JP2009159767A - Power conversion apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a power conversion apparatus which suppresses the deformation of an electronic circuit board and which is compact and has an excellent heat dissipation property. <P>SOLUTION: The power conversion apparatus 1 has a plurality of electronic circuit boards 2. The plurality of electronic circuit boards 2 are disposed in layers, being spaced apart from each other, in the thickness direction. Between the plurality of electronic circuit boards 2, a pair of metallic stays 3 is disposed along a pair of end edges 21 which constitute the sides opposite to each other in the electronic circuit boards 2. The plurality of electronic circuit boards 2 are fixed to the pair of stays 3 at the end edges 21. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a power conversion device such as an inverter or a converter provided with a plurality of electronic circuit boards.

For example, electric vehicles, hybrid vehicles, and the like are equipped with power conversion devices such as inverters and converters for converting power supply power into drive power for driving a drive motor. Such a power converter performs power conversion by switching operations of a plurality of semiconductor modules.
The power converter is mounted with an electronic circuit board having a drive circuit for switching and driving the plurality of semiconductor modules, a control circuit for controlling a drive state based on various vehicle information, and the like.

As this electronic circuit board, two boards for a high voltage system and a low voltage system may be used. For example, a high-voltage electronic circuit board that constitutes a drive circuit and a low-voltage electronic circuit board that constitutes a control circuit may be used. When arranging the two electronic circuit boards in the power converter, they are arranged so as to be stacked in the thickness direction while providing a space between them. At this time, it is considered that a boss is interposed between the two electronic circuit boards as shown in FIG.
That is, as shown in FIG. 9, the two electronic circuit boards 92 are fixed to each other via the bosses 93 in the vicinity of the end portions. In addition, the two electronic circuit boards 92 fixed to each other are fixed to the case.

Japanese Utility Model Publication No. 58-3790

However, if the two electronic circuit boards 92 are fixed using the bosses 93 near the end of the electronic circuit board 92 as described above, the electronic circuit board 92 is likely to be deformed when an external force is applied due to, for example, a vehicle collision. There's a problem. Therefore, when the electronic circuit board 92 is deformed, in order to prevent the two electronic circuit boards 92 from coming into contact with each other, it is necessary to increase the distance between the two. As a result, it is difficult to reduce the size of the power converter.
In addition, when the electronic circuit boards 92 are stacked in multiple stages as described above, there is a problem that it is difficult to dissipate heat from the electronic components disposed between the electronic circuit boards 92.

  The present invention has been made in view of such conventional problems, and an object of the present invention is to provide a power conversion device that suppresses deformation of an electronic circuit board, is small, and has excellent heat dissipation.

The present invention is a power converter having a plurality of electronic circuit boards,
The plurality of electronic circuit boards are stacked in the thickness direction while providing a space between each other,
Between the plurality of electronic circuit boards, a pair of metal stays arranged along a pair of end edges that constitute opposite sides of the electronic circuit board are disposed,
The plurality of electronic circuit boards may be fixed to the pair of stays at the edges of the electronic circuit boards. (Claim 1)

Next, the function and effect of the present invention will be described.
In the power conversion device, a pair of metal stays arranged along a pair of end edges constituting opposite sides of the electronic circuit board are disposed between the plurality of electronic circuit boards. . The plurality of electronic circuit boards are fixed to the pair of stays. Accordingly, the plurality of electronic circuit boards are fixed to each other by the stay at the pair of end edges, and the electronic circuit board can be given rigidity. Therefore, even if an external force is applied, the electronic circuit board can be prevented from being greatly deformed.
In addition, since the deformation of the electronic circuit board can be suppressed in this way, the interval between the plurality of electronic circuit boards can be reduced, and the power converter can be easily downsized.

  In addition, since the metal stay is disposed along the pair of edges between the plurality of electronic circuit boards, heat dissipation of the electronic components arranged between the electronic circuit boards can be performed. It becomes possible to carry out via. That is, for example, by disposing an electronic component that particularly requires heat dissipation in contact with or in proximity to the stay, the heat dissipation of the electronic component can be effectively performed through the stay.

