JP2013115169A - Package for electronic component storage and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that a frame body of a package for electronic component storage including an input/output member may decrease in durability as a solder material for fixing the input/output member to the frame body flows horizontally on an inner peripheral surface of the frame body.SOLUTION: The package for electronic component storage includes an insulation member and the input/output member including a wiring conductor led out from the inner side to the outside of a region surrounded with the frame body, a side face of the insulation member parallel with the direction in which the wiring conductor is led out includes a first region located from between an inner peripheral surface and an outer peripheral surface of the frame body to outside the frame body, and a second region located from between the inner peripheral surface and outer peripheral surface of the frame body to inside the frame body, the first region being covered with a metallized layer.

Description

  The present invention relates to an electronic component storage package in which an electronic component such as a semiconductor element is stored, and an electronic device using the same. Such an electronic device can be used for various electronic devices.

  As an electronic component storage package (hereinafter also simply referred to as a package) for storing electronic components, for example, a package described in Patent Document 1 is known. The package described in Patent Document 1 includes input / output terminals for electrically connecting a built-in semiconductor element and an external electric circuit board. The input / output terminal includes a flat plate portion made of a dielectric, a line conductor formed on the upper surface of the flat plate portion, and a standing wall portion made of a dielectric material joined to the upper surface of the flat plate portion with the line conductor interposed therebetween. ing.

  In the input / output terminal described in Patent Document 1, the lower surface of the flat plate portion, the upper surface of the standing wall portion, and the entire side surface parallel to the transmission direction of the line conductor in the flat plate portion and the standing wall portion are covered with the metallization layer. When the surface of the input / output terminal is covered with the metallized layer, the bondability between the frame body made of the brazing material and the input / output terminal can be improved.

JP 2002-280473 A

  In recent years, since miniaturization of packages has been demanded, miniaturization of input / output terminals has also been demanded. However, when downsizing of the package and the input / output terminal is promoted, the brazing material joining the frame and the input / output terminal wets and spreads in the region surrounded by the frame, thereby reducing the durability of the frame. there is a possibility. Specifically, when the metallized layer is formed on the entire side surface of the input / output terminal, the brazing material is easily spread over the entire side surface.

  When the brazing material wets and spreads in the region surrounded by the frame on the side surface, the brazing material tends to wet and spread in the horizontal direction on the inner peripheral surface of the frame. The brazing material that has spread in the horizontal direction tends to accumulate at the corners of the inner peripheral surface of the frame. In such a case, excessive stress may be applied to the corners of the frame due to the difference between the thermal expansion coefficient of the material constituting the frame and the thermal expansion coefficient of the material constituting the brazing material. Therefore, the durability of the frame body may be reduced.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide an electronic component storage package having good durability even when downsized.

  An electronic component storage package according to one aspect of the present invention includes a substrate having a placement area on which an electronic component is placed on an upper surface, and an inner surface provided on the upper surface of the substrate so as to surround the placement area. A frame having a peripheral surface and a through-hole that opens to the outer peripheral surface, an insulating member, and a wiring conductor drawn from the inside to the outside of the region surrounded by the frame, and joined to the through-hole by a brazing material Input / output members.

In addition, the side surface of the insulating member, which is parallel to the direction in which the wiring conductor is drawn out, is positioned between the inner peripheral surface and the outer peripheral surface of the frame body to the outside of the frame body, and the frame body. It has the 2nd field located from the inner peripheral surface and the outer peripheral surface to the inner side of the frame. The electronic component storage package of this aspect is characterized in that the first region is covered with a metallized layer.

  In the electronic component storage package of the above aspect, the entire side surface of the insulating member is not covered with the metallized layer, but the side surface is covered with the first region covered with the metallized layer and the metallized layer. Has no second region. And the boundary of these area | regions is located between the internal peripheral surface and outer peripheral surface of a frame.

  If the amount of brazing material is simply reduced, the possibility that the brazing material will spread out on the inner peripheral surface of the frame body can be reduced, but the bondability of the input / output member to the frame body will be reduced, or the airtightness of the package will be reduced. May be reduced. However, in the package of the above aspect, the first region covered with the metallized layer is located from between the inner peripheral surface and the outer peripheral surface of the frame to the outer side of the frame. Therefore, since the brazing material spreads wet toward the outside of the frame body, the possibility that the brazing material spreads wet on the inner peripheral surface of the frame body can be reduced without excessively reducing the amount of the brazing material. As a result, it is possible to provide a package having good durability even when downsized.

