JP2016119440A - Capacitor - Google Patents

Capacitor Download PDF

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JP2016119440A
JP2016119440A JP2014259832A JP2014259832A JP2016119440A JP 2016119440 A JP2016119440 A JP 2016119440A JP 2014259832 A JP2014259832 A JP 2014259832A JP 2014259832 A JP2014259832 A JP 2014259832A JP 2016119440 A JP2016119440 A JP 2016119440A
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capacitor
electrode plate
external connection
insulator
capacitor element
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JP6478264B2 (en
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真教 石田
Masanori Ishida
真教 石田
裕二 塩見
Yuji Shiomi
裕二 塩見
勇太 岡部
Yuta Okabe
勇太 岡部
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Shizuki Electric Co Inc
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Shizuki Electric Co Inc
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Abstract

PROBLEM TO BE SOLVED: To provide a capacitor which attains sufficient cooling effect even when achieving downsizing and cost reduction.SOLUTION: In a capacitor, a capacitor element 2 and first and second electrode plates 8, 9 connected with the capacitor element 2 are housed in a case and the case is filled with a resin. Exterior connection parts 8b, 9b of the first and second electrode plates 8, 9 which are pulled out to the outside of the case overlap with each other through an insulative heat conduction sheet 14. The capacitor has a contact part 11g for placing cooling means 16 in contact therewith.SELECTED DRAWING: Figure 4

Description

この発明は、コンデンサ素子をケースに収納し樹脂を充填したコンデンサに関し、特に冷却に適したコンデンサに関する。   The present invention relates to a capacitor in which a capacitor element is housed in a case and filled with resin, and more particularly to a capacitor suitable for cooling.

複数のコンデンサ素子を電極板とともにケースに収納し樹脂を充填してなるコンデンサは、従来から広く用いられている。   A capacitor in which a plurality of capacitor elements are housed in a case together with an electrode plate and filled with resin has been widely used.

ところで、コンデンサに通電すると、コンデンサ素子や電極板が発熱する。特に、コンデンサを大電流用や高周波共振用として使用した場合には、発熱が大きくなり易い。また、コンデンサに接続される機器（例えばＩＧＢＴ：絶縁ゲートバイポーラトランジスタ）からも電極板を介して熱が伝わってくる。さらに、コンデンサ素子が樹脂によって覆われていることから、ケース内に熱がこもり易い。そのため、上記構成のコンデンサは、熱によってコンデンサ素子の特性劣化が生じ易いといった問題がある。   By the way, when the capacitor is energized, the capacitor element and the electrode plate generate heat. In particular, when a capacitor is used for large current or high frequency resonance, heat generation tends to increase. In addition, heat is transmitted from the device (for example, IGBT: insulated gate bipolar transistor) connected to the capacitor via the electrode plate. Furthermore, since the capacitor element is covered with resin, heat is likely to be trapped in the case. Therefore, the capacitor having the above configuration has a problem that the characteristic of the capacitor element is easily deteriorated by heat.

そこで、特許文献１では、コンデンサ本体から取り出した電極板に冷却器を当接させることで、電極板及びコンデンサ本体の冷却（放熱）を促し、上記問題の解決を図っている。   Therefore, in Patent Document 1, a cooler is brought into contact with the electrode plate taken out from the capacitor body to promote cooling (heat radiation) of the electrode plate and the capacitor body, thereby solving the above problem.

特開２００３−４７２５９号公報JP 2003-47259 A

ところが、特許文献１に開示された構成は、正負いずれか一方の電極板に冷却器を当接させているに過ぎない。従って、冷却器と当接しない他方の電極板は、電極板間に介在する絶縁体を介して、冷却器と当接する一方の電極板側に熱を伝えることになるが、絶縁体として使用されているポリプロピレンやマイカシート、樹脂等（特許文献１の段落［００２７］参照）は熱伝導率が低いため、熱の伝達が思うように進まず、他方の電極板の冷却が不十分となり易い。冷却を促すために、例えば正負電極板にそれぞれ冷却器を当接させることも考えられるが、冷却器は通常、導電性を有することから、短絡を防ぐために、電気的に独立した冷却器を別途設けることが好ましく、結果、装置の大型化やコスト増に繋がってしまう。   However, the configuration disclosed in Patent Document 1 merely has a cooler in contact with either the positive or negative electrode plate. Therefore, the other electrode plate not in contact with the cooler transfers heat to the one electrode plate in contact with the cooler via an insulator interposed between the electrode plates, but is used as an insulator. Polypropylene, mica sheet, resin, etc. (see paragraph [0027] of Patent Document 1) have low thermal conductivity, so that heat transfer does not proceed as expected, and the other electrode plate tends to be insufficiently cooled. In order to promote cooling, for example, it is conceivable to bring a cooler into contact with each of the positive and negative electrode plates. However, since the cooler is usually conductive, an electrically independent cooler is separately provided to prevent a short circuit. It is preferable to provide it, and as a result, it leads to an increase in size and cost of the apparatus.

