. The capacitor includes an outer case that accommodates a plurality of capacitor elements. The outer case opens on one of the opposing wall surfaces of the outer case and separates the capacitor elements. A slit portion to be formed is provided.

According to this capacitor, by providing the slit portion, an air layer continuous with the outside is provided between the plurality of capacitor elements, and the heat generated by the capacitor element can be directly radiated to the outside through the slit portion (patent) Reference 2).
JP-A-2-28910 JP 2001-326131 A Japanese Utility Model Publication No. 5-43533 Japanese Utility Model Publication No. 5-76028 JP 2000-208366 A JP 11-67593 A

  In recent years, a hybrid vehicle and an electric vehicle have attracted a great deal of attention against the background of increasing energy saving and environmental problems. This hybrid vehicle or electric vehicle is equipped with a DC power source, an inverter, and a motor driven by the inverter as a power source. A capacitor device for smoothing the DC voltage is disposed between the DC power supply and the inverter.

  In such a vehicle system, it is strongly required to reduce the size of each device to be mounted. Further, further downsizing of the capacitor device is also required.

  In the molded capacitor disclosed in Japanese Patent Laid-Open No. 2-28910, since the heat pipe is inserted into the capacitor element, the volume of the capacitor element increases as the heat pipe is inserted. Therefore, this molded capacitor may not be able to sufficiently meet the demand for downsizing, particularly in the vehicle system as described above.

  Further, the downsizing of the apparatus causes the heat generating elements to be dense, and as a result, heat is likely to be accumulated inside the apparatus. Therefore, in order to further reduce the size of the capacitor device, it is necessary to effectively dissipate the heat in the capacitor device to the outside.

  In the molded capacitor disclosed in Japanese Patent Laid-Open No. 2-291010, one heat pipe is inserted into the central portion of each capacitor element. Therefore, the number of heat pipes in the entire molded capacitor, that is, the heat dissipation point, is the capacitor element. Limited to the number of Further, increasing the number of heat pipes in order to increase the heat dissipation point leads to an increase in the volume of each capacitor element, and as a result, hinders downsizing of the capacitor device.

  In addition, since the capacitor disclosed in Japanese Patent Laid-Open No. 2001-326131 has a slit portion between a plurality of capacitor elements, space saving and downsizing of the capacitor device are hindered. Furthermore, since this capacitor is an air cooling system using a slit portion, a sufficient cooling effect cannot be obtained. In addition, since the slit portion of this capacitor is formed in advance in the outer case, it is impossible to increase the size of the capacitor element or change the arrangement, and the degree of freedom of the device configuration is low.

  Furthermore, in particular, in the vehicle system as described above, in order to increase the efficiency of the layout of various devices, condenser devices, inverter devices, electrode bus bars, etc., which are heating elements, are densely arranged, and heat interference occurs between the devices. Will occur. For this reason, even in the capacitor device, it is necessary to take measures for preventing the influence of heat from the outside of the capacitor device as much as possible.

  Therefore, the present invention has been made to solve such a problem, and an object thereof is to provide a small capacitor device.

  Another object of the present invention is to provide a capacitor device having excellent heat dissipation.

  Furthermore, another object of the present invention is to provide a capacitor device having a high degree of freedom in device configuration.

  Furthermore, another object of the present invention is to provide a capacitor device that is not easily affected by heat from outside the device.

  According to the present invention, a capacitor device includes a casing, a plurality of capacitor elements that are spread in close contact with each other in the casing, and a plurality of heat dissipating members that are disposed in unoccupied regions of the plurality of capacitors in the casing. Prepare.

  In the capacitor device according to the present invention, the heat inside the capacitor device is radiated to the outside by the heat radiating member. Then, the plurality of capacitor elements are spread in close contact with each other, and further, the plurality of heat dissipating members that dissipate the heat inside the capacitor device to the outside are disposed in the non-occupied regions of the plurality of capacitors in the housing, There is no increase in the volume of the capacitor device.

  Therefore, according to the capacitor device of the present invention, a small capacitor device can be realized. And since heat dissipation is performed by the several heat radiating member, it is excellent in heat dissipation compared with the case of air cooling. Furthermore, since the size of the capacitor element and the heat radiating member and the degree of freedom of arrangement are high, it can contribute to the reduction of the manufacturing cost.

  Preferably, the plurality of heat dissipating members are disposed in unoccupied regions of the plurality of capacitors generated between the plurality of capacitor elements.

  In this capacitor device, the heat inside the capacitor device is effectively radiated to the outside by the plurality of heat dissipating members disposed in the non-occupied region generated between the plurality of capacitor elements. Therefore, according to this capacitor device, a capacitor device having excellent heat dissipation can be realized.

  Preferably, the plurality of heat dissipating members are further disposed in a non-occupied region of the plurality of capacitors generated between the housing and the plurality of capacitor elements.

  In this capacitor device, heat transfer from the outside of the capacitor device to the inside of the device is alleviated by a plurality of heat dissipating members disposed in a non-occupied region generated between the housing and the plurality of capacitor elements. Therefore, according to this capacitor device, it is possible to realize a capacitor device that is hardly affected by heat from outside the device.

  Preferably, the plurality of capacitor elements are arranged in a matrix in the housing, and each of the plurality of heat dissipating members includes a rod-shaped heat conducting member, and the plurality of rod-shaped heat conducting members includes a plurality of capacitor elements in a matrix. Are arranged at the four corners of each of at least a plurality of capacitor elements along a substantially normal direction of the surface arranged in a shape.

  In this capacitor device, since a plurality of rod-like heat conducting members are disposed at each of the four corners of at least a plurality of capacitor elements, a large number of heat radiation routes from the inside of the device to the outside of the device are formed. Therefore, according to this capacitor device, a capacitor device having excellent heat dissipation can be realized.

  Preferably, each of the plurality of heat radiating members includes a heat pipe.

  In this capacitor device, each of the plurality of heat dissipating members is a heat pipe having high heat conduction characteristics. Therefore, according to this capacitor device, the heat inside the device can be effectively radiated to the outside of the device.

  Preferably, the capacitor device further includes a cooler that cools one end of the plurality of heat pipes.

  In this condenser device, the heat pipe is forcibly cooled by the cooler. Therefore, according to this capacitor device, the heat inside the device can be dissipated more effectively to the outside of the device.

  According to the present invention, a small capacitor device can be realized. Moreover, the capacitor | condenser apparatus excellent in heat dissipation is realizable. Furthermore, a capacitor device having a high degree of freedom in the device configuration can be realized. Furthermore, it is possible to realize a capacitor device that is hardly affected by heat from outside the device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

  1 and 2 are diagrams for explaining the structure of a capacitor device according to an embodiment of the present invention. FIG. 1 is a plan view of a capacitor device 10 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of section II-II of the capacitor device 10 shown in FIG. In FIG. 1, the cooling fan 50 shown in FIG. 2 is not shown for the sake of explanation.

  Referring to FIGS. 1 and 2, a capacitor device 10 according to this embodiment includes a plurality of capacitor elements 20, a plurality of heat pipes 30, a case 40, and a cooling fan 50. The plurality of capacitor elements 20 are arranged in a planar manner in close contact with each other in the case 40, for example, arranged in a matrix. The plurality of capacitor elements 20 are connected by electrodes (not shown) to form one capacitor as a whole.

  The reason why the capacitor device 10 is formed by the plurality of capacitor elements 20 is to improve the fault tolerance of the capacitor device 10 as a whole. That is, the capacitor device 10 is formed of a plurality of capacitor elements 20 in order to prevent the entire capacitor device 10 from functioning at all even if one or some of the capacitor elements 20 fail.

  The plurality of heat pipes 30 absorb the heat in the capacitor device 10 and radiate the absorbed heat to the outside of the capacitor device 10. The plurality of heat pipes 30 are disposed in a non-occupied region of the plurality of capacitor elements 20 in the case 40. More specifically, the plurality of heat pipes 30 are arranged so as to be positioned at the four corners of the plurality of capacitor elements 20 in the gaps between the plurality of capacitor elements 20 laid out in a matrix. Is done.

  The case 40 is a housing that houses the plurality of capacitor elements 20 and the plurality of heat pipes 30. The case 40 is made of a member having excellent strength and heat dissipation, and is made of, for example, aluminum. The cooling fan 50 is disposed above the plurality of capacitor elements 20 and the plurality of heat pipes 30 and forcibly cools the plurality of heat pipes 30 that have absorbed the heat in the capacitor device 10. The cooling fan 50 also directly cools the plurality of capacitor elements 20 from above.

  A structural feature of the capacitor device 10 is that, first, in the case 40, a plurality of heat pipes 30 are arranged in a non-occupied region of a plurality of capacitor elements 20 spread in close contact with each other in a matrix. It is that you are. That is, the plurality of heat pipes 30 are disposed in the gaps between the plurality of capacitors 20 spread in the case 40. Thereby, the heat dissipation of the capacitor device 10 is ensured without increasing the volume of the capacitor device 10. In addition, the plurality of capacitor elements 20 and the plurality of heat pipes 30 have a high degree of freedom in size and arrangement, and a high degree of freedom in device configuration.

  The second structural feature of the capacitor device 10 is that a plurality of heat pipes 30 are arranged so as to fill the four corners of each of the plurality of capacitor elements 20. That is, in the capacitor device 10 according to this embodiment, 16 heat pipes 30 arranged in a matrix are arranged for the nine capacitor devices 20 arranged in a matrix. Thereby, each of the plurality of capacitor elements 20 radiates heat to the outside of the apparatus via the four heat pipes 30, so that the heat dissipation of each of the plurality of capacitor elements 20 is improved. As a result, the heat in the capacitor device 10 is effectively radiated to the outside.

  Further, compared to the prior art in which a heat pipe is inserted at the center of each of the plurality of capacitor elements 20, more heat radiation routes from the inside of the capacitor device 10 to the outside of the device are formed. The heat dissipation of 10 is improved. Furthermore, since the heat pipe 30 is also disposed between the capacitor element 20 adjacent to the case 40 and the case 40, heat transfer from the outside of the capacitor device 10 to the inside of the device is reduced.

  A third characteristic of the structure of the capacitor device 10 is that a heat pipe 30 having high thermal conductivity is used as a heat radiating member that radiates the heat in the capacitor device 10 to the outside of the device. Moreover, the heat pipe 30 has a rod-like shape, and is suitable for insertion into empty spaces at the four corners of the plurality of capacitor elements 20 laid out in a matrix.

  A fourth structural feature of the capacitor device 10 is that a cooling fan 50 for forcibly cooling the plurality of heat pipes 30 is provided. Accordingly, one end of each of the plurality of heat pipes 30 is cooled by the cooling fan 50, and the heat conduction characteristics of the plurality of heat pipes 30 are further improved. As a result, the heat dissipation of the capacitor device 10 is further improved.

  FIG. 3 is a diagram for explaining the configuration of capacitor element 20 shown in FIG. Referring to FIG. 3, capacitor element 20 is formed by winding sheet-like member 22 in which electrodes and separators are laminated. Thereby, the cross-sectional shape of the capacitor element 20 becomes a bowl-like shape as shown in the figure or a substantially circular shape.

  FIG. 4 is a cross-sectional view of the heat pipe 30 shown in FIG. Referring to FIG. 4, heat pipe 30 includes a cylindrical and hollow metal member 32 and a working fluid 34. The metal member 32 is made of a metal having high thermal conductivity, such as copper or stainless steel. The working fluid 34 is, for example, water, methyl alcohol, benzene, or the like, and is enclosed in the metal member 32.

  In the heat pipe 30, heat outside the heat pipe 30 is absorbed by the working fluid 34 as vaporization energy of the working fluid 34 through the metal member 32. The vaporized working fluid 34 is cooled and liquefied by a cooling fan 50 (not shown) and is returned to the bottom of the metal member 34.

  In the above description, the cooling fan 50 is provided to cool the plurality of heat pipes 30, but a heat sink 60 may be provided instead of the cooling fan 50 as shown in FIG. 5. The heat sink 60 is in close contact with the plurality of heat pipes 30 and dissipates heat from the plurality of heat pipes 30 to the outside of the apparatus.