It is a disassembled perspective view which shows the electronic component storage package of 1st Embodiment, and an electronic apparatus provided with the same. FIG. 2 is a perspective view of an input / output member in the electronic component storage package shown in FIG. 1. (A) is a side view of the input / output member shown in FIG. 2, (b) is a plan view of the input / output member shown in FIG. 2, and (c) is a bottom view of the input / output member shown in FIG. (A) is a top view which shows the 1st modification of the input / output member shown in FIG. 2, (b) is the enlarged plan view which expanded the area | region A of the input / output member shown in FIG. 4 (a). . (A) is a top view which shows the 2nd modification of the input / output member shown in FIG. 2, (b) is the enlarged plan view which expanded the area | region B of the input / output member shown in FIG. 5 (a). .

  Hereinafter, an electronic component storage package (hereinafter also simply referred to as a package) and an electronic apparatus including the same according to an embodiment of the present invention will be described in detail with reference to the drawings. However, in the drawings referred to below, for convenience of explanation, among the constituent members of the embodiment, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the package and the electronic device according to the present invention can include arbitrary components not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not represent the dimension of an actual structural member, the dimension ratio of each member, etc. faithfully.

  As shown in FIGS. 1 to 3, the package 1 of the present embodiment includes a substrate 3, a frame body 5 provided on the upper surface of the substrate 3 and having through holes opened on the inner peripheral surface and the outer peripheral surface, An input / output member 7 joined to the through hole with a brazing material is provided.

  The substrate 3 in the present embodiment has a rectangular plate-shaped flat plate portion and screwing portions that are drawn laterally from the four corners of the flat plate region. The flat plate portion has a placement area on which the electronic component 9 is placed. Each screwing portion is formed with a screwing hole. The package 1 can be fixed to the mounting substrate 13 with screws 11 in these screw holes.

In the present embodiment, the placement area means an area that overlaps the electronic component 9 when the substrate 3 is viewed in plan. As a magnitude | size of the board | substrate 3, the one side of a flat plate part can be set to 5 mm-50 mm, for example. Moreover, as thickness of the board | substrate 3, it can set to 0.3 mm-3 mm, for example.

  In the present embodiment, the placement area is formed at the center of the upper surface of the substrate 3. However, since the area where the electronic component 9 is placed is the placement area, for example, the end of the upper surface of the substrate 3. There is no problem even if the mounting area is formed. Moreover, although the board | substrate 3 of this embodiment has one mounting area | region, the board | substrate 3 may have a some mounting area | region and the electronic component 9 may be mounted in each mounting area | region. .

  An electronic component 9 is disposed in the placement area on the upper surface of the substrate 3. As the electronic component 9, for example, components such as an optical semiconductor element, an IC element, an LSI element, and a capacitor can be used. As an optical semiconductor element, for example, a light emitting element that emits light to an optical fiber, represented by an LD element, a light receiving element that receives light from an optical fiber, represented by a PD element, or an IC element And semiconductor elements that perform electrical signal processing typified by LSI elements. In the electronic device 101 of this embodiment, an optical semiconductor element is used as the electronic component 9. The optical semiconductor element is optically coupled with an optical fiber described later.

  One end of the bonding wire 15 is electrically connected to the electronic component 9. The electronic component 9 can input / output signals to / from an external wiring circuit (not shown) via the bonding wire 15 and lead terminals (not shown). Thus, the electronic component 9 is disposed on the upper surface of the substrate 3. For this reason, the substrate 3 is required to have high insulation properties at least in a portion where the electronic component 9 is disposed.

  The substrate 3 having high insulation can be produced by laminating a plurality of insulating members. Then, the electronic component 9 is placed on the placement area of the substrate 3. As the insulating member, for example, a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body may be used. it can. Further, a glass ceramic material may be used instead of these ceramic materials.

  A mixing member is prepared by mixing the raw material powder containing these glass powder and ceramic powder, an organic solvent, and a binder. A plurality of ceramic green sheets are produced by forming the mixed member into a sheet. A plurality of laminated bodies are produced by laminating the produced ceramic green sheets. The substrate 3 is fabricated by integrally firing the plurality of laminated bodies at a temperature of about 1600 degrees.

