JP2013111736A - ロボットシステムおよび加工品の製造方法 - Google Patents
ロボットシステムおよび加工品の製造方法 Download PDFInfo
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- JP2013111736A JP2013111736A JP2011263018A JP2011263018A JP2013111736A JP 2013111736 A JP2013111736 A JP 2013111736A JP 2011263018 A JP2011263018 A JP 2011263018A JP 2011263018 A JP2011263018 A JP 2011263018A JP 2013111736 A JP2013111736 A JP 2013111736A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
- B05B13/0431—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation with spray heads moved by robots or articulated arms, e.g. for applying liquid or other fluent material to 3D-surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
- B05C5/0212—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles
- B05C5/0216—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path
- B05C5/022—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles only at particular parts of the articles by relative movement of article and outlet according to a predetermined path the outlet being fixed during operation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0162—Silicon containing polymer, e.g. silicone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Manipulator (AREA)
Abstract
【解決手段】上記した課題を解決するために、供給部と、ロボットとを備えるようにロボットシステムを構成する。供給部は、所定位置に固定して設けられ、被加工品の加工に用いる供給材を供給する。ロボットは、所定の受け渡し位置において作業者から渡された加工前の被加工品を供給部の近傍へ移送し、供給部から供給される供給材を用いて被加工品を加工した後、加工後の被加工品を上記の受け渡し位置へ移送する。
【選択図】図4C
Description
2 仕切り壁
3 シャッター部
4 制御装置
5 タッチパネル
6 サーボモータ
7 シリンダ部
7a 加圧部
8 スタンド
9 ディスペンサ
9a ノズル
10 ロボット
11 第1アーム部
12 第2アーム部
13 第3アーム部
14 第4アーム部
15 ロボットハンド
15a スライド部
15b ガイドレール
15c 側壁部
100 作業者
500 シリコンカートリッジ
P1、P2、P3 電子部品
W 基板
Claims (7)
- 所定位置に固定して設けられ、被加工品の加工に用いる供給材を供給する供給部と、
所定の受け渡し位置において作業者から渡された加工前の前記被加工品を前記供給部の近傍へ移送し、前記供給部から供給される前記供給材を用いて前記被加工品を加工した後、加工後の前記被加工品を前記受け渡し位置へ移送するロボットと
を備えることを特徴とするロボットシステム。 - 前記ロボットは、
前記被加工品を載置するテーブル
をさらに備え、
前記受け渡し位置における前記被加工品の受け渡しの際に、前記テーブルを前記作業者の所在する方向へ傾けることを特徴とする請求項1に記載のロボットシステム。 - 前記供給材は、
液状材であって、
前記ロボットは、
前記被加工品を前記供給部に対して動かしながら前記液状材を前記被加工品の所定部位へ付着させることを特徴とする請求項1または2に記載のロボットシステム。 - 前記ロボットは、
前記液状材が前記所定部位へ波打って付着するように、前記被加工品を所定の振幅で揺動させることを特徴とする請求項3に記載のロボットシステム。 - 前記ロボットは、
同一の前記被加工品が複数個の前記所定部位を有する場合に、前記供給部を1つの前記所定部位から他の前記所定部位へ相対的に移動させるに際して、前記被加工品を前記液状材が供給される領域から一旦退避させることを特徴とする請求項3または4に記載のロボットシステム。 - 前記液状材は、
シリコン樹脂であり、
前記被加工品は、
電子機器用の基板であり、
前記所定部位は、
前記基板と当該基板に取り付けられた電子部品とが接する部位を含むことを特徴とする請求項3、4または5に記載のロボットシステム。 - 固定された所定位置から供給材を供給する供給工程と、
所定の受け渡し位置において作業者から渡された加工前の被加工品を前記所定位置の近傍に移送させ、前記供給工程から供給される前記供給材を用いて前記被加工品を加工させた後、加工後の前記被加工品を前記受け渡し位置へ移送させる制御をロボットに対して行う制御工程と
を含むことを特徴とする加工品の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011263018A JP2013111736A (ja) | 2011-11-30 | 2011-11-30 | ロボットシステムおよび加工品の製造方法 |
US13/448,395 US20130133189A1 (en) | 2011-11-30 | 2012-04-17 | Robot system and method of manufacturing workpiece |
EP12170128.8A EP2639824A2 (en) | 2011-11-30 | 2012-05-31 | Robot system and method of manufacturing workpiece |
