JP2013092633A - ポジ型感光性組成物 - Google Patents

ポジ型感光性組成物 Download PDF

Info

Publication number
JP2013092633A
JP2013092633A JP2011234285A JP2011234285A JP2013092633A JP 2013092633 A JP2013092633 A JP 2013092633A JP 2011234285 A JP2011234285 A JP 2011234285A JP 2011234285 A JP2011234285 A JP 2011234285A JP 2013092633 A JP2013092633 A JP 2013092633A
Authority
JP
Japan
Prior art keywords
group
general formula
carbon atoms
compound
positive photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011234285A
Other languages
English (en)
Japanese (ja)
Inventor
Hiromi Takenouchi
宏美 竹之内
Junichi Omi
仁一 尾見
Seiichi Saito
誠一 斎藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Priority to JP2011234285A priority Critical patent/JP2013092633A/ja
Priority to TW101135177A priority patent/TWI556062B/zh
Priority to KR1020120112317A priority patent/KR20130045172A/ko
Priority to CN2012103835704A priority patent/CN103076721A/zh
Publication of JP2013092633A publication Critical patent/JP2013092633A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2011234285A 2011-10-25 2011-10-25 ポジ型感光性組成物 Pending JP2013092633A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011234285A JP2013092633A (ja) 2011-10-25 2011-10-25 ポジ型感光性組成物
TW101135177A TWI556062B (zh) 2011-10-25 2012-09-25 Positive type photosensitive composition
KR1020120112317A KR20130045172A (ko) 2011-10-25 2012-10-10 포지티브형 감광성 조성물
CN2012103835704A CN103076721A (zh) 2011-10-25 2012-10-11 正型感光性组合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011234285A JP2013092633A (ja) 2011-10-25 2011-10-25 ポジ型感光性組成物

Publications (1)

Publication Number Publication Date
JP2013092633A true JP2013092633A (ja) 2013-05-16

Family

ID=48153293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011234285A Pending JP2013092633A (ja) 2011-10-25 2011-10-25 ポジ型感光性組成物

Country Status (4)

Country Link
JP (1) JP2013092633A (ko)
KR (1) KR20130045172A (ko)
CN (1) CN103076721A (ko)
TW (1) TWI556062B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014115438A (ja) * 2012-12-10 2014-06-26 Jsr Corp 表示素子用感放射線性樹脂組成物、硬化膜、硬化膜の製造方法、半導体素子および表示素子
WO2016052390A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
WO2016052389A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
WO2016052391A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
KR20160102538A (ko) 2014-02-13 2016-08-30 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 액정 표시 장치, 유기 el 표시 장치, 터치 패널 표시 장치

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570187B (zh) 2015-12-17 2017-02-11 財團法人工業技術研究院 光學固態預聚物與模塑組成物
TWI665519B (zh) * 2016-06-30 2019-07-11 奇美實業股份有限公司 正型感光性樹脂組成物及其應用
TWI721145B (zh) * 2017-03-31 2021-03-11 奇美實業股份有限公司 正型感光性聚矽氧烷組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101558442B1 (ko) * 2007-11-13 2015-10-07 가부시키가이샤 아데카 포지티브형 감광성 조성물, 포지티브형 영구 레지스트 및 포지티브형 영구 레지스트의 제조 방법
KR101094005B1 (ko) * 2008-03-31 2011-12-15 히다치 가세고교 가부시끼가이샤 실리카계 포지티브형 감광성 수지 조성물
JP4960330B2 (ja) * 2008-10-21 2012-06-27 株式会社Ａｄｅｋａ ポジ型感光性組成物及び永久レジスト
TWI502004B (zh) * 2009-11-09 2015-10-01 Dow Corning 群集官能性聚有機矽氧烷之製法及其使用方法
JP2011186069A (ja) * 2010-03-05 2011-09-22 Adeka Corp 感光性樹脂組成物
JP5310656B2 (ja) * 2010-06-18 2013-10-09 信越化学工業株式会社 シルフェニレン含有光硬化性組成物、それを用いたパターン形成方法およびその方法により得られる光半導体素子

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014115438A (ja) * 2012-12-10 2014-06-26 Jsr Corp 表示素子用感放射線性樹脂組成物、硬化膜、硬化膜の製造方法、半導体素子および表示素子
KR20160102538A (ko) 2014-02-13 2016-08-30 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 액정 표시 장치, 유기 el 표시 장치, 터치 패널 표시 장치
WO2016052390A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
WO2016052389A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル
WO2016052391A1 (ja) * 2014-09-29 2016-04-07 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置、有機エレクトロルミネッセンス表示装置およびタッチパネル

Also Published As

Publication number Publication date
KR20130045172A (ko) 2013-05-03
TW201324056A (zh) 2013-06-16
CN103076721A (zh) 2013-05-01
TWI556062B (zh) 2016-11-01

Similar Documents

Publication Publication Date Title
TWI437369B (zh) A positive type photosensitive composition and a permanent resist
JP2013092633A (ja) ポジ型感光性組成物
JP5698070B2 (ja) ポジ型感光性組成物及びその硬化物
JP5136777B2 (ja) ポリオルガノシロキサン化合物、これを含む樹脂組成物及びこれらのパターン形成方法
JP5105555B2 (ja) ポジ型感光性組成物、ポジ型永久レジスト及びポジ型永久レジストの製造方法
KR102157030B1 (ko) 네거티브형 감광성 실록산 조성물
JP5479993B2 (ja) ポジ型感光性組成物及び永久レジスト
JP2012511742A (ja) 湿式エッチング可能な反射防止膜
TWI480334B (zh) A silane-based composition and a hardened film thereof, and a method for forming a negative resist pattern using the same
JP2011123450A (ja) ポジ型感放射線性組成物、層間絶縁膜及びその形成方法
KR101799361B1 (ko) 감광성 수지 조성물
JP5734629B2 (ja) ポジ型感光性樹脂組成物及び永久レジスト
JP2010008603A (ja) 配線隔壁形成用感放射線性樹脂組成物ならびに配線隔壁およびその形成方法
JP5003375B2 (ja) 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
TW201403235A (zh) 包括二苯并哌喃結構之黏合劑樹脂及包含該樹脂之有機絕緣層組合物
JP5666266B2 (ja) ポジ型感光性樹脂組成物及び永久レジスト
KR20120056773A (ko) 포지티브형 감광성 수지 조성물 및 영구 레지스트
US20230333468A1 (en) Resin composition, cured film, method for manufacturing cured film, substrate having multilayer film, method for producing patterned substrate, photosensitive resin composition, method for producing pattern cured film, method for producing polymer, and method for producing resin composition
KR20090113183A (ko) 폴리유기실록산 화합물, 이것을 포함하는 수지 조성물 및 이들의 패턴 형성 방법