JP2013095006A5 - - Google Patents

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Publication number
JP2013095006A5
JP2013095006A5 JP2011238371A JP2011238371A JP2013095006A5 JP 2013095006 A5 JP2013095006 A5 JP 2013095006A5 JP 2011238371 A JP2011238371 A JP 2011238371A JP 2011238371 A JP2011238371 A JP 2011238371A JP 2013095006 A5 JP2013095006 A5 JP 2013095006A5
Authority
JP
Japan
Prior art keywords
pasting
sticking
holding sheet
pressing mechanism
pasted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011238371A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013095006A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011238371A priority Critical patent/JP2013095006A/ja
Priority claimed from JP2011238371A external-priority patent/JP2013095006A/ja
Priority to TW101138587A priority patent/TW201317116A/zh
Priority to KR1020120117135A priority patent/KR20130047590A/ko
Publication of JP2013095006A publication Critical patent/JP2013095006A/ja
Publication of JP2013095006A5 publication Critical patent/JP2013095006A5/ja
Pending legal-status Critical Current

Links

JP2011238371A 2011-10-31 2011-10-31 貼付装置および貼付方法 Pending JP2013095006A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011238371A JP2013095006A (ja) 2011-10-31 2011-10-31 貼付装置および貼付方法
TW101138587A TW201317116A (zh) 2011-10-31 2012-10-19 貼合裝置及貼合方法
KR1020120117135A KR20130047590A (ko) 2011-10-31 2012-10-22 접착 장치 및 접착 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011238371A JP2013095006A (ja) 2011-10-31 2011-10-31 貼付装置および貼付方法

Publications (2)

Publication Number Publication Date
JP2013095006A JP2013095006A (ja) 2013-05-20
JP2013095006A5 true JP2013095006A5 (cg-RX-API-DMAC7.html) 2014-08-21

Family

ID=48617482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011238371A Pending JP2013095006A (ja) 2011-10-31 2011-10-31 貼付装置および貼付方法

Country Status (3)

Country Link
JP (1) JP2013095006A (cg-RX-API-DMAC7.html)
KR (1) KR20130047590A (cg-RX-API-DMAC7.html)
TW (1) TW201317116A (cg-RX-API-DMAC7.html)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160133500A (ko) 2014-03-14 2016-11-22 쓰리엠 이노베이티브 프로퍼티즈 컴파니 첩부 방법 및 필름
JP6616060B2 (ja) * 2014-03-14 2019-12-04 スリーエム イノベイティブ プロパティズ カンパニー 貼付装置及び貼付方法
US10507634B2 (en) 2014-03-14 2019-12-17 3M Innovative Properties Compnay Application device and application method
JP6320211B2 (ja) * 2014-07-17 2018-05-09 三菱電機株式会社 貼合装置
JP6706746B2 (ja) * 2015-12-16 2020-06-10 株式会社タカトリ 接着シート貼り付け装置及び貼り付け方法
CN109633942A (zh) * 2019-01-08 2019-04-16 厦门柯尔自动化设备有限公司 一种偏光片无气泡贴合装置
CN110356015B (zh) * 2019-08-14 2024-04-26 东莞市益诚自动化设备有限公司 一种胶粒自动上料粘贴设备
JP7488565B2 (ja) 2020-11-05 2024-05-22 株式会社石山製作所 貼付装置
CN115691302B (zh) * 2022-10-28 2024-11-22 贵州电网有限责任公司 一种便携式绝缘标志牌粘贴器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004358856A (ja) * 2003-06-06 2004-12-24 Hitachi Industries Co Ltd フィルム貼り付け方法
JP2008300521A (ja) * 2007-05-30 2008-12-11 Disco Abrasive Syst Ltd 半導体ウェーハおよびその加工方法
JP2011014790A (ja) * 2009-07-03 2011-01-20 Hitachi High-Technologies Corp Ａｃｆ貼付装置及び貼付方法

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