JP2013095006A5 - - Google Patents
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- Publication number
- JP2013095006A5 JP2013095006A5 JP2011238371A JP2011238371A JP2013095006A5 JP 2013095006 A5 JP2013095006 A5 JP 2013095006A5 JP 2011238371 A JP2011238371 A JP 2011238371A JP 2011238371 A JP2011238371 A JP 2011238371A JP 2013095006 A5 JP2013095006 A5 JP 2013095006A5
- Authority
- JP
- Japan
- Prior art keywords
- pasting
- sticking
- holding sheet
- pressing mechanism
- pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Description
また、上記課題を解決するために、本発明に係る貼付方法は、被貼付部材に対し、貼始端と該貼始端に対向した貼終端とを有する貼付部材を貼始端から貼終端にかけて貼り付けていく貼付方法であって、
ワークステージに被貼付部材を載置するステップと、ワークステージの載置面に対向して設けられた保持シートに保持された貼付部材とワークステージ上の被貼付部材とが所定のギャップになるように保持シートを下降させるステップと、保持シートを上方から押圧する押圧機構により保持シートを押圧して貼付部材の貼始端を被貼付部材に押し付けるとともに、貼終端を貼始端よりも上方に位置させた状態で、保持シートを押圧機構に沿って上方に折り曲げるために保持シートの一端と押圧機構との間に設けられた剥離機構を、押圧機構とともに貼始端側に位置する保持シートの一端側から貼終端側に位置する保持シートの他端側に移動させるステップと、を含む貼付プロセスを備えたことを特徴とする。
Moreover, in order to solve the said subject, the sticking method which concerns on this invention sticks the sticking member which has a sticking end and the sticking end opposite to this sticking end from a sticking end to a sticking end with respect to a to-be-pasted member. It is a method of pasting,
The step of placing the member to be pasted on the work stage, and the pasting member held on the holding sheet provided facing the work stage placing surface and the member to be stuck on the work stage form a predetermined gap. The holding sheet is lowered by a pressing mechanism that presses the holding sheet from above and the sticking end of the sticking member is pressed against the sticking member and the sticking end is positioned above the sticking end. state, the holding sheet peeling mechanism provided between the one end and the pressing mechanism of the holding sheet to bend upward along the pressing mechanism, from one end of the holding sheet located pasting the pressing mechanism start-end side and moving the other end of the holding sheet located bonded final end side, characterized by comprising a sticking process comprising.
Claims (1)
ワークステージに前記被貼付部材を載置するステップと、
前記ワークステージの載置面に対向して設けられた保持シートに保持された前記貼付部材と前記ワークステージ上の前記被貼付部材とが所定のギャップになるように前記保持シートを下降させるステップと、
前記保持シートを上方から押圧する押圧機構により前記保持シートを押圧して前記貼付部材の前記貼始端を前記被貼付部材に押し付けるとともに、前記貼終端を前記貼始端よりも上方に位置させた状態で、前記保持シートを前記押圧機構に沿って上方に折り曲げるために前記保持シートの一端と前記押圧機構との間に設けられた剥離機構を、前記押圧機構とともに前記貼始端側に位置する前記保持シートの一端側から前記貼終端側に位置する前記保持シートの他端側に移動させるステップと、
を含む貼付プロセスを備えたことを特徴とする貼付方法。 For a member to be pasted, a pasting method in which a pasting member having a pasting end and a pasting end facing the pasting end is pasted from the pasting end to the pasting end,
Placing the member to be pasted on a work stage;
Lowering the holding sheet so that a predetermined gap is formed between the sticking member held by a holding sheet provided facing the mounting surface of the work stage and the adherend member on the work stage; ,
In a state where the holding sheet is pressed by a pressing mechanism that presses the holding sheet from above to press the sticking end of the sticking member against the sticking member, and the sticking end is positioned above the sticking end. , the holding said peeling mechanism provided between one end of the holding sheet holding sheet to bend upward along the pressing mechanism and the pressing mechanism, located at the bonded start end side together with the pressing mechanism and moving from one end side of the sheet to the other end of the holding sheet located at the bonded end-end side,
A pasting method comprising: a pasting process including:
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011238371A JP2013095006A (en) | 2011-10-31 | 2011-10-31 | Pasting device and pasting method |
TW101138587A TW201317116A (en) | 2011-10-31 | 2012-10-19 | Laminating apparatus and the laminating method |
KR1020120117135A KR20130047590A (en) | 2011-10-31 | 2012-10-22 | Sticking apparatus and sticking method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011238371A JP2013095006A (en) | 2011-10-31 | 2011-10-31 | Pasting device and pasting method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013095006A JP2013095006A (en) | 2013-05-20 |
JP2013095006A5 true JP2013095006A5 (en) | 2014-08-21 |
Family
ID=48617482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011238371A Pending JP2013095006A (en) | 2011-10-31 | 2011-10-31 | Pasting device and pasting method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2013095006A (en) |
KR (1) | KR20130047590A (en) |
TW (1) | TW201317116A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10507634B2 (en) | 2014-03-14 | 2019-12-17 | 3M Innovative Properties Compnay | Application device and application method |
CN106103287B (en) | 2014-03-14 | 2018-05-25 | 3M创新有限公司 | Method of administration and film |
JP6616060B2 (en) * | 2014-03-14 | 2019-12-04 | スリーエム イノベイティブ プロパティズ カンパニー | Pasting device and pasting method |
JP6320211B2 (en) * | 2014-07-17 | 2018-05-09 | 三菱電機株式会社 | Bonding device |
JP6706746B2 (en) * | 2015-12-16 | 2020-06-10 | 株式会社タカトリ | Adhesive sheet pasting device and pasting method |
CN109633942A (en) * | 2019-01-08 | 2019-04-16 | 厦门柯尔自动化设备有限公司 | A kind of polaroid bubble-free laminating device |
CN110356015B (en) * | 2019-08-14 | 2024-04-26 | 东莞市益诚自动化设备有限公司 | Automatic feeding and pasting equipment for colloidal particles |
JP7488565B2 (en) | 2020-11-05 | 2024-05-22 | 株式会社石山製作所 | Application device |
CN115691302A (en) * | 2022-10-28 | 2023-02-03 | 贵州电网有限责任公司 | Portable insulated sign board sticking device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004358856A (en) * | 2003-06-06 | 2004-12-24 | Hitachi Industries Co Ltd | Method for pasting up film |
JP2008300521A (en) * | 2007-05-30 | 2008-12-11 | Disco Abrasive Syst Ltd | Semiconductor wafer and its processing method |
JP2011014790A (en) * | 2009-07-03 | 2011-01-20 | Hitachi High-Technologies Corp | Acf sticking device and sticking method |
-
2011
- 2011-10-31 JP JP2011238371A patent/JP2013095006A/en active Pending
-
2012
- 2012-10-19 TW TW101138587A patent/TW201317116A/en unknown
- 2012-10-22 KR KR1020120117135A patent/KR20130047590A/en not_active Application Discontinuation
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