JP2013084743A5 - - Google Patents

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Publication number
JP2013084743A5
JP2013084743A5 JP2011223300A JP2011223300A JP2013084743A5 JP 2013084743 A5 JP2013084743 A5 JP 2013084743A5 JP 2011223300 A JP2011223300 A JP 2011223300A JP 2011223300 A JP2011223300 A JP 2011223300A JP 2013084743 A5 JP2013084743 A5 JP 2013084743A5
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JP
Japan
Prior art keywords
semiconductