JP2004358856A - Method for pasting up film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method capable of simplifying a preparation process and pasting up a film preliminarily cut into a desired dimension on a substrate at a desired position without causing air bubbles or wrinkles. <P>SOLUTION: The film F preliminarily cut into a desired dimension is held on a sheet 16 and the other end side of the film F is lifted up from the substrate 2 with respect to one end side of the aligned film F and one end side of the substrate 2. Then, pressure means 17A and 17B are moved on the sheet from one end side of the film to the other end side thereof to successively paste up the film F on the substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a film sticking method for sticking a film cut to a desired size in a desired position on a substrate.
[0002]
[Prior art]
As in the case of attaching a deflection plate in the process of manufacturing a liquid crystal display panel, a film which has not been rolled and has been cut into a desired size in advance may be attached to a desired position on a substrate.
[0003]
When laminating a film cut to the desired size, it is possible to paste while pushing out bubbles without contacting the substrate and the film at the beginning of lamination, but the film and the substrate contact at the end of the lamination. It is difficult to adhere while keeping this distance without doing so. If the film is adhered in a state where the substrate and the film are in contact with each other, the air bubbles cannot be pushed out, and the air bubbles enter the adhered surface.
[0004]
In order to prevent this, in Patent Literature 1 below, minute holes (5 to 100 μm) are provided in the film to be attached, and bubbles are expelled from these holes.
[0005]
[Patent Document 1]
JP 2001-279195 A
[Problems to be solved by the invention]
In the above-mentioned conventional technique, it is necessary to provide a large number of fine holes evenly in advance in a film, and preparation is difficult. In addition, since the end of the film is gripped by the holding member, when sticking the end, the grip is stopped and released, and the film is dropped on the substrate. In this case, even if the air bubbles fall out of the holes, wrinkles may be generated depending on the way of falling.
[0007]
Accordingly, an object of the present invention is to provide a film sticking method capable of simplifying a preparation step and sticking a film cut to a desired size in a desired position on a substrate without generating bubbles or wrinkles. It is in.
[0008]
[Means for Solving the Problems]
A feature of the present invention that achieves the above object is that in a film sticking method for sticking a film previously cut to a desired size to a desired position on a substrate, the film is held by a sheet and the film is aligned. And the other end of the film is lifted from the substrate with respect to one end of the substrate, and the pressing means is moved from the one end to the other end of the sheet to sequentially move the film. It is to stick to the substrate.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
An embodiment according to the present invention will be described below with reference to FIGS.
[0010]
In FIG. 1, reference numeral 11 denotes a film holder having a plurality of suction holes on its lower surface. The base film 1 having a larger area than the lower surface is held on the lower surface of the film holder 11 by the suction holes.
[0011]
The base film 1 has a laminated structure using the adhesiveness of the resist film 1b in the order of the base film 1a, the resist film 1b, and the cover film 1c from the lower surface side of the film holding base 11, and has a shape of a substrate (described later) to be bonded. It is cut in advance as a desired shape that matches.
[0012]
A large number of base films 1 previously cut into desired dimensions are stacked and stored in a stock case (not shown) with the base film 1a facing upward, and the film holding table 11 sequentially sucks the base films 1 one by one. And remove it from the stock case.
[0013]
In FIG. 1, a film holding table 11 on which one base film 1 is adsorbed on the lower surface is installed at a desired position, and the imaging cameras 12A and 12B read alignment marks and edge positions provided in advance on the base film 1. Thus, the user intends to recognize the position where the base film 1 is held by suction on the film holding table 11.
[0014]
In addition, at this desired position, a state is shown in which the peeling roller 13 having an adhesive surface is in contact with the cover film 1c and rotates clockwise to peel off the cover film 1c. When peeling the cover film 1c, the cover film 1c may be peeled off when the peeling roller 13 is rotated to the right with an adhesive tape wound around the peeling roller 13.
[0015]
The two-layer film composed of the base film 1a and the resist film 1b after the cover film 1c has been peeled off is referred to as an adhesive film F.