そこで、本発明は、上記課題を解決するためになされたものであって、小型化や低コスト化を図りながらも、十分な冷却効果を得られるコンデンサの提供を目的とする。   Therefore, the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a capacitor that can obtain a sufficient cooling effect while achieving downsizing and cost reduction.

上記課題を解決するため、本願のコンデンサは、コンデンサ素子２と、このコンデンサ素子２に接続された正負電極板８、９とをケース４に収納し樹脂５を充填したコンデンサ１であって、ケース４の外方に引き出された正負電極板８、９の外部接続部８ｂ、９ｂは、絶縁性を有する熱伝導シート１４を介して重なり合っているとともに、冷却手段１６を当接させるための当接部１１ｇを有していることを特徴としている。   In order to solve the above problems, the capacitor of the present application is a capacitor 1 in which a capacitor element 2 and positive and negative electrode plates 8 and 9 connected to the capacitor element 2 are housed in a case 4 and filled with a resin 5. 4, the external connection portions 8 b and 9 b of the positive and negative electrode plates 8 and 9 drawn out to the outside overlap with each other via an insulating heat conductive sheet 14 and contact with the cooling means 16. It has the part 11g.

また、外部接続部８ｂ、９ｂ間には、熱伝導シート１４の他に絶縁体１５が介在しており、この絶縁体１５には、熱伝導シート１４と対向する部分に開口１５ｂが設けられてい
ることが好ましい。 In addition to the heat conductive sheet 14, an insulator 15 is interposed between the external connection portions 8b and 9b. The insulator 15 is provided with an opening 15b at a portion facing the heat conductive sheet 14. Preferably it is.

この発明のコンデンサでは、正負電極板の外部接続部が熱伝導シートを介して重なり合っているため、いずれか一方の電極板に冷却手段を当接させれば、他方の電極板も自ずと冷却されることになる。そのため、他方の電極板のために別途、冷却手段を設ける必要は無く、小型化や低コスト化を実現しながらも十分な冷却効果を得ることができる。また、電極板の厚みが薄いと抵抗が増して発熱量が増加することから、通常、電極板はある程度の厚みを有しているが、このように正負電極板の双方を冷却すれば、電極板の厚みを薄くすることも可能であり、一層のコスト削減を図ることができる。さらに、コンデンサを大電流用として用いることも可能となる。   In the capacitor according to the present invention, since the external connection portions of the positive and negative electrode plates overlap with each other through the heat conductive sheet, if the cooling means is brought into contact with one of the electrode plates, the other electrode plate is naturally cooled. It will be. Therefore, it is not necessary to provide a separate cooling means for the other electrode plate, and a sufficient cooling effect can be obtained while realizing a reduction in size and cost. In addition, since the resistance increases and the amount of heat generation increases when the electrode plate is thin, the electrode plate usually has a certain thickness, but if both the positive and negative electrode plates are cooled in this manner, the electrode plate It is possible to reduce the thickness of the plate, and further cost reduction can be achieved. Furthermore, a capacitor can be used for a large current.

また、外部接続部間に、熱伝導シートの他に絶縁体が介在しており、この絶縁体に、熱伝導シートと対向する部分に開口が設けられていれば、外部接続部間の絶縁の確実性を高めながらも、正負電極板と熱伝導シートとを直接当接させることができる。   In addition to the heat conduction sheet, an insulator is interposed between the external connection portions. If an opening is provided in the insulator in a portion facing the heat conduction sheet, the insulation between the external connection portions is reduced. While increasing the reliability, the positive and negative electrode plates and the heat conductive sheet can be brought into direct contact with each other.