  As described above, according to the present invention, it is possible to provide a power converter that suppresses deformation of an electronic circuit board, is small, and has excellent heat dissipation.

In the present invention (Claim 1), it is preferable that the pair of stays are coupled to each other by a coupling portion that couples the two stays (Claim 2).
In this case, the rigidity of the electronic circuit board can be further improved, and deformation of the electronic circuit board can be more effectively suppressed. Moreover, in this case, since the heat from the electronic component can be received also in the connecting portion, a power conversion device having further excellent heat dissipation can be obtained.

Moreover, it is preferable that the said connection part is a plate-shaped object distribute | arranged substantially parallel to the said electronic circuit board (Claim 3).
In this case, the connecting portion can be disposed between the pair of electronic circuit boards so as to face the electronic component. Therefore, heat dissipation of the electronic component can be performed more effectively through the connecting portion.

Further, it is preferable that at least one of the pair of stays supports the electronic circuit board also in a portion other than a fixing portion with the electronic circuit board.
In this case, the rigidity of the electronic circuit board can be further improved, and deformation of the electronic circuit board can be more effectively suppressed.
In addition, it is more preferable that both of the pair of stays support the electronic circuit board also in a portion other than a portion fixed to the electronic circuit board.

Further, it is preferable that at least one of the pair of stays is in contact with an electronic component mounted on the electronic circuit board.
In this case, heat dissipation of the electronic component can be performed more effectively.
Note that an electronic component may be in contact with one of the pair of stays, or an electronic component may be in contact with both.

Further, it is preferable that at least one of the pair of stays has a heat radiating fin formed on an outer surface (Claim 6).
In this case, the heat received by the stay can be released into the air through the radiation fin. Therefore, it is possible to obtain a power conversion device that is further excellent in heat dissipation.
In addition, it is more preferable that both of the stays have radiating fins formed on the outer surface.

Moreover, it is preferable that at least one of the pair of stays is fixed to a metal case of the power conversion device.
In this case, heat of the electronic component can be released by heat transfer to the case through the stay. Therefore, it is possible to obtain a power conversion device that is further excellent in heat dissipation.
It is more preferable that both the stays are fixed to the case.

Example 1
A power converter according to an embodiment of the present invention will be described with reference to FIGS.
The power converter 1 of this example has the two electronic circuit boards 2 as shown in FIGS.
The two electronic circuit boards 2 are stacked in the thickness direction while providing a space between them.
Between the two electronic circuit boards 2, a pair of metal stays 3 arranged along a pair of end edges 21 constituting opposite sides of the electronic circuit board 2 are arranged. .
The two electronic circuit boards 2 are fixed to the pair of stays 3 at the edge 21 thereof.

As shown in FIGS. 2 and 4, the two electronic circuit boards 2 have a rectangular shape in plan view, and an edge 21 constituting the long side is fixed to the stay 3.
The two electronic circuit boards 2 are each fixed to the stay 3 with screws 11. A pair of end edges 21 in each electronic circuit board 2 are fixed to the stay 3 by screws 11 at three locations. Two of these three locations hit the corners of the electronic circuit board 2 and the other one hits a substantially intermediate position.

  One of the two electronic circuit boards 2 is a relatively high-voltage high-voltage electronic circuit board 201 having a drive circuit for switching and driving a plurality of semiconductor modules, and the other is driven based on various vehicle information. This is a low-voltage electronic circuit board 202 having a control circuit for controlling the state.

Then, the high-voltage electronic circuit board 201 is fixed to one end face 311 of the stay 3, and the low-voltage electronic circuit board 202 is fixed to the other end face 312 of the stay 3. The end surface 311 and the end surface 312 of the stay 3 are respectively formed on planes that are orthogonal to the stacking direction of the electronic circuit board 2 and are parallel to each other. As shown in FIG. 4, the stay 3 includes a boss portion 33 provided with a screw hole for screwing the screw 11 and a connecting portion 34 formed so as to connect the boss portion 33. As shown in FIG. 2, in the boss portion 33 and the connecting portion 34, the end surfaces 311 and 312 constitute a flat surface that exists on the same plane.
Therefore, the stay 3 is in contact with the electronic circuit board 2 and supports the electronic circuit board 2 in both the fixing part to the electronic circuit board 2, that is, the boss part 33 and the other part, that is, the connecting part 34. Yes.

