JP2013143512A5 - - Google Patents

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Publication number
JP2013143512A5
JP2013143512A5 JP2012003691A JP2012003691A JP2013143512A5 JP 2013143512 A5 JP2013143512 A5 JP 2013143512A5 JP 2012003691 A JP2012003691 A JP 2012003691A JP 2012003691 A JP2012003691 A JP 2012003691A JP 2013143512 A5 JP2013143512 A5 JP 2013143512A5
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JP
Japan
Prior art keywords
space
processing apparatus
hole
socket
processing chamber
Prior art date
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Application number
JP2012003691A
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English (en)
Japanese (ja)
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JP2013143512A (ja
JP5936361B2 (ja
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Priority to JP2012003691A priority Critical patent/JP5936361B2/ja
Priority claimed from JP2012003691A external-priority patent/JP5936361B2/ja
Priority to US13/410,331 priority patent/US9384946B2/en
Publication of JP2013143512A publication Critical patent/JP2013143512A/ja
Publication of JP2013143512A5 publication Critical patent/JP2013143512A5/ja
Application granted granted Critical
Publication of JP5936361B2 publication Critical patent/JP5936361B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012003691A 2012-01-12 2012-01-12 プラズマ処理装置 Active JP5936361B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012003691A JP5936361B2 (ja) 2012-01-12 2012-01-12 プラズマ処理装置
US13/410,331 US9384946B2 (en) 2012-01-12 2012-03-02 Plasma processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012003691A JP5936361B2 (ja) 2012-01-12 2012-01-12 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2013143512A JP2013143512A (ja) 2013-07-22
JP2013143512A5 true JP2013143512A5 (enExample) 2015-03-05
JP5936361B2 JP5936361B2 (ja) 2016-06-22

Family

ID=48779160

Family Applications (1)

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JP2012003691A Active JP5936361B2 (ja) 2012-01-12 2012-01-12 プラズマ処理装置

Country Status (2)

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US (1) US9384946B2 (enExample)
JP (1) JP5936361B2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6312451B2 (ja) * 2014-01-29 2018-04-18 東京エレクトロン株式会社 給電部カバー構造及び半導体製造装置
JP6308871B2 (ja) * 2014-05-28 2018-04-11 新光電気工業株式会社 静電チャック及び半導体・液晶製造装置
JP6317183B2 (ja) * 2014-05-30 2018-04-25 日本特殊陶業株式会社 半導体製造装置用部品
JP6424049B2 (ja) * 2014-09-12 2018-11-14 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN108475658B (zh) * 2016-01-19 2023-12-22 住友大阪水泥股份有限公司 静电卡盘装置
DE102017208081B3 (de) * 2017-05-12 2018-10-11 centrotherm international AG Kontaktierungsvorrichtung zur Verbindung eines Waferbootes mit einer elektrischen Leistungsversorgung
JP7052796B2 (ja) * 2017-07-28 2022-04-12 住友電気工業株式会社 シャワーヘッド及びその製造方法
JP7149068B2 (ja) * 2017-12-21 2022-10-06 株式会社日立ハイテク プラズマ処理装置およびプラズマ処理方法
US11121010B2 (en) 2018-02-15 2021-09-14 Tokyo Electron Limited Plasma processing apparatus
JP7122212B2 (ja) * 2018-02-15 2022-08-19 東京エレクトロン株式会社 プラズマ処理装置
JP7090465B2 (ja) * 2018-05-10 2022-06-24 東京エレクトロン株式会社 載置台及びプラズマ処理装置
JP7090481B2 (ja) * 2018-06-15 2022-06-24 新光電気工業株式会社 静電チャック及びその製造方法
KR102608957B1 (ko) * 2018-08-27 2023-12-01 삼성전자주식회사 플라즈마 처리 장치
JP7285154B2 (ja) * 2019-07-16 2023-06-01 日本特殊陶業株式会社 保持装置
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US12331984B2 (en) 2021-05-10 2025-06-17 Applied Materials, Inc. Cryogenic micro-zone electrostatic chuck connector assembly
JP7557429B2 (ja) * 2021-05-27 2024-09-27 東京エレクトロン株式会社 プラズマ処理装置
JP7579758B2 (ja) * 2021-06-28 2024-11-08 東京エレクトロン株式会社 基板支持体、基板支持体アセンブリ及びプラズマ処理装置
KR102836506B1 (ko) * 2023-03-27 2025-07-22 주식회사 히타치하이테크 플라스마 처리 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764950A (en) 1980-10-08 1982-04-20 Fujitsu Ltd Electrostatically attracting device and method therefor
JPH0478133A (ja) * 1990-07-20 1992-03-12 Tokyo Electron Ltd プラズマ処理装置
KR100260587B1 (ko) * 1993-06-01 2000-08-01 히가시 데쓰로 정전척 및 그의 제조방법
JPH0774234A (ja) * 1993-06-28 1995-03-17 Tokyo Electron Ltd 静電チャックの電極構造、この組み立て方法、この組み立て治具及び処理装置
JPH08162518A (ja) * 1994-12-06 1996-06-21 Fujitsu Ltd 半導体装置の製造装置
US6072685A (en) * 1998-05-22 2000-06-06 Applied Materials, Inc. Electrostatic chuck having an electrical connector with housing
US6151203A (en) * 1998-12-14 2000-11-21 Applied Materials, Inc. Connectors for an electrostatic chuck and combination thereof
US20020022403A1 (en) * 1999-08-06 2002-02-21 Wing L. Cheng Connectors for an eletrostatic chuck
US6490144B1 (en) * 1999-11-29 2002-12-03 Applied Materials, Inc. Support for supporting a substrate in a process chamber
TWI246873B (en) * 2001-07-10 2006-01-01 Tokyo Electron Ltd Plasma processing device
JP3993408B2 (ja) * 2001-10-05 2007-10-17 株式会社巴川製紙所 静電チャック装置、その組立方法および静電チャック装置用部材
US6646233B2 (en) * 2002-03-05 2003-11-11 Hitachi High-Technologies Corporation Wafer stage for wafer processing apparatus and wafer processing method
JP4276404B2 (ja) * 2002-03-25 2009-06-10 株式会社クリエイティブ テクノロジー 静電チャックの電極構造

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