CN2012101818475A CN103137523A (zh) | 2011-11-30 | 2012-06-04 | 机器人系统和工件制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011263018A JP2013111736A (ja) | 2011-11-30 | 2011-11-30 | ロボットシステムおよび加工品の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2013111736A true JP2013111736A (ja) | 2013-06-10 |
Family
ID=46201426
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011263018A Pending JP2013111736A (ja) | 2011-11-30 | 2011-11-30 | ロボットシステムおよび加工品の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130133189A1 (ja) |
EP (1) | EP2639824A2 (ja) |
JP (1) | JP2013111736A (ja) |
CN (1) | CN103137523A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113519209B (zh) * | 2019-01-04 | 2023-01-24 | 捷普有限公司 | 提供电路板组件底部填充物分配器的设备、系统和方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04163926A (ja) * | 1990-10-26 | 1992-06-09 | Nippon Chemicon Corp | 半導体封止方法 |
JPH08112791A (ja) * | 1994-10-12 | 1996-05-07 | Nitto Denko Corp | シールテープ自動貼付け装置 |
JP2002192488A (ja) * | 2000-12-26 | 2002-07-10 | Koganei Corp | ロボット制御装置 |
JP2003524896A (ja) * | 2000-02-23 | 2003-08-19 | フィーコ ビー.ブイ. | 電子部品を処理するための装置および方法 |
JP2003309158A (ja) * | 2002-04-12 | 2003-10-31 | Tokyo Electron Ltd | 処理装置 |
JP2005169489A (ja) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | 斜動多関節ロボットを補助ロボットとして使用する溶接システム |
JP2006081955A (ja) * | 2004-09-14 | 2006-03-30 | Nachi Fujikoshi Corp | シーリング・システム |
JP2006093497A (ja) * | 2004-09-27 | 2006-04-06 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2010269418A (ja) * | 2009-05-22 | 2010-12-02 | Ihi Corp | ロボット制御装置およびその制御方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003229444A (ja) | 2001-11-30 | 2003-08-15 | Apic Yamada Corp | 成形品収納装置及び樹脂封止装置 |
-
2011
- 2011-11-30 JP JP2011263018A patent/JP2013111736A/ja active Pending
-
2012
- 2012-04-17 US US13/448,395 patent/US20130133189A1/en not_active Abandoned
- 2012-05-31 EP EP12170128.8A patent/EP2639824A2/en not_active Withdrawn
- 2012-06-04 CN CN2012101818475A patent/CN103137523A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04163926A (ja) * | 1990-10-26 | 1992-06-09 | Nippon Chemicon Corp | 半導体封止方法 |
JPH08112791A (ja) * | 1994-10-12 | 1996-05-07 | Nitto Denko Corp | シールテープ自動貼付け装置 |
JP2003524896A (ja) * | 2000-02-23 | 2003-08-19 | フィーコ ビー.ブイ. | 電子部品を処理するための装置および方法 |
JP2002192488A (ja) * | 2000-12-26 | 2002-07-10 | Koganei Corp | ロボット制御装置 |
JP2003309158A (ja) * | 2002-04-12 | 2003-10-31 | Tokyo Electron Ltd | 処理装置 |
JP2005169489A (ja) * | 2003-12-15 | 2005-06-30 | Toyota Motor Corp | 斜動多関節ロボットを補助ロボットとして使用する溶接システム |
JP2006081955A (ja) * | 2004-09-14 | 2006-03-30 | Nachi Fujikoshi Corp | シーリング・システム |
JP2006093497A (ja) * | 2004-09-27 | 2006-04-06 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2010269418A (ja) * | 2009-05-22 | 2010-12-02 | Ihi Corp | ロボット制御装置およびその制御方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130133189A1 (en) | 2013-05-30 |
CN103137523A (zh) | 2013-06-05 |
EP2639824A2 (en) | 2013-09-18 |
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