  Moreover, the stay 3 has the flange part 35 for fixing to the support body 12 which comprises a part of case of the power converter device 1 in the both ends of the length direction, and the substantially intermediate position. The flange portion 35 is provided with an insertion hole through which the screw 11 is inserted. As a result, as shown in FIG. 1, the screw 11 is inserted into the flange portion 35 and the screw 11 is screwed into the screw hole provided in the substrate mounting portion 121 of the support 12 to thereby form two electronic circuit boards. A pair of stays 3 to which 2 is fixed are fixed to the support 12.

  Further, the support 12 has a module mounting portion 122 for mounting the power module 13 constituted by a plurality of semiconductor modules, bus bars connecting their electrode terminals, cooling means for the semiconductor modules, and the like inside the substrate mounting portion 121. Have A first cover 141 that covers the electronic circuit board 2 side is fixed at a position outside the board mounting portion 121 in the support 12. A second cover 142 is fixed to the support 12 on the side opposite to the substrate mounting part 121. The first cover 141, the second cover 142, and the support 12 constitute a case of the power conversion device 1.

  The high-voltage electronic circuit board 201 is disposed on the side close to the power module 13, and the low-voltage electronic circuit board 202 is disposed on the side far from the power module 13. Control terminals 131 provided on a plurality of semiconductor modules in the power module 13 are connected to the electronic circuit board 201.

Further, as shown in FIG. 5, at least one of the pair of stays 3 is in contact with an electronic component 15 mounted on the electronic circuit board 2.
The stay 3, the support 12, the first cover 141, and the second cover 142 are all made of aluminum or an alloy thereof.

Next, the function and effect of this example will be described.
In the power conversion device 1, a pair of metal stays 3 arranged between a pair of electronic circuit boards 2 along a pair of end edges 21 constituting opposite sides of the electronic circuit board 2. Is arranged. The two electronic circuit boards 2 are fixed to a pair of stays 3. Thus, the two electronic circuit boards 2 are fixed to each other by the stay 3 at the pair of end edges 21, and the electronic circuit board 2 can be given rigidity. Therefore, even when an external force is applied, the electronic circuit board 2 can be prevented from being greatly deformed.
Moreover, since the deformation | transformation of the electronic circuit board 2 can be suppressed in this way, the space | interval between the two electronic circuit boards 2 can be made small, and size reduction of the power converter device 1 can be made easy.

  In addition, since the metal stay 3 is disposed between the two electronic circuit boards 2 along the pair of end edges 21, heat dissipation of the electronic components disposed between the electronic circuit boards 2 can be performed. It becomes possible to carry out via the stay 2. That is, for example, as shown in FIG. 5, an electronic component 15 (for example, a transformer, an electrolytic capacitor, etc.) that particularly needs to be dissipated is placed in contact with or in proximity to the stay 3, so Heat can be effectively dissipated.

  In addition, the stay 3 supports the electronic circuit board 2 also in a portion other than a portion fixed to the electronic circuit board 2. That is, the electronic circuit board 2 is in contact with the stay 3 at the boss portion 33 of the stay 3, but the electronic circuit board 2 is in contact with the stay 3 at the connecting portion 34. Thereby, the rigidity of the electronic circuit board 2 can be further improved, and the deformation of the electronic circuit board 2 can be more effectively suppressed.

  The stay 3 is fixed to a support 12 that is a part of the case of the power conversion device 1. Therefore, the heat of the electronic component can be released by heat transfer to the case via the stay 3. Therefore, it is possible to obtain the power conversion device 1 that is further excellent in heat dissipation.

  As described above, according to this example, it is possible to provide a power converter that suppresses deformation of the electronic circuit board, is small, and has excellent heat dissipation.