  The substrate 3 is not limited to the configuration in which a plurality of insulating members are stacked. The board | substrate 3 may be comprised by one insulating member. Moreover, since it is calculated | required that the board | substrate 3 has high insulation at least in the part by which the electronic component 9 is arrange | positioned, it is good also as a structure which laminated | stacked the insulating member on the metal member, for example. In particular, when high heat dissipation is required for the substrate 3, the substrate 3 preferably has the above-described configuration. This is because the metal member has high heat dissipation. With the configuration in which the insulating member is laminated on the metal member, the heat dissipation of the electronic device 101 from the electronic component 9 through the insulating member and the substrate 3 can be enhanced.

  Specifically, an insulating mounting substrate 17 may be provided as in the package 1 of the present embodiment. In the package 1 of the present embodiment, the substrate 3 is made of a metal member, and the mounting substrate 17 is disposed on the mounting region of the substrate 3. The electronic component 9 is placed on the placement board 17.

  Specifically, as the metal member, a metal material such as iron, copper, nickel, chromium, cobalt, molybdenum and tungsten, an alloy made of these metals, or a metal substrate on which these metals are laminated can be used. . The metal member which comprises the board | substrate 3 is producible by giving metal processing methods, such as a rolling method and a punching method, to such an ingot of a metal material.

  Further, as the mounting substrate 17, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, a nitriding body is used. Ceramic materials such as aluminum sintered bodies and silicon nitride sintered bodies, or glass ceramic materials can be used.

  The package 1 according to the present embodiment includes a frame body 5 disposed on the upper surface of the substrate 3 so as to surround the mounting area. The frame 5 has a quadrangular cylindrical shape on the inner peripheral surface and the outer peripheral surface in plan view, and includes four side wall portions. The frame 5 is bonded to the substrate 3 via a bonding member such as silver solder. Moreover, the frame 5 has a through hole (first through hole) that opens to the inner peripheral surface and the outer peripheral surface.

  The frame 5 can be set to have an outer periphery of 5 mm or more and 50 mm or less when viewed in plan. Moreover, the thickness of the frame 5 shown by the width | variety between an outer periphery and an inner periphery can be set to 0.5 mm or more and 2 mm or less, for example. Moreover, as the height of the frame 5, it can set to 3 mm or more and 30 mm or less, for example.

  As the frame body 5, for example, a member having a good insulating property or a metal member can be used in the same manner as the substrate 3. Examples of members having good insulation include ceramic materials such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, and a silicon nitride sintered body. Can be used. Moreover, as a metal member, metal materials, such as iron, copper, nickel, chromium, cobalt, and tungsten, or the alloy which consists of these metal materials can be used, for example.

  An input / output member 7 is attached to the first through hole. The input / output member 7 is joined to the first through hole via a brazing material. The input / output member 7 in this embodiment includes an insulating member 19 and a wiring conductor 25. The wiring conductor 25 is drawn from the inside to the outside of the region surrounded by the frame body 5. The insulating member 19 includes a flat plate-shaped first insulating member 21 and a flat plate-shaped second insulating member 23.

  The first insulating member 21 has a square plate shape. As an exemplary size of the first insulating member 21, one side parallel to the direction in which the wiring conductor 25 is drawn in a plan view is about 1 to 10 mm, and the direction in which the wiring conductor 25 is drawn in a plan view. The vertical side is about 5 to 50 mm and the thickness is about 0.3 to 3 mm.

  As the first insulating member 21, it is preferable to use a member having good insulation like the insulating member. For example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, and a nitrided body are used. A ceramic material such as an aluminum sintered body and a silicon nitride sintered body, or a glass ceramic material can be used.

A plurality of wiring conductors 25 are disposed on the upper surface of the first insulating member 21. Each wiring conductor 25 is drawn from the inside to the outside of the region surrounded by the frame body 5. That is, one end of the wiring conductor 25 is located inside the frame 5 and the other end is located outside the frame 5. The wiring conductor 25 is a member for electrically connecting the electronic component 9 and an external wiring circuit. Therefore, the other end of the bonding wire 15 that is electrically connected to the electronic component 9 and the mounting substrate 17 is electrically connected to one end of the wiring conductor 25. 1 to 5, hatching is added to the wiring conductor 25 for easy visual understanding.