この発明の一実施形態に係るコンデンサを示す斜視図である。It is a perspective view showing a capacitor concerning one embodiment of this invention. 同じくそのコンデンサの分解斜視図である。Similarly, it is an exploded perspective view of the capacitor. コンデンサ素子と電極板との接続状態を示す斜視図である。It is a perspective view which shows the connection state of a capacitor | condenser element and an electrode plate. 図３の端面図である。FIG. 4 is an end view of FIG. 3.

次に、この発明のコンデンサの一実施形態を図面に基づいて詳細に説明する。この発明のコンデンサ１は、図１及び図２に示すように、複数のコンデンサ素子２と、これらコンデンサ素子２に接続された電極板３とをケース４内に収納し樹脂５を充填することにより構成されている。以下、各構成部品について説明する。   Next, one embodiment of the capacitor of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, the capacitor 1 of the present invention includes a plurality of capacitor elements 2 and electrode plates 3 connected to the capacitor elements 2 in a case 4 and filled with a resin 5. It is configured. Hereinafter, each component will be described.

コンデンサ素子２は、例えば絶縁性のフィルム上に金属を蒸着した金属化フィルムを巻回するとともに、断面形状を円形から略楕円形になるように押圧することで形成されたフィルムコンデンサであって、図２に示すように、その側面には、巻回による湾曲部２ａと押圧による平坦部２ｂが形成されている。また、軸方向両端部には、メタリコンを溶射してなる電極部２ｃ、２ｃが形成されている。また、これら電極部２ｃ、２ｃには、例えば軟銅線からなるリード端子６がスポット溶接や半田付けによってそれぞれ接続されている。そして、コンデンサ素子２は、平坦部２ｂ、２ｂ同士、電極部２ｃ、２ｃ同士を互いに対向させるようにして、軸方向及びそれと直交する方向に複数並設され、コンデンサ素子群７を形成している。   The capacitor element 2 is a film capacitor formed by, for example, winding a metallized film obtained by vapor-depositing a metal on an insulating film and pressing the cross-sectional shape from a circular shape to a substantially elliptical shape, As shown in FIG. 2, a curved portion 2a by winding and a flat portion 2b by pressing are formed on the side surfaces. Further, electrode portions 2c and 2c formed by thermally spraying metallicon are formed at both ends in the axial direction. Further, lead terminals 6 made of, for example, annealed copper wire are connected to these electrode portions 2c and 2c by spot welding or soldering, respectively. A plurality of capacitor elements 2 are arranged side by side in the axial direction and in a direction orthogonal thereto so that the flat portions 2b and 2b and the electrode portions 2c and 2c face each other, thereby forming a capacitor element group 7. .

電極板３は、図１及び図２に示すように、コンデンサ素子２の一方の電極部（例えば正極となる側）２ｃと外部機器（例えばＩＧＢＴ）との接続に供される第１電極板（例えば正電極板）８と、コンデンサ素子２の他方の電極部（例えば負極となる側）２ｃと外部機器との接続に供される第２電極板（例えば負電極板）９とから構成されている。   As shown in FIG. 1 and FIG. 2, the electrode plate 3 is a first electrode plate (for example, a positive electrode) 2c of the capacitor element 2 and a first electrode plate (for example, IGBT) provided for connection to an external device (for example, IGBT). For example, a positive electrode plate) 8 and a second electrode plate (for example, a negative electrode plate) 9 provided for connection between the other electrode portion (for example, the negative electrode side) 2c of the capacitor element 2 and an external device. Yes.

また、第１、第２電極板８、９はそれぞれ、コンデンサ素子２と接続されるリップル電極板１０、１２と、ＤＣ電源と接続されるＤＣ電極板１１、１３とから構成されている。   The first and second electrode plates 8 and 9 are respectively composed of ripple electrode plates 10 and 12 connected to the capacitor element 2 and DC electrode plates 11 and 13 connected to a DC power source.