(Example 2)
In this example, as shown in FIG. 6, the radiation fins 36 are formed on the outer surface of the stay 3.
That is, each of the pair of stays 3 is provided with a number of protrusion-like heat radiation fins 36 protruding outward from the outer surface. These radiating fins 36 can be formed integrally with the main body of the stay 3 and are made of aluminum or an alloy thereof.
Others are the same as in the first embodiment.

In the case of this example, the heat received by the stay 3 can be released into the air via the radiation fins 36 in addition to the heat transfer to the case (support 12). Therefore, it is possible to obtain the power conversion device 1 that is further excellent in heat dissipation.
In addition, the same effects as those of the first embodiment are obtained.

(Example 3)
In this example, as shown in FIGS. 7 and 8, the pair of stays 3 are connected to each other by a connecting portion 37 that connects them.
That is, the connection part 37 is formed in three places, the vicinity of the both ends of a pair of stay 3 in the longitudinal direction, and the intermediate part vicinity. Further, each connecting portion 37 is a plate-like body that is arranged substantially in parallel with the electronic circuit board 2.
These connecting portions 37 can be formed integrally with the main body of the stay 3 and are made of aluminum or an alloy thereof.
Others are the same as in the first embodiment.

In the case of this example, the rigidity of the electronic circuit board 2 can be further improved, and the deformation of the electronic circuit board 2 can be more effectively suppressed. Moreover, in this case, since the heat can be received from the electronic component also in the connecting portion 37, the power conversion device 1 having further excellent heat dissipation can be obtained.
Moreover, since the connection part 37 is a plate-like body arranged substantially parallel to the electronic circuit board 2, the connection part 37 is disposed close to the electronic circuit board 2 so as to face the electronic component. Can do. Therefore, heat dissipation of the electronic component can be performed more effectively via the connecting portion 37.
In addition, the same effects as those of the first embodiment are obtained.

In the first to third embodiments, the configuration in which there are two electronic circuit boards 2 has been described. However, the present invention can also be applied to a case where three or more electronic circuit boards are stacked.
Further, by disposing the stay 3 in contact with a cooling means such as a cooler for cooling the power module 13, the heat radiation efficiency between the electronic circuit boards 2 can be improved.

Sectional explanatory drawing of the power converter device in Example 1. FIG. 2 is a perspective view of a pair of electronic circuit boards fixed to a stay in Embodiment 1. FIG. FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. FIG. 4 is a cross-sectional view taken along line B-B in FIG. 3. Explanatory drawing of the state which made the electronic component contact the stay in Example 1. FIG. FIG. 9 is an explanatory plan view of a pair of electronic circuit boards fixed to a stay in the second embodiment. FIG. 9 is an explanatory plan view of a pair of electronic circuit boards fixed to a stay in Example 3. CC sectional view taken on the line of FIG. The perspective view of the state in which a pair of electronic circuit board was fixed with the boss | hub in a prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Power converter 2 Electronic circuit board 21 Edge 3 Stay

Claims (7)

A power converter having a plurality of electronic circuit boards,
The plurality of electronic circuit boards are stacked in the thickness direction while providing a space between each other,
Between the plurality of electronic circuit boards, a pair of metal stays arranged along a pair of end edges that constitute opposite sides of the electronic circuit board are disposed,
The power conversion device, wherein the plurality of electronic circuit boards are fixed to the pair of stays at their edges.   The power conversion device according to claim 1, wherein the pair of stays are connected to each other by a connecting portion that connects the stays.   3. The power conversion device according to claim 2, wherein the connecting portion is a plate-like body that is disposed substantially parallel to the electronic circuit board.   The electric power according to any one of claims 1 to 3, wherein at least one of the pair of stays supports the electronic circuit board also in a portion other than a fixing portion with the electronic circuit board. Conversion device.   5. The power converter according to claim 1, wherein an electronic component mounted on the electronic circuit board is in contact with at least one of the pair of stays.   6. The power conversion device according to claim 1, wherein at least one of the pair of stays has a heat radiating fin formed on an outer surface.   The power converter according to any one of claims 1 to 6, wherein at least one of the pair of stays is fixed to a metal case of the power converter.

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