  A second insulating member 23 is disposed on the first insulating member 21 and the wiring conductor 25. At this time, the second insulating member 23 is disposed on the wiring conductor 25 so that one end and the other end of the wiring conductor 25 are exposed. The second insulating member 23 has a square plate shape. As an exemplary size of the second insulating member 23, the wiring conductor 25 in a plan view has a side parallel to the direction in which the wiring conductor 25 is drawn out in a plan view of about 0.5 to 2.5 mm. One side perpendicular to the direction of drawing is about 5 to 50 mm, and the thickness is about 0.3 to 3 mm. As the second insulating member 23, it is preferable to use a member having good insulating properties like the first insulating member 21.

  As described above, the insulating member 19 is constituted by the first insulating member 21 and the second insulating member 23. A metallized layer (first metallized layer 27) is disposed on each of the pair of side surfaces 19 a parallel to the direction in which the wiring conductor 25 is drawn out of the insulating member 19. The metallized layer is provided to improve the wettability of the brazing material for joining the input / output member 7 and the frame 5 (first through hole) to the input / output member 7. In FIG. 1 to FIG. 3, the first metallized layer 27 is hatched to facilitate visual understanding.

  As the first metallized layer 27, for example, a metal material such as manganese, molybdenum and tungsten, or an alloy made of these metal materials can be used. The brazing material is not particularly limited as long as the input / output member 7 can be satisfactorily joined to the frame 5. For example, gold-tin solder or silver solder can be used.

  In the package 1 of the present embodiment, the both side surfaces 19a are the first region 29 located between the inner peripheral surface and the outer peripheral surface of the frame 5 and the outer side of the frame 5, and the inner peripheral surface of the frame 5. And a second region 31 located between the outer peripheral surface and the inside of the frame 5. The entire side surface 19 a is not covered with the metallized layer, but only the first region 29 is covered with the first metalized layer 27. That is, the side surface 19 a has the first region 29 covered with the first metallized layer 27 and the second region 31 not covered with the first metallized layer 27.

  In other words, the both side surfaces 19a are located between the inner peripheral surface and the outer peripheral surface of the frame body 5 and outside the frame body 5 and are covered with the first metallized layer 27, and A region which is located between the inner peripheral surface and the outer peripheral surface and inside the frame body 5 and is not covered with the first metallized layer 27. The boundaries between these regions are located between the inner peripheral surface and the outer peripheral surface of the frame 5.

  Therefore, the brazing material that joins the input / output member 7 and the frame body 5 easily spreads in the first region 29 via the first metallized layer 27, and is not covered by the first metallized layer 27. From the boundary between the region 31 and the region covered with the first metallized layer 27 and the region not covered with the first metallized layer 27, wetting and spreading on the inner peripheral surface of the frame 5 through the first through hole It becomes difficult.

  As a result, the possibility that the brazing material spreads wet on the inner peripheral surface of the frame 5 and adjacent to the side surface 19a of the insulating member 19 is reduced. For example, when the inner peripheral surface of the frame 5 and a portion adjacent to the side surface 19 a is close to the input / output member 7, the input / output member 7, the inner peripheral surface of the frame 5, The possibility that excessive brazing material is accumulated between the peripheral surface and the portion adjacent to the side surface 19a is reduced.

  Accordingly, the brazing material is prevented from spreading in the horizontal direction from the portion of the inner peripheral surface of the frame 5 adjacent to the side surface 19a, so that the corners of the inner peripheral surface of the frame 5 and the input / output members 7 and the frame Accumulation between the inner peripheral surface of the body 5 and the inner peripheral surface of the frame 5 and adjacent to the side surface 19a is suppressed.

  As a result, the solder accumulated between the corners of the inner peripheral surface of the frame 5 and the input / output member 7 and the inner peripheral surface of the frame 5 and the inner peripheral surface of the frame 5 and adjacent to the side surface 19a. Generation of thermal stress due to differences in thermal expansion coefficients between the material and the frame 5 and the input / output member 7 and concentration of the thermal stress on local parts such as brazing material are suppressed, and the frame 5 and the input / output member 7 and cracks generated in the brazing material can be suppressed. As a result, it is possible to provide the package 1 having good durability and airtightness even when it is downsized.

  If the amount of brazing material that simply joins the input / output member 7 and the frame 5 is reduced, the possibility that the brazing material will spread out on the inner peripheral surface of the frame 5 can be reduced. There is a possibility that the bonding property of the member 7 to the frame 5 is lowered, or the airtightness of the package 1 is lowered.

