JP2013089871A - 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 - Google Patents
固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 Download PDFInfo
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- JP2013089871A JP2013089871A JP2011230920A JP2011230920A JP2013089871A JP 2013089871 A JP2013089871 A JP 2013089871A JP 2011230920 A JP2011230920 A JP 2011230920A JP 2011230920 A JP2011230920 A JP 2011230920A JP 2013089871 A JP2013089871 A JP 2013089871A
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
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- 238000005286 illumination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
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- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
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- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230920A JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230920A JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013089871A true JP2013089871A (ja) | 2013-05-13 |
| JP2013089871A5 JP2013089871A5 (enrdf_load_stackoverflow) | 2014-11-27 |
Family
ID=48533468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011230920A Abandoned JP2013089871A (ja) | 2011-10-20 | 2011-10-20 | 固体撮像素子ウエハ、固体撮像素子の製造方法、および固体撮像素子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2013089871A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752382A (zh) * | 2013-12-30 | 2015-07-01 | 台湾积体电路制造股份有限公司 | 半导体器件及其制造方法 |
| JPWO2015159766A1 (ja) * | 2014-04-18 | 2017-04-13 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
| WO2019171879A1 (ja) * | 2018-03-08 | 2019-09-12 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| WO2022118670A1 (ja) * | 2020-12-04 | 2022-06-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、電子機器、製造方法 |
| WO2024185480A1 (ja) * | 2023-03-08 | 2024-09-12 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
| WO2025062837A1 (ja) * | 2023-09-19 | 2025-03-27 | ソニーセミコンダクタソリューションズ株式会社 | 半導体チップ及び電子機器 |
-
2011
- 2011-10-20 JP JP2011230920A patent/JP2013089871A/ja not_active Abandoned
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104752382A (zh) * | 2013-12-30 | 2015-07-01 | 台湾积体电路制造股份有限公司 | 半导体器件及其制造方法 |
| KR20150080433A (ko) * | 2013-12-30 | 2015-07-09 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스 및 그 제조 방법 |
| KR101700489B1 (ko) | 2013-12-30 | 2017-01-26 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 반도체 디바이스 및 그 제조 방법 |
| US9818735B2 (en) | 2013-12-30 | 2017-11-14 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing a semiconductor device |
| JPWO2015159766A1 (ja) * | 2014-04-18 | 2017-04-13 | ソニー株式会社 | 固体撮像装置および製造方法、並びに電子機器 |
| WO2019171879A1 (ja) * | 2018-03-08 | 2019-09-12 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| CN111788688A (zh) * | 2018-03-08 | 2020-10-16 | 索尼半导体解决方案公司 | 摄像装置 |
| US12087796B2 (en) | 2018-03-08 | 2024-09-10 | Sony Semiconductor Solutions Corporation | Imaging device |
| WO2022118670A1 (ja) * | 2020-12-04 | 2022-06-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置、電子機器、製造方法 |
| WO2024185480A1 (ja) * | 2023-03-08 | 2024-09-12 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置 |
| WO2025062837A1 (ja) * | 2023-09-19 | 2025-03-27 | ソニーセミコンダクタソリューションズ株式会社 | 半導体チップ及び電子機器 |
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