第１電極板８のリップル電極板（以下、第１リップル電極板と称す）１０は、例えば銅板をプレス成型することでなる。具体的には、図２に示すように、コンデンサ素子群７の側面を覆う基板部１０ａと、基板部１０ａの一辺（図において上辺）から略Ｌ字状に折曲して延出されてなる外部接続部１０ｂとから構成されている。基板部１０ａには、コンデ
ンサ素子２の一方の電極部２ｃに接続されたリード端子６と接続可能なように、このリード端子６と対向する位置に接続孔１０ｃが設けられている。また、コンデンサ素子２の他方の電極部２ｃに接続されたリード端子６との接続を避けるために、このリード端子６と対向する位置に接続回避孔１０ｄが設けられている。外部接続部１０ｂには、その先端部に外部機器との接続に供する突出片１０ｅ及び連結孔１０ｆが設けられている。 The ripple electrode plate (hereinafter referred to as the first ripple electrode plate) 10 of the first electrode plate 8 is formed, for example, by press-molding a copper plate. Specifically, as shown in FIG. 2, a board portion 10 a that covers the side surface of the capacitor element group 7, and is bent and extended in a substantially L shape from one side (upper side in the drawing) of the board portion 10 a. It is comprised from the external connection part 10b. A connection hole 10 c is provided at a position facing the lead terminal 6 in the substrate part 10 a so that the lead terminal 6 connected to one electrode part 2 c of the capacitor element 2 can be connected. Further, in order to avoid connection with the lead terminal 6 connected to the other electrode portion 2 c of the capacitor element 2, a connection avoidance hole 10 d is provided at a position facing the lead terminal 6. The external connection portion 10b is provided with a projecting piece 10e and a connecting hole 10f provided at the tip of the external connection portion 10b for connection with an external device.

第１電極板８のＤＣ電極板（以下、第１ＤＣ電極板と称す）１１は、例えば銅板をプレス成型することでなる。具体的には、図２に示すように、コンデンサ素子群７の側面を半分程度覆う基板部１１ａと、基板部１１ａの一辺（図において上辺）から略Ｌ字状に折曲して延出されてなる外部接続部１１ｂと、基板部１１ａの外部接続部１１ｂが延出されている辺とは異なる一辺（図において左手前の辺）からコンデンサ素子２の電極部２ｃに沿うようにして折曲して延出されてなる電源接続部１１ｃとから構成されている。外部接続部１１ｂは、第１リップル電極板１０と同様に、その先端部に外部機器との接続に供する突出片１１ｄ及び連通孔１１ｅが設けられている。また、電源接続部１１ｃには、その先端部にＤＣ電源と接続するための接続端子１１ｆが設けられている。   The DC electrode plate (hereinafter referred to as the first DC electrode plate) 11 of the first electrode plate 8 is formed by press molding a copper plate, for example. Specifically, as shown in FIG. 2, a board portion 11 a that covers about half of the side surface of the capacitor element group 7, and is bent and extended in a substantially L shape from one side (the upper side in the figure) of the board portion 11 a. The external connection part 11b and the external connection part 11b of the substrate part 11a are bent from one side (the left front side in the figure) along the electrode part 2c of the capacitor element 2 from the side where the external connection part 11b extends. And a power supply connection portion 11c that is extended. As with the first ripple electrode plate 10, the external connection portion 11 b is provided with a protruding piece 11 d and a communication hole 11 e provided for connection with an external device at the tip. The power connection portion 11c is provided with a connection terminal 11f for connecting to a DC power source at the tip portion.

そして、図３に示すように、第１ＤＣ電極板１１が外側になるように、第１リップル電極板１０と第１ＤＣ電極板１１の基板部１０ａ、１１ａ同士、外部接続部１０ｂ、１１ｂ同士を重ね合わせることで、第１電極板８としての基板部８ａと外部接続部８ｂとが構成されている。   Then, as shown in FIG. 3, the first ripple electrode plate 10 and the substrate portions 10a and 11a of the first DC electrode plate 11 and the external connection portions 10b and 11b are overlapped so that the first DC electrode plate 11 is outside. Together, a substrate portion 8a as the first electrode plate 8 and an external connection portion 8b are configured.