[0016]
FIG. 2 shows the substrate 2 to which the adhesive film F is attached.
The imaging cameras 14A and 14B read the alignment marks provided on the substrate 2 to recognize the position of the substrate 2 so that the film holding table 11 can position the attached film F to a desired position on the substrate 2. I do.
[0017]
In FIG. 2, reference numeral 15 denotes a sheet roll formed by winding a dielectric sheet 16, and reference numerals 17A and 17B denote sticking rollers. The functions and operations of the sheet 16 and the sticking rollers 17A and 17B will be described later.
[0018]
When the position of the substrate 2 is grasped by the imaging cameras 14A and 14B, the adhesive film F is aligned with the desired position of the substrate 2 by the film holding stand 11 as shown in FIG. The left end of F is temporarily fixed to the substrate 2. In the positioning of the adhesive film F and the substrate 2, the weight of the film holder 11 is not added to the adhesive film F, and the adhesive film F is temporarily fixed to the substrate 2 by the adhesive member 18 by thermocompression. Do.
[0019]
Thereafter, the suction holding of the attached film F by the film holding base 11 is released, and as shown in FIG. 4, the film holding base 11 is retracted, and the right end of the sheet 16 is gripped by the chuck 19. The sheet 16 is made of a dielectric material and has a larger width (the width is measured in the front-rear direction in the figure) than the adhesive film F.
[0020]
Then, as shown in FIG. 5, the chuck 19 is moved to the right through the bonding rollers 17A and 17B so that the sheet 16 is stretched to be positioned on the bonding film F.
[0021]
In FIG. 6, reference numerals 20A to 20C denote charge applying means for applying static electricity from the charge applying means 20A to 20C to electrostatically adsorb the sheet 16 and the adhesive film F.
[0022]
Thereafter, as shown in FIG. 7, the chuck 19 is lifted with the temporary attaching portion A as a fulcrum, and the attaching rollers 17A and 17B are moved to the temporary attaching portion A as shown in FIG. , 17B between the sheet 16, the adhesive film F and the substrate 2.
[0023]
Then, as shown in FIG. 9, the sticking rollers 17A and 17B are arranged from the left side to the right side where the temporary attaching portion A is located, and the sheet 16, the sticking film F and the substrate 2 are sandwiched between the sticking rollers 17A and 17B. Roll.
[0024]
In this case, since the chuck 19 is located above the lowermost portion of the attaching roller 17A, there is a space between the attaching film F and the substrate 2 that rises to the right with respect to the upper surface of the substrate 2. As a result, the rolling of the bonding rollers 17A and 17B causes the bonding film F and the substrate 2 to be bonded by pressure while the air between the bonding film F and the substrate 2 is sequentially expelled. When the pasting rollers 17A and 17B roll to the right end position of the pasting film F, the pasting of the pasting film F to the substrate 2 is completed.
[0025]
Thereafter, as shown in FIG. 10, the sticking rollers 17A and 17B are opened, and the charge on the sheet 16 is charged by the charge removing means 21A to 21C by applying a charge of the opposite polarity to the charge applying means 20A to 20C to the sheet 16. I will erase it.
[0026]
The static elimination may be performed before the application rollers 17A, 17B are opened, and the application rollers 17A, 17B may be eliminated.
[0027]
If the sheet 16 is lightly pressed when the attaching rollers 17A and 17B are returned to the left after the charge removing means 21A to 21C are retracted, the charge removal on the film F is further improved.
[0028]
The static elimination of the sheet 16 releases the electrostatic attraction between the sheet 16 and the adhesive film F, and also releases the dielectric of the adhesive film F. Therefore, after the substrate 2 is taken out as shown in FIG. The substrate 2 can be kept clean without being attracted to the substrate 2.
[0029]
The static elimination means 21A to 21C may be a grounded brush or a means for performing static elimination by spraying a mist to generate a discharge.
[0030]
If the sheet 16 is bonded an appropriate number of times, the sheet 16 is cut in the width direction by the disk cutter 22 or the like, and a new sheet 16 is drawn out and used, so that the cleanliness can be maintained.