  As described above, according to this embodiment, since the plurality of heat pipes 30 are disposed in the non-occupied regions of the plurality of capacitor elements 20 disposed in the case 40, the plurality of heat pipes 30 are There is no increase in volume of the capacitor device 10 due to being disposed in the capacitor device 10. Therefore, a small capacitor device 10 is realized.

  Further, since the heat in the capacitor device 10 is effectively radiated to the outside of the device by the plurality of heat pipes 30 having high heat conduction characteristics, the capacitor device 10 having excellent heat dissipation is realized.

  Furthermore, the size and arrangement of the plurality of capacitor elements 20 and the plurality of heat pipes 30 can be changed, and the capacitor device 10 having a high degree of freedom in device configuration is realized.

  Further, since the heat pipe 30 is also disposed between the plurality of capacitor elements 20 and the case 40, heat transfer from the outside of the capacitor device 10 to the inside of the device is reduced. Therefore, the capacitor device 10 is not easily affected by heat from the outside of the device.

  Furthermore, since the cooling fan 50 or the heat sink 60 that forcibly cools the plurality of heat pipes 30 is provided, the heat in the capacitor device 10 can be radiated more effectively to the outside of the device.

  As described above, the capacitor device 10 having such a small size and excellent heat dissipation is strongly required to be downsized, and a plurality of devices, each of which is a heating element, are closely packed in a limited space. It is particularly suitable for a vehicle system to be arranged.

  FIG. 6 is a schematic block diagram of a hybrid vehicle shown as an example of a vehicle system in which the capacitor device 10 shown in FIG. 1 is mounted. Referring to FIG. 6, hybrid vehicle 100 includes a battery B, a boost converter 110, inverters 120 and 130, a capacitor device 10, a capacitor C, power supply lines PL1 and PL2, and a ground line SL. Motor generators MG1 and MG2 are connected to inverters 120 and 130, respectively.

  Motor generators MG1 and MG2 are motor generators, for example, three-phase AC synchronous motor generators. Motor generator MG1 is connected to engine 140 and driven by inverter 120. Motor generator MG <b> 1 starts engine 140 and generates power using the rotational force from engine 140. Motor generator MG2 is connected to drive wheel 150 and driven by inverter 130. Motor generator MG2 drives drive wheel 150 and generates electric power by the rotational force from drive wheel 150 during regenerative braking of hybrid vehicle 100.

  Battery B, which is a direct current power source, is a secondary battery that can be charged and discharged. Battery B is connected to boost converter 110 and outputs the generated DC voltage to boost converter 110. Battery B is charged by a DC voltage output from boost converter 110.

  Boost converter 110 boosts the DC voltage supplied from battery B and outputs the boosted voltage to inverters 120 and 130. Boost converter 110 steps down DC voltage received from inverters 120 and / or 130 to the voltage level of battery B and charges battery B.

  Inverter 120 receives the output from engine 140, converts the three-phase AC voltage generated by motor generator MG1 into a DC voltage, and outputs the converted DC voltage to boost converter 110. Inverter 120 also converts DC voltage supplied from boost converter 110 into a three-phase AC voltage to drive motor generator MG1.

  Inverter 130 converts the DC voltage supplied from boost converter 110 into a three-phase AC voltage, and drives motor generator MG2. Inverter 130 also converts the three-phase AC voltage generated by motor generator MG2 by receiving the rotational force from drive wheel 150 during regenerative braking of hybrid vehicle 100 into a DC voltage, and the converted DC voltage is boosted converter 110. Output to.

  Capacitor device 10 is connected between power supply line PL2 and ground line SL, and smoothes voltage fluctuations between power supply line PL2 and ground line SL. That is, a ripple voltage is generated in power supply line PL2 by the switching operations of inverters 120 and 130 and boost converter 110, and capacitor device 10 smoothes voltage fluctuations due to such ripple voltage and the like. Capacitor C is connected between power supply line PL1 and ground line SL, and smoothes voltage fluctuations between power supply line PL1 and ground line SL.

