JP2013084876A5 - - Google Patents

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Publication number
JP2013084876A5
JP2013084876A5 JP2012026290A JP2012026290A JP2013084876A5 JP 2013084876 A5 JP2013084876 A5 JP 2013084876A5 JP 2012026290 A JP2012026290 A JP 2012026290A JP 2012026290 A JP2012026290 A JP 2012026290A JP 2013084876 A5 JP2013084876 A5 JP 2013084876A5
Authority
JP
Japan
Prior art keywords
ammonium
composition according
polishing composition
ammonium salt
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012026290A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013084876A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012026290A priority Critical patent/JP2013084876A/ja
Priority claimed from JP2012026290A external-priority patent/JP2013084876A/ja
Priority to KR1020147010937A priority patent/KR20140071446A/ko
Priority to US14/346,921 priority patent/US20140251950A1/en
Priority to PCT/JP2012/075052 priority patent/WO2013047734A1/ja
Priority to TW101135840A priority patent/TW201326376A/zh
Publication of JP2013084876A publication Critical patent/JP2013084876A/ja
Publication of JP2013084876A5 publication Critical patent/JP2013084876A5/ja
Pending legal-status Critical Current

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JP2012026290A 2011-09-30 2012-02-09 研磨用組成物 Pending JP2013084876A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012026290A JP2013084876A (ja) 2011-09-30 2012-02-09 研磨用組成物
KR1020147010937A KR20140071446A (ko) 2011-09-30 2012-09-28 연마용 조성물
US14/346,921 US20140251950A1 (en) 2011-09-30 2012-09-28 Polishing composition
PCT/JP2012/075052 WO2013047734A1 (ja) 2011-09-30 2012-09-28 研磨用組成物
TW101135840A TW201326376A (zh) 2011-09-30 2012-09-28 研磨用組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011218723 2011-09-30
JP2011218723 2011-09-30
JP2012026290A JP2013084876A (ja) 2011-09-30 2012-02-09 研磨用組成物

Publications (2)

Publication Number Publication Date
JP2013084876A JP2013084876A (ja) 2013-05-09
JP2013084876A5 true JP2013084876A5 (OSRAM) 2015-01-29

Family

ID=47995759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012026290A Pending JP2013084876A (ja) 2011-09-30 2012-02-09 研磨用組成物

Country Status (5)

Country Link
US (1) US20140251950A1 (OSRAM)
JP (1) JP2013084876A (OSRAM)
KR (1) KR20140071446A (OSRAM)
TW (1) TW201326376A (OSRAM)
WO (1) WO2013047734A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6222907B2 (ja) * 2012-09-06 2017-11-01 株式会社フジミインコーポレーテッド 研磨用組成物
JP6139975B2 (ja) * 2013-05-15 2017-05-31 株式会社フジミインコーポレーテッド 研磨用組成物
JP6113619B2 (ja) * 2013-09-30 2017-04-12 株式会社フジミインコーポレーテッド 研磨用組成物
US20170342304A1 (en) * 2015-01-19 2017-11-30 Fujimi Incorporated Polishing composition
CN107207268A (zh) 2015-01-19 2017-09-26 福吉米株式会社 改性胶体二氧化硅及其制造方法、以及使用其的研磨剂
US20190077991A1 (en) * 2015-10-09 2019-03-14 Fujimi Incorporated Polishing composition and polishing method using same, and method for producing polishing-completed object to be polished using same
US20190085207A1 (en) * 2016-03-25 2019-03-21 Fujimi Incorporated Polishing composition for object to be polished having metal-containing layer
JP6908480B2 (ja) * 2017-09-15 2021-07-28 株式会社フジミインコーポレーテッド 研磨用組成物及びその製造方法並びに研磨方法並びに基板の製造方法
TWI844518B (zh) * 2017-09-26 2024-06-11 日商福吉米股份有限公司 研磨用組合物、研磨用組合物的製造方法、研磨方法及半導體基板的製造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5858813A (en) * 1996-05-10 1999-01-12 Cabot Corporation Chemical mechanical polishing slurry for metal layers and films
JP2005340554A (ja) * 2004-05-28 2005-12-08 Hitachi Ltd 半導体記憶装置の製造方法
JP4814502B2 (ja) * 2004-09-09 2011-11-16 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
US7897061B2 (en) * 2006-02-01 2011-03-01 Cabot Microelectronics Corporation Compositions and methods for CMP of phase change alloys
JP2008098314A (ja) * 2006-10-10 2008-04-24 Nitta Haas Inc 研磨組成物
US8518296B2 (en) * 2007-02-14 2013-08-27 Micron Technology, Inc. Slurries and methods for polishing phase change materials
US20090001339A1 (en) * 2007-06-29 2009-01-01 Tae Young Lee Chemical Mechanical Polishing Slurry Composition for Polishing Phase-Change Memory Device and Method for Polishing Phase-Change Memory Device Using the Same
CN101765647B (zh) * 2007-07-26 2016-05-04 卡伯特微电子公司 用于相变材料的化学-机械抛光的组合物及方法
US7678605B2 (en) * 2007-08-30 2010-03-16 Dupont Air Products Nanomaterials Llc Method for chemical mechanical planarization of chalcogenide materials
US7915071B2 (en) * 2007-08-30 2011-03-29 Dupont Air Products Nanomaterials, Llc Method for chemical mechanical planarization of chalcogenide materials
KR101198100B1 (ko) * 2007-12-11 2012-11-09 삼성전자주식회사 상변화 물질층 패턴의 형성 방법, 상변화 메모리 장치의제조 방법 및 이에 사용되는 상변화 물질층 연마용 슬러리조성물
KR101341875B1 (ko) * 2008-04-30 2013-12-16 한양대학교 산학협력단 상변환 물질 연마용 슬러리 및 이를 이용한 상변환 물질의 패터닝 방법
US8735293B2 (en) * 2008-11-05 2014-05-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
US20100130013A1 (en) * 2008-11-24 2010-05-27 Applied Materials, Inc. Slurry composition for gst phase change memory materials polishing
US20120003834A1 (en) * 2010-07-01 2012-01-05 Koo Ja-Ho Method Of Polishing Chalcogenide Alloy
KR20120020556A (ko) * 2010-08-30 2012-03-08 삼성전자주식회사 화학적 기계적 연마 공정의 슬러리 조성물 및 이를 이용하는 상변화 메모리 소자의 형성 방법
CN102690604A (zh) * 2011-03-24 2012-09-26 中国科学院上海微系统与信息技术研究所 化学机械抛光液
US8309468B1 (en) * 2011-04-28 2012-11-13 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys
US8790160B2 (en) * 2011-04-28 2014-07-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing phase change alloys
JP2013080751A (ja) * 2011-09-30 2013-05-02 Fujimi Inc 研磨用組成物

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