第２電極板９のリップル電極板（以下、第２リップル電極板と称す）１２とＤＣ電極板（以下、第２ＤＣ電極板と称す）１３は、図２及び図３に示すように、第１電極板８の第１リップル電極板１０や第１ＤＣ電極板１１と略同様であって、第２リップル電極板１２と第２ＤＣ電極板１３とを重ね合わせることで、第２電極板９としての基板部９ａと外部接続部９ｂとが構成されている。なお、正負の違いに起因して、接続孔１０ｃや接続回避孔１０ｄ、突出片１０ｅ、１１ｄの位置が入れ替わったり、ずれたりしている点、第２リップル電極板１２と第２ＤＣ電極板１３との間にコンデンサ素子群７が介在している点で第１電極板８と相違しているが、その他の構成については、第１電極板８と同様であることから、同じ添え字を付し、詳細な説明は省略する。   A ripple electrode plate (hereinafter referred to as a second ripple electrode plate) 12 and a DC electrode plate (hereinafter referred to as a second DC electrode plate) 13 of the second electrode plate 9 are, as shown in FIGS. The electrode plate 8 is substantially the same as the first ripple electrode plate 10 and the first DC electrode plate 11, and the second ripple electrode plate 12 and the second DC electrode plate 13 are overlapped to form a substrate as the second electrode plate 9. A portion 9a and an external connection portion 9b are configured. In addition, due to the difference between positive and negative, the positions of the connection hole 10c, the connection avoidance hole 10d, and the protruding pieces 10e and 11d are switched or shifted, and the second ripple electrode plate 12 and the second DC electrode plate 13 Is different from the first electrode plate 8 in that the capacitor element group 7 is interposed between them, but the other components are the same as those of the first electrode plate 8, and therefore the same subscripts are attached. Detailed description will be omitted.

ところで、第１電極板８と第２電極板９とは、図４に示すように、熱伝導シート１４及び絶縁体１５を介して外部接続部８ｂ、９ｂ同士が重なり合っている。また、基板部部８ａ、９ａ同士も絶縁体１５を介して重なり合っている。   By the way, as shown in FIG. 4, the external connection portions 8 b and 9 b of the first electrode plate 8 and the second electrode plate 9 are overlapped with each other through the heat conductive sheet 14 and the insulator 15. Further, the substrate portions 8 a and 9 a are also overlapped with each other through the insulator 15.

熱伝導シート１４は、例えば、シリコンゴムやシリコン樹脂にセラミックス粒子等を分散含有させたシート状のものであって、高い熱伝導率と絶縁性を備えている。また、弾力性があって密着性も良い。この熱伝導シート１４は、外部接続部８ｂ、９ｂ同士の重なり合う部分より僅かに小さいか、略同じ大きさとされており、それぞれの外部接続部８ｂ、９ｂの表面に直接当接（密着）している。なお、熱伝導シート１４としては、シリコン系の他にアクリル系のものを使用しても良い。   The heat conductive sheet 14 is, for example, a sheet-like material in which ceramic particles or the like are dispersed and contained in silicon rubber or silicon resin, and has high heat conductivity and insulation. In addition, it has elasticity and good adhesion. The heat conductive sheet 14 is slightly smaller than or substantially the same size as the overlapping portion of the external connection portions 8b and 9b, and directly contacts (adheres) to the surfaces of the external connection portions 8b and 9b. Yes. The heat conductive sheet 14 may be an acrylic sheet in addition to the silicon sheet.

絶縁体１５としては、熱伝導シートに比べて熱伝導率が高くないものの、電気絶縁性や取り扱い易さ、コストを重視し、例えば絶縁紙等が用いられる。絶縁体１５は、第１電極板８よりもやや大きく、第１、第２電極板８、９間に介在させた場合に、絶縁紙１５の外周部分が第１、第２電極板８、９間からはみ出し、第１、第２電極板８、９の縁端部間での沿面距離を確保できるようになっている。これは、外部接続部８ｂ、９ｂでも同様であって、重なり合う外部接続部８ｂ、９ｂ間から絶縁紙１５が外方にはみ出すようにして介在しており、外部接続部８ｂ、９ｂ同士の沿面距離を確保している。また、絶縁紙１５には、図２に示すように、コンデンサ素子２の第１、第２リード端子６と対向する箇所に、
リード端子６を挿通可能な開口部１５ａが設けられている。さらに、熱伝導シート１４と対向する部分にも開口部１５ｂが設けられている。そのため、熱伝導シート１４は、熱伝導率の低い絶縁紙１５を介することなく外部接続部８ｂ、９ｂの表面に直接当接するようになっている。この状態は、絶縁紙１５が外部接続部８ｂ、９ｂ（又は熱伝導シート１４）を縁取るように設けられているともいえる。なお、熱伝導シート１４の外周部分と絶縁紙１５の開口部１５ｂ周りとは重なり合っており、絶縁が確保されるようになっている。 As the insulator 15, although the thermal conductivity is not higher than that of the heat conductive sheet, for example, insulating paper or the like is used with an emphasis on electric insulation, ease of handling, and cost. The insulator 15 is slightly larger than the first electrode plate 8. When the insulator 15 is interposed between the first and second electrode plates 8 and 9, the outer peripheral portion of the insulating paper 15 is the first and second electrode plates 8 and 9. The creeping distance between the edge portions of the first and second electrode plates 8 and 9 can be secured. The same applies to the external connection portions 8b and 9b, and the insulating paper 15 is interposed so as to protrude outward between the overlapping external connection portions 8b and 9b, and the creepage distance between the external connection portions 8b and 9b. Is secured. Further, as shown in FIG. 2, the insulating paper 15 has a portion facing the first and second lead terminals 6 of the capacitor element 2.
An opening 15a through which the lead terminal 6 can be inserted is provided. Furthermore, an opening 15b is also provided in a portion facing the heat conductive sheet 14. Therefore, the heat conductive sheet 14 comes into direct contact with the surfaces of the external connection portions 8b and 9b without using the insulating paper 15 having low heat conductivity. It can be said that this state is provided so that the insulating paper 15 borders the external connection portions 8b and 9b (or the heat conductive sheet 14). In addition, the outer peripheral part of the heat conductive sheet 14 and the periphery of the opening 15b of the insulating paper 15 overlap each other so as to ensure insulation.