  In the above-described embodiment, the capacitor device 10 includes nine capacitor elements 20, but the number of the plurality of capacitor elements 20 is not limited to this. Further, although the plurality of capacitor elements 20 are arranged in a matrix, the arrangement of the plurality of capacitor elements 20 is not limited to that arranged in a matrix.

  Furthermore, although the plurality of heat pipes 30 are disposed in the empty spaces at the four corners of each of the plurality of capacitor elements 20, the plurality of heat pipes 30 are disposed in the other empty spaces in the case 40. May be. Furthermore, the number of the plurality of heat pipes 30 is not limited to 16 as described above.

  Moreover, the member for radiating the heat in the capacitor device 10 to the outside of the device is not limited to the plurality of heat pipes 30 and may be other heat radiating members. For example, a heat sink may be provided between adjacent capacitor elements 20.

  Moreover, the cross-sectional shape of the plurality of capacitor elements 20 is not limited to the bowl shape, but may be other shapes, for example, a substantially circular shape. Furthermore, the cross-sectional shape of the plurality of heat pipes 30 is not limited to the illustrated substantially circular shape, and may be other shapes.

  In the hybrid vehicle 100 described above, the capacitor device according to the present invention can also be applied to the capacitor C connected in parallel to the battery B.

  In the above description, the capacitor device 10 is mounted on a hybrid vehicle. However, the scope of application of the present invention is not limited to the capacitor device mounted on a hybrid vehicle, but an electric vehicle or a fuel cell vehicle. It may be a capacitor device mounted on the like.

  In the above embodiment, the plurality of heat pipes 30 correspond to the “plurality of heat radiating members” and the “plurality of rod-shaped heat conduction members” in the present invention. The case 40 corresponds to the “casing” in the present invention, and each of the cooling fan 50 and the heat sink 60 corresponds to the “cooler” in the present invention.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and is intended to include meanings equivalent to the scope of claims for patent and all modifications within the scope.

It is a top view of the capacitor | condenser apparatus by embodiment of this invention. It is sectional drawing of the cross section II-II of the capacitor | condenser apparatus shown in FIG. It is a figure for demonstrating the structure of the capacitor | condenser element shown in FIG. It is sectional drawing of the heat pipe shown in FIG. It is sectional drawing which shows the other structure of the capacitor | condenser apparatus by embodiment of this invention. It is a schematic block diagram of the hybrid vehicle shown as an example of the vehicle system carrying the capacitor | condenser apparatus shown in FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 Capacitor device, 20 Capacitor element, 22 Sheet-like member, 30 Heat pipe, 32 Metal member, 34 Working fluid, 40 Case, 50 Cooling fan, 60 Heat sink, 110 Boost converter, 120, 130 Inverter, 140 Engine, 150 Drive wheel , B battery, C capacitor, MG1, MG2 motor generator, PL1, PL2 power line, SL ground line.

Claims (6)

A housing,
A plurality of capacitor elements which are spread in close contact with each other in the housing;
A capacitor device comprising: a plurality of heat dissipating members disposed in an unoccupied region of the plurality of capacitors in the housing.   The capacitor device according to claim 1, wherein the plurality of heat dissipating members are disposed in an unoccupied region of the plurality of capacitors generated between the plurality of capacitor elements.   The capacitor device according to claim 2, wherein the plurality of heat dissipating members are further disposed in an unoccupied region of the plurality of capacitors generated between the housing and the plurality of capacitor elements. The plurality of capacitor elements are arranged in a matrix in the housing,
Each of the plurality of heat dissipating members includes a rod-like heat conducting member,
The plurality of rod-shaped heat conducting members are disposed at least at four corners of each of the plurality of capacitor elements along a substantially normal direction of a surface on which the plurality of capacitor elements are arranged in a matrix. The capacitor | condenser apparatus of any one of Claims 1-3.   5. The capacitor device according to claim 1, wherein each of the plurality of heat radiation members includes a heat pipe.   The capacitor device according to claim 5, further comprising a cooler that cools one end of the plurality of heat pipes.

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