JP2013120063A - 表面処理状況モニタリング装置 - Google Patents

表面処理状況モニタリング装置 Download PDF

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Publication number
JP2013120063A
JP2013120063A JP2011266613A JP2011266613A JP2013120063A JP 2013120063 A JP2013120063 A JP 2013120063A JP 2011266613 A JP2011266613 A JP 2011266613A JP 2011266613 A JP2011266613 A JP 2011266613A JP 2013120063 A JP2013120063 A JP 2013120063A
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Japan
Prior art keywords
spectrum
surface treatment
interference
status monitoring
treatment status
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JP2011266613A
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English (en)
Japanese (ja)
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JP2013120063A5 (https=
Inventor
Hiroomi Goto
洋臣 後藤
Yuzo Nagumo
雄三 南雲
Rui Kato
塁 加藤
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Shimadzu Corp
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Shimadzu Corp
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Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Priority to JP2011266613A priority Critical patent/JP2013120063A/ja
Priority to US13/707,407 priority patent/US20130169958A1/en
Publication of JP2013120063A publication Critical patent/JP2013120063A/ja
Publication of JP2013120063A5 publication Critical patent/JP2013120063A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G01B11/0633—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection using one or more discrete wavelengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2011266613A 2011-12-06 2011-12-06 表面処理状況モニタリング装置 Pending JP2013120063A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011266613A JP2013120063A (ja) 2011-12-06 2011-12-06 表面処理状況モニタリング装置
US13/707,407 US20130169958A1 (en) 2011-12-06 2012-12-06 Surface Processing Progress Monitoring System

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011266613A JP2013120063A (ja) 2011-12-06 2011-12-06 表面処理状況モニタリング装置

Publications (2)

Publication Number Publication Date
JP2013120063A true JP2013120063A (ja) 2013-06-17
JP2013120063A5 JP2013120063A5 (https=) 2014-05-08

Family

ID=48694578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011266613A Pending JP2013120063A (ja) 2011-12-06 2011-12-06 表面処理状況モニタリング装置

Country Status (2)

Country Link
US (1) US20130169958A1 (https=)
JP (1) JP2013120063A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017078632A (ja) * 2015-10-20 2017-04-27 国立大学法人 和歌山大学 断層構造の観測方法、観測装置、及びコンピュータプログラム
JP2019537007A (ja) * 2016-12-05 2019-12-19 クオリティー ヴィジョン インターナショナル インコーポレイテッドＱｕａｌｉｔｙ Ｖｉｓｉｏｎ Ｉｎｔｅｒｎａｔｉｏｎａｌ， Ｉｎｃ． 光学測定機のプローブ用の交換可能なレンズモジュールシステム

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150022658A1 (en) * 2013-07-16 2015-01-22 University Of North Carolina At Charlotte Noise reduction techniques, fractional bi-spectrum and fractional cross-correlation, and applications
KR102313350B1 (ko) 2014-09-02 2021-10-15 삼성전자주식회사 광학 측정 방법 및 광학 측정 장치
KR20180064791A (ko) * 2016-12-06 2018-06-15 삼성전자주식회사 연마 방법 및 연마 장치
CN108515460A (zh) * 2018-04-10 2018-09-11 湖南工学院 平面光学元件亚表面损伤检测方法
CN111238432A (zh) * 2019-06-20 2020-06-05 石河子大学 一种智能开沟作业质量监测系统
US20220397515A1 (en) * 2021-06-10 2022-12-15 Applied Materials, Inc. Obtaining substrate metrology measurement values using machine learning

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274259A (ja) * 1998-03-26 1999-10-08 Hitachi Ltd 厚さ測定装置および厚さ制御装置
JP2002081917A (ja) * 2000-06-20 2002-03-22 Hitachi Ltd 発光分光法による被処理材の膜厚測定方法及び装置とそれを用いた被処理材の処理方法及び装置
JP2004507070A (ja) * 1999-09-30 2004-03-04 ラム　リサーチ　コーポレーション パルス広帯域光源を用いてプラズマエッチングおよび堆積プロセスをその場モニタリングするための方法および装置
JP2004253516A (ja) * 2003-02-19 2004-09-09 Hitachi High-Technologies Corp 試料のドライエッチング方法及びドライエッチング装置
JP2005184013A (ja) * 2001-03-12 2005-07-07 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2008142443A (ja) * 2006-12-13 2008-06-26 Fujifilm Corp 光断層画像化装置
JP2008218898A (ja) * 2007-03-07 2008-09-18 Hitachi High-Technologies Corp プラズマ処理装置
WO2011045967A1 (ja) * 2009-10-13 2011-04-21 浜松ホトニクス株式会社 膜厚測定装置および膜厚測定方法
US20110216328A1 (en) * 2010-03-02 2011-09-08 Yoichi Kobayashi Polishing monitoring method, polishing method, and polishing monitoring apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3946470B2 (ja) * 2001-03-12 2007-07-18 株式会社デンソー 半導体層の膜厚測定方法及び半導体基板の製造方法
EP1611411A2 (en) * 2003-03-26 2006-01-04 Southwest Sciences Incorporated Method and apparatus for imaging internal structures of transparent and translucent materials
JP5862433B2 (ja) * 2012-04-09 2016-02-16 株式会社島津製作所 表面処理状況モニタリング装置
JP5888111B2 (ja) * 2012-05-18 2016-03-16 株式会社島津製作所 エッチングモニタ装置
JP2014002068A (ja) * 2012-06-19 2014-01-09 Shimadzu Corp 厚みモニタリング装置、エッチング深さモニタリング装置および厚みモニタリング方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11274259A (ja) * 1998-03-26 1999-10-08 Hitachi Ltd 厚さ測定装置および厚さ制御装置
JP2004507070A (ja) * 1999-09-30 2004-03-04 ラム　リサーチ　コーポレーション パルス広帯域光源を用いてプラズマエッチングおよび堆積プロセスをその場モニタリングするための方法および装置
JP2002081917A (ja) * 2000-06-20 2002-03-22 Hitachi Ltd 発光分光法による被処理材の膜厚測定方法及び装置とそれを用いた被処理材の処理方法及び装置
JP2005184013A (ja) * 2001-03-12 2005-07-07 Denso Corp 半導体層の膜厚測定方法及び半導体基板の製造方法
JP2004253516A (ja) * 2003-02-19 2004-09-09 Hitachi High-Technologies Corp 試料のドライエッチング方法及びドライエッチング装置
JP2008142443A (ja) * 2006-12-13 2008-06-26 Fujifilm Corp 光断層画像化装置
JP2008218898A (ja) * 2007-03-07 2008-09-18 Hitachi High-Technologies Corp プラズマ処理装置
WO2011045967A1 (ja) * 2009-10-13 2011-04-21 浜松ホトニクス株式会社 膜厚測定装置および膜厚測定方法
US20110216328A1 (en) * 2010-03-02 2011-09-08 Yoichi Kobayashi Polishing monitoring method, polishing method, and polishing monitoring apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017078632A (ja) * 2015-10-20 2017-04-27 国立大学法人 和歌山大学 断層構造の観測方法、観測装置、及びコンピュータプログラム
JP2019537007A (ja) * 2016-12-05 2019-12-19 クオリティー ヴィジョン インターナショナル インコーポレイテッドＱｕａｌｉｔｙ Ｖｉｓｉｏｎ Ｉｎｔｅｒｎａｔｉｏｎａｌ， Ｉｎｃ． 光学測定機のプローブ用の交換可能なレンズモジュールシステム

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