[0031]
In the above-described embodiment, the preparation for the base film 1 is almost unnecessary, and furthermore, from the start position of the application of the adhesive film F to the substrate 2 (one end side of the adhesive film F) to the end position (the position of the adhesive film F). Since the application of pressure can be continuously performed for the whole up to the other end), no bubbles or wrinkles are generated.
[0032]
The attachment described above may be performed in a vacuum or under reduced pressure,
It may be performed under an inert atmosphere.
[0033]
A heating means such as an electric heater is built in the attaching rollers 17A and 17B, and the adhesive film F and the substrate 2 are heated, and the adhesiveness of the resist film 1b is improved by applying heat and pressure to perform the attaching. You may do so.
[0034]
Instead of the charge applying means 20A to 20C, an adhesive sheet is used as the sheet 16, and the upper surface of the base film 1a in the adhesive film F is adhered by the adhesive property of the sheet 16 in the stage of FIG. As shown, the right side may be lifted.
[0035]
Instead of the suction holding of the base film 1 by the film holding base 11, the electrostatic suction holding by the film holding base 11 having a built-in electrostatic suction means may be performed. In this case, if the electrostatic attraction is to be performed on the sheet 16, there is a possibility that the residual charge may not be sufficient to hold the sheet 16. It is preferable to carry out the electrostatic suction holding by using the following method.
[0036]
【The invention's effect】
As described above, according to the present invention, not only the preparation process can be simplified, but also a film cut into a desired size in advance at a desired position on a substrate can be attached without generating bubbles or wrinkles.
[Brief description of the drawings]
FIG. 1 is a view showing a situation in which a cover film is peeled from a base film in an embodiment according to the present invention.
FIG. 2 is a diagram showing a situation in which a substrate is image-recognized in a step following FIG. 1;
FIG. 3 is a view showing a situation in which a sticking film is temporarily attached to a substrate in a step following FIG. 2;
FIG. 4 is a diagram illustrating a situation where a sheet is gripped by a chuck in a process subsequent to FIG. 3;
FIG. 5 is a view showing a state in which a sheet is attached and stretched on a film with a chuck in a step following FIG. 4;
FIG. 6 is a view showing a state following the step shown in FIG. 5 in which a charge is applied to hold the sheet and the adhesive film by electrostatic attraction.
FIG. 7 is a view showing a state in which one side of an adhesive film held by a sheet is lifted in a step following FIG. 6;
FIG. 8 is a view showing a situation in which a pasting film is pasted on a substrate from above a sheet in a step following FIG. 7;
FIG. 9 is a view showing a state in which a sticking film is stuck to a substrate from above a sheet in a step following FIG. 8;
FIG. 10 is a view showing a situation following the step shown in FIG. 9 in which a staying charge of the sheet is removed after the sticking film is attached to the substrate.
FIG. 11 is a diagram showing a state after a film is attached to a substrate in the embodiment according to the present invention.
[Explanation of symbols]
F: Adhesive film 1: Base film 1a: Base film 1b: Resist film 1c: Cover film 2: Substrate 11: Film holders 12A, 12B, 14A, 14B: Imaging camera 13: Peeling roller 15: Sheet roll 16: Sheet 17A, 17B: adhering roller 18, temporary attaching member 19, chucks 20A to 20C, charge applying means 21A to 21C, static elimination means

Claims (4)

In a film pasting method for pasting a film cut to a desired size in a desired position on a substrate,
The film is held by a sheet, and the other end of the film is floated from the substrate with respect to the aligned film and one end of the substrate. A film sticking method, wherein the film sticks to the substrate while moving toward the other end. In the film sticking method according to claim 1,
The film sticking method, wherein the sheet electrostatically holds the film. In the film sticking method according to claim 1,
The film is held by suction and suction means and placed at a desired position on the substrate, and one end of the aligned film is temporarily attached to the substrate, and then the film is held by the sheet. Characteristic film sticking method. In the film sticking method according to claim 2,
After attaching the film to the substrate, static elimination of the sheet is performed.

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