  However, in the package 1 of the present embodiment, the first region 29 covered with the first metallized layer 27 is located from between the inner peripheral surface and the outer peripheral surface of the frame 5 to the outer side of the frame 5. Yes. Therefore, the brazing material spreads wet toward the outside of the frame body 5 and a meniscus is formed by brazing material at the corner between the outer peripheral surface of the frame body 5 and the first region 29. In addition to reducing the possibility that the brazing material spreads wet on the inner peripheral surface of the frame body 5 without reducing the thickness of the input / output member 7 and the frame body 5 necessary for maintaining the durability and airtightness of the package 1. Bonding strength can be ensured. As a result, it is possible to provide the package 1 having good durability and airtightness even when it is downsized.

  As described above, the boundary between the first region 29 and the second region 31 is located between the inner peripheral surface and the outer peripheral surface of the frame 5. At this time, the width D1 of the second region 31 between the inner peripheral surface and the outer peripheral surface of the frame 5 is the width D2 between the inner peripheral surface and the outer peripheral surface of the frame 5, in other words, the width of the frame 5 It is preferably about 70 to 90% of the thickness.

  When the width D1 is 70% or more of the width D2, the bonding area between the input / output member 7 and the frame 5 necessary for maintaining the durability and airtightness of the package 1 is secured, and the input / output member 7 is secured. The bonding property to the frame body 5 can be improved, and the airtightness of the package 1 can be improved. Further, when the width D1 is 90% or less of the width D2, it is possible to more reliably suppress the brazing material joining the input / output member 7 and the frame body 5 from spreading on the inner peripheral surface of the frame body 5. 2 and 3, the alternate long and short dash line X <b> 1 means a portion that overlaps with the inner peripheral surface of the frame body 5, and the alternate long and short dash line X <b> 2 means a portion that overlaps the outer peripheral surface of the frame body 5.

  Moreover, it is preferable that the boundary of the 1st area | region 29 and the 2nd area | region 31 is parallel with respect to the internal peripheral surface of the frame 5, as shown to FIG. In other words, when the first metallized layer 27 is viewed from the side, it is preferable that the end portion close to the inner peripheral surface of the frame 5 is parallel to the inner peripheral surface of the frame 5. When the distance between the boundary between the first region 29 and the second region 31 and the inner peripheral surface of the frame 5 is not constant, the distance between them is the narrowest. The brazing material is transmitted through the portion, and it is easy to wet and spread on the inner peripheral surface of the frame 5, and the portion between the boundary between the first region 29 and the second region 31 and the inner peripheral surface of the frame 5 is narrow In a wide part, thermal stress generated due to the difference in thermal expansion coefficient between the brazing material and the frame 5 and the input / output member 7 tends to be unevenly distributed. Therefore, cracks and cracks are likely to occur in the frame 5, the input / output member 7, and the brazing material due to these biased thermal stresses.

  However, when the boundary between the first region 29 and the second region 31 is parallel to the inner peripheral surface of the frame body 5, the bondability of the input / output member 7 to the frame body 5 is improved. However, it is possible to more reliably suppress the brazing material from spreading on the inner peripheral surface of the frame body 5. Further, since the distance between the boundary between the first region 29 and the second region 31 and the inner peripheral surface of the frame 5 is constant, the difference in thermal expansion coefficient between the brazing material, the frame 5 and the input / output member 7. It is possible to suppress the uneven distribution of the thermal stress caused by the occurrence of cracks, and to suppress the occurrence of cracks and cracks due to the uneven thermal stress.

  The package 1 of the present embodiment further includes a second metallized layer 33 provided on the lower surface of the first insulating member 21 and the upper surface of the second insulating member 23. Therefore, the input / output member 7 can be firmly joined to the frame 5 also on the upper surface side and the lower surface side of the input / output member 7. 3 to 5, hatching is added to the second metallized layer 33 in order to facilitate visual understanding.

  As shown in FIG. 4, the upper surface 19 b and the lower surface 19 c of the insulating member 19 are located on the outer peripheral surface side of the frame body 5 as in the case of the side surface 19 a and the region of the frame body 5 where the metallized layer is formed on the surface. Although it may have a region located on the inner peripheral surface side where the metallized layer is not formed on the surface, as shown in FIG. 3, the entire lower surface of the first insulating member 21 and the second insulating member 23 It is preferable that the second metallized layer 33 is provided on the entire upper surface in order to ensure the bonding strength between the input / output member 7 and the frame body 5.