ケース４は、例えば樹脂製であって、図１に示すように略長方形状の底部４ａと、その底部４ａの４辺からそれぞれ立ち上がる側壁部４ｂとから構成されている。４つの側壁部４ｂのうち１つの側壁部４ｂ（図において左手前側）には開口が設けられており、この開口部４ｃから、第１、第２電極板８、９の接続端子１１ｆ、１３ｆがケース４の外方に引き出されている。また、底部４ａと対向する面にも開口が設けられており、この開口部４ｄから第１、第２電極板８、９の外部接続部８ｂ、９ｂがケース４の外方に引き出されている。   The case 4 is made of, for example, resin, and includes a substantially rectangular bottom portion 4a and side wall portions 4b rising from four sides of the bottom portion 4a as shown in FIG. Of the four side wall portions 4b, one side wall portion 4b (left front side in the figure) is provided with an opening, from which the connection terminals 11f and 13f of the first and second electrode plates 8 and 9 are connected. The case 4 is pulled out. Also, an opening is provided on the surface facing the bottom 4 a, and the external connection portions 8 b and 9 b of the first and second electrode plates 8 and 9 are drawn out of the case 4 from the opening 4 d. .

ケース４の外方に引き出された外部接続部８ｂ、９ｂの表面は、図１や図４に示すように、比較的大きな平坦部１１ｇとなっている。そして、この平坦部１１ｇに冷却手段１６が当接している。これは、平坦部１１ｇが冷却手段１６の当接部となっているともいえる。なお、冷却手段１６は、例えばインバータを冷却するための冷却器であるが、別途、コンデンサ１を冷却するために設けた冷却器であっても良い。   As shown in FIGS. 1 and 4, the surfaces of the external connection portions 8b and 9b drawn out of the case 4 are relatively large flat portions 11g. The cooling means 16 is in contact with the flat portion 11g. This can be said that the flat portion 11 g is the contact portion of the cooling means 16. The cooling means 16 is, for example, a cooler for cooling the inverter, but may be a separate cooler provided for cooling the capacitor 1.

上記構成のコンデンサ１は、重なり合った第１、第２電極板８、９のうち、一方の電極板（第１電極板８）に冷却手段１６を当接させているに過ぎないが、第１、第２電極板８、９間に熱伝導シート１４を介在させているため、冷却手段１６と当接しない他方の電極板（第２電極板９）も効率的に冷却することができる。そのため、別途、他方の電極板のために冷却手段１６を設ける必要が無く、コスト削減を図ることができる。また、効率的に冷却することができるため、電極板３の厚みを薄くすることも可能となり、一層のコスト削減を図ることができる。また、大電流で使用した場合も、熱によるコンデンサ素子２の特性劣化を抑制することができる。   The capacitor 1 having the above configuration has only the cooling means 16 in contact with one electrode plate (first electrode plate 8) of the first and second electrode plates 8 and 9 that overlap each other. Since the heat conductive sheet 14 is interposed between the second electrode plates 8 and 9, the other electrode plate (second electrode plate 9) not contacting the cooling means 16 can be efficiently cooled. Therefore, it is not necessary to separately provide the cooling means 16 for the other electrode plate, and the cost can be reduced. Moreover, since it can cool efficiently, it becomes possible to make thickness of the electrode plate 3 thin, and can aim at the further cost reduction. Moreover, even when used with a large current, the characteristic deterioration of the capacitor element 2 due to heat can be suppressed.

以上に、この発明の実施形態について説明したが、この発明は上記実施形態に限定されるものではなく、この発明の範囲内で種々変更して実施することが可能である。例えば、上記実施形態では、重なり合う第１、第２電極板８、９の外部接続部８ｂ、９ｂ同士の沿面距離を確保するため、絶縁体１５を外部接続部８ｂ、９ｂ間からはみ出させていたが、熱伝導シート１４をはみ出させるようにして沿面距離を確保するようにしても良い。ただ、熱伝導シート１４は比較的高価であり、また軟質で欠損し易いことから、絶縁体１５を併用した方が安価で且つ耐久性に優れる。なお、上記実施形態では、絶縁体１５は１枚の絶縁紙で構成されていたが、例えば基板部８ａ、８ｂ間に位置するものと、外部接続部８ｂ、９ｂ間に位置するものとの２枚の絶縁紙で構成するようにしても良い。また、絶縁体１５として絶縁紙の他に、ポリプロピレン、ポリエチレン、ポリエステル、ポリ塩化ビニル、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリフェニレンサルファイド、テフロン（登録商標）、ポリイミド、シリコン、エポキシ樹脂、フェノール樹脂、ウレタン樹脂等の樹脂シートやマイカシート等、公知の種々の絶縁材質を使用可能である。   Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, in the above embodiment, the insulator 15 protrudes from between the external connection portions 8b and 9b in order to ensure the creepage distance between the external connection portions 8b and 9b of the overlapping first and second electrode plates 8 and 9. However, the creeping distance may be secured by protruding the heat conductive sheet 14. However, since the heat conductive sheet 14 is relatively expensive and is soft and easily damaged, it is cheaper and more durable when the insulator 15 is used in combination. In the above embodiment, the insulator 15 is composed of one sheet of insulating paper. However, for example, the insulator 15 is located between the substrate portions 8a and 8b and the insulator 15 is located between the external connection portions 8b and 9b. You may make it comprise with a sheet of insulating paper. In addition to insulating paper, the insulator 15 includes polypropylene, polyethylene, polyester, polyvinyl chloride, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, Teflon (registered trademark), polyimide, silicon, epoxy resin, phenol resin, and urethane resin. Various known insulating materials such as resin sheets and mica sheets can be used.

また、上記実施形態では、ケース４の素材として樹脂を用いていたが、アルミ等の金属を用いても良い。この場合、ケース４からの放熱も見込める。また、ケース４に充填される樹脂５としては、エポキシ樹脂やウレタン樹脂等、公知の種々のものが使用可能である。また、冷却手段１６としては冷媒を循環させるものやヒートシンク等、公知の種々のものを使用可能である。また、冷却手段１６と電極板３との電気的な接続を避けるために、
両者間に絶縁体１５を介在させるようにしても良い。この際、絶縁体１５として熱伝導シート１４を用いれば、冷却手段１６と電極板３の間での熱交換が良好となる。また、当接部１１ｇは、常に平坦である必要は無く、冷却手段１６の形状に合わせて適宜変更可能である。 Moreover, in the said embodiment, although resin was used as a raw material of case 4, you may use metals, such as aluminum. In this case, heat dissipation from the case 4 can also be expected. Moreover, as resin 5 with which case 4 is filled, well-known various things, such as an epoxy resin and a urethane resin, can be used. Further, as the cooling means 16, various known ones such as a circulating refrigerant and a heat sink can be used. In order to avoid electrical connection between the cooling means 16 and the electrode plate 3,
You may make it interpose the insulator 15 between both. Under the present circumstances, if the heat conductive sheet 14 is used as the insulator 15, the heat exchange between the cooling means 16 and the electrode plate 3 will be favorable. Further, the contact portion 11g does not always need to be flat, and can be appropriately changed according to the shape of the cooling means 16.

１・・コンデンサ、２・・コンデンサ素子、２ａ・・湾曲部、２ｂ・・平坦部、２ｃ・・電極部、３・・電極板、４・・ケース、４ａ・・底部、４ｂ・・側壁部、４ｃ・・開口部、４ｄ・・開口部、５・・樹脂、６・・リード端子、７・・コンデンサ素子群、８・・第１電極板、８ａ・・基板部、８ｂ・・外部接続部、９・・第２電極板、９ａ・・基板部、９ｂ・・外部接続部、１０・・第１リップル電極板、１０ａ・・基板部、１０ｂ・・外部接続部、１０ｃ・・接続孔、１０ｄ・・接続回避孔、１０ｅ・・突出片、１０ｆ・・連結孔、１１・・第１ＤＣ電極板、１１ａ・・基板部、１１ｂ・・外部接続部、１１ｃ・・電源接続部、１１ｄ・・突出片、１１ｅ・・連結部、１１ｆ・・接続端子、１１ｇ・・当接部（平坦部）、１２・・第２リップル電極板、１２ａ・・基板部、１２ｂ・・外部接続部、１２ｃ・・接続孔、１２ｄ・・接続回避孔、１２ｅ・・突出片、１２ｆ・・連結孔、１３・・第２ＤＣ電極板、１３ａ・・基板部、１３ｂ・・外部接続部、１３ｃ・・電源接続部、１３ｄ・・突出片、１３ｅ・・連結部、１３ｆ・・接続端子、１３ｇ・・当接部（平坦部）、１４・・熱伝導シート、１５・・絶縁体、１５ａ・・開口部、１５ｂ・・開口部、１６・・冷却手段   1 ·· capacitor 2 ·· capacitor element 2a ·· curved portion 2b ·· flat portion 2c ·· electrode portion 3 ·· electrode plate 4 ·· case 4a ·· bottom portion 4b ·· side wall portion 4c ··· Opening portion 4d · · · Opening portion 5 · · Resin 6 · · Lead terminal 7 · · Capacitor element group · · · 1st electrode plate 8a · · · Board portion 8b · · · External connection Part, 9 ... second electrode plate, 9a ... substrate part, 9b ... external connection part, 10 ... first ripple electrode plate, 10a ... board part, 10b ... external connection part, 10c ... connection hole 10d .. Connection avoidance hole, 10e .. Projection piece, 10f .. Connection hole, 11 .. First DC electrode plate, 11a .. Substrate part, 11b .. External connection part, 11c ... Power supply connection part, 11d .. projecting piece, 11e ..connecting portion, 11f ..connection terminal, 11g ..contact portion (flat portion), 12.. Plural electrode plate, 12a ... substrate part, 12b ... external connection part, 12c ... connection hole, 12d ... connection avoiding hole, 12e ... projecting piece, 12f ... coupling hole, 13 ... second DC electrode plate, 13a ... Board part, 13b ... External connection part, 13c ... Power supply connection part, 13d ... Projection piece, 13e ... Connection part, 13f ... Connection terminal, 13g ... Contact part (flat part), 14 ..Heat conductive sheet, 15 ... Insulator, 15a ... Opening, 15b ... Opening, 16 ... Cooling means

Claims (2)

コンデンサ素子（２）と、このコンデンサ素子（２）に接続された正負電極板（８、９）とをケース（４）に収納し樹脂（５）を充填したコンデンサであって、ケース（４）の外方に引き出された正負電極板（８、９）の外部接続部（８ｂ、９ｂ）は、絶縁性を有する熱伝導シート（１４）を介して重なり合っているとともに、冷却手段（１６）を当接させるための当接部（１１ｇ）を有していることを特徴とするコンデンサ。   A capacitor in which a capacitor element (2) and positive and negative electrode plates (8, 9) connected to the capacitor element (2) are housed in a case (4) and filled with a resin (5), the case (4) The external connection portions (8b, 9b) of the positive and negative electrode plates (8, 9) drawn outward are overlapped via an insulating heat conductive sheet (14) and the cooling means (16) is provided. A capacitor having a contact portion (11g) for contact. 外部接続部（８ｂ、９ｂ）間には、熱伝導シート（１４）の他に絶縁体（１５）が介在しており、この絶縁体（１５）には、熱伝導シート（１４）と対向する部分に開口（１５ｂ）が設けられている請求項１記載のコンデンサ。   In addition to the heat conductive sheet (14), an insulator (15) is interposed between the external connection portions (8b, 9b), and this insulator (15) faces the heat conductive sheet (14). 2. The capacitor according to claim 1, wherein an opening (15b) is provided in the portion.
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