  The brazing material that has spread on the inner peripheral surface of the frame 5 through the surface of the second metallization layer 33 provided on the lower surface of the first insulating member 21 is downward, in other words, on the inner peripheral surface of the frame 5. This is because it tends to wet and spread toward the substrate 3. Further, the brazing material wets and spreads also on the second metallization layer 33 provided on the lower surface of the first insulating member 21, and excess brazing material can be accumulated in the second metallization layer 33, and the first A meniscus made of brazing material can be formed at the corner formed between the lower surface of the insulating member 21 and the inner peripheral surface of the frame 5.

  In the package 1 of the present embodiment, as described above, the substrate 3 and the frame body 5 are bonded via a bonding member such as silver solder. Therefore, even if the brazing material spreads wet toward the substrate 3, it is unlikely to affect the durability of the substrate 3 and the frame 5, and an excessive brazing is applied to the lower surface of the first insulating member 21. It is possible to increase the bonding strength between the input / output member 7 and the frame 5 while accumulating materials.

  In addition, the brazing material that has spread over the inner peripheral surface of the frame 5 along the surface of the second metallization layer 33 provided on the upper surface of the second insulating member 23 is directed upward on the inner peripheral surface of the frame 5. Further, the brazing material is also spread to the second metallization layer 33 provided on the upper surface of the second insulating member 23, and excess brazing material is accumulated in the second metallization layer 33. In addition, a meniscus made of a brazing material can be formed at the corner formed between the upper surface of the second insulating member 23 and the inner peripheral surface of the frame 5.

  In the electronic device 101 using the package 1 of the present embodiment, as described later, the frame 5 and the lid 103 are joined using, for example, gold-tin solder. Therefore, even if the brazing material spreads wet toward the upper end of the frame body 5, the possibility of affecting the durability of the frame body 5 and the lid body 103 is low. Furthermore, the upper surface of the second insulating member 23 In addition, it is possible to increase the bonding strength between the input / output member 7 and the frame 5 while accumulating excess brazing material.

  Therefore, when the second metallized layer 33 is provided on the entire lower surface of the first insulating member 21 and the entire upper surface of the second insulating member 23, the possibility of reducing the durability of the package 1 is small. Therefore, it is preferable because the input / output member 7 can be more firmly joined to the frame 5.

  In the case where the brazing material spreads on the inner peripheral surface of the frame 5 through the surface of the second metallization layer 33 provided on the upper surface of the second insulating member 23 or the lower surface of the first insulating member 21. In the case where it is required to more surely reduce the possibility that the brazing material spreads in the horizontal direction on the inner peripheral surface of the frame 5 while securing the bonding strength between the input / output member 7 and the frame 5. For example, as shown in FIG. 5, a second metallized layer 33 may be provided on the upper surface of the second insulating member 23, or formed on the lower surface of the first insulating member 21 as in FIG. The second metallized layer 33 thus formed may be formed in a shape in which the inner peripheral surface side of the frame 5 adjacent to the side surface 19a is cut out.

  In FIG. 5, the upper surface of the second insulating member 23 is a region that overlaps with the inner peripheral surface of the frame 5 and the ring-shaped metal member to which the lid 103 is joined, and on both sides of the insulating member 19. A second metallized layer 33 is provided in a portion excluding the region Y adjacent to 19a. In other words, the second metallized layer 33 is a region that overlaps the upper surface of the second insulating member 23 with the metal member having a ring shape to which the inner peripheral surface of the frame 5 and the lid 103 are joined. The insulating member 19 is provided on the upper surface of the second insulating member 23 in a shape in which portions close to both side surfaces 19 a are cut out.

  The frame 5 in the package 1 of the present embodiment may have a second through hole separately from the first through hole. A cylindrical optical fiber holding member 35 (hereinafter simply referred to as a holding member 35) is attached to the second through hole. The holding member 35 is a member for holding and fixing the optical fiber. The holding member 35 fixes and positions the optical fiber and is cylindrical, so that light can be transmitted between the electronic component 9 and the optical fiber through the hollow portion of the cylindrical shape.

  The holding member 35 preferably has a strength that can at least fix the optical fiber. Specifically, metal members such as iron, copper, nickel, chromium, cobalt, and tungsten, or alloys made of these metals can be used. The cylindrical holding member 35 can be produced by subjecting such an ingot of a metal member to a metal processing method such as a rolling method or a punching method.

  In particular, the frame 5 and the holding member 35 are preferably formed using the same metal member. This is because the difference in thermal expansion between the frame 5 and the holding member 35 can be reduced, so that the stress generated between the frame 5 and the holding member 35 can be reduced.

  When the electronic device 101 of this embodiment is used, a ferrule (not shown) is fixed to the other end of the holding member 35. The ferrule has a through hole whose one end opens to the inside of the cylinder of the holding member 35. Then, an optical fiber is inserted and fixed in this through hole. Thus, the optical coupling between the optical fiber and the electronic component 9 can be performed by inserting and fixing the ferrule to the holding member 35.

  As the ferrule, for example, a ceramic material such as zirconia or alumina can be used. As the optical fiber, a light-transmitting material such as quartz glass can be used. The ferrule may be joined to the inner peripheral surface of the cylindrical holding member 35 or may be joined to the end surface of the other end of the holding member 35.

  Next, an electronic device 101 according to an embodiment will be described in detail with reference to the drawings. The electronic device 101 of this embodiment is joined to the element housing package 1 typified by the above embodiment, the electronic component 9 placed in the placement area of the element housing package 1, and the frame 5. And a lid 103 for sealing the electronic component 9.

  As shown in FIG. 1, in the electronic device 101 of the present embodiment, the electronic component 9 is placed in the placement area of the substrate 3. The electronic component 9 is electrically connected to the wiring conductor 25 of the input / output member 7 through the bonding wire 15. A desired input / output can be obtained from the electronic component 9 by inputting / outputting an external signal to / from the electronic component 9 via the wiring conductor 25 or the like.

  The lid 103 is joined to the frame 5 and provided to seal the electronic component 9. The lid 103 is joined to the upper surface of the frame 5. The electronic component 9 is sealed in a space surrounded by the base body, the frame body 5 and the lid body 103. By sealing the electronic component 9 in this way, deterioration of the electronic component 9 due to the long-term use of the package 1 can be suppressed.

  As the lid 103, for example, a metal member such as iron, copper, nickel, chromium, cobalt, and tungsten, or an alloy made of these metals can be used. Moreover, you may join the frame 5 and the cover body 103, for example using gold- tin solder.

  The frame 5 and the lid 103 may be directly joined. For example, a metal member having a ring shape that overlaps the frame 5 when viewed in plan, a so-called seal ring is interposed therebetween. It may be joined.

  As mentioned above, although the element storage package of one embodiment and the electronic apparatus provided with the same have been described, the present invention is not limited to the above-described embodiment. That is, various modifications can be made without departing from the scope of the present invention.

1 ... Electronic component storage package (package)
3 ... substrate 5 ... frame 7 ... input / output member 9 ... electronic component 11 ... screw 13 ... mounting substrate 15 ... bonding wire 17 ... mounting substrate 19 .... Insulating member 19a ... side 19b ... upper surface 19c ... lower surface 21 ... first insulating member 23 ... second insulating member 25 ... wiring conductor 27 ... first Metallized layer 29 ... first region 31 ... second region 33 ... second metallized layer 35 ... holding member 101 ... electronic device 103 ... lid

Claims (4)

A substrate having a placement area on the top surface on which electronic components are placed;
A frame body provided on the upper surface of the substrate so as to surround the placement area, and having a through-hole opened in an inner peripheral surface and an outer peripheral surface;
An electronic component storage package comprising an insulating member and a wiring conductor drawn from the inside to the outside of the region surrounded by the frame, and an input / output member joined to the through hole by a brazing material. And
The side surface of the insulating member parallel to the direction in which the wiring conductor is drawn out includes a first region located between an inner peripheral surface and an outer peripheral surface of the frame body and an outer side of the frame body, and an inner periphery of the frame body. A second region located between the surface and the outer peripheral surface to the inside of the frame,
An electronic component storage package, wherein the first region is covered with a metallized layer.   2. The electronic component storage package according to claim 1, wherein a boundary between the first region and the second region is parallel to an inner peripheral surface of the frame. When the metallized layer is a first metallized layer,
The electronic component storage package according to claim 1, further comprising a second metallization layer provided on a lower surface of the insulating member. The electronic component storage package according to claim 1;
An electronic component placed in the placement area of the electronic component storage package;
An electronic device comprising: a lid body that seals the electronic component joined to an upper surface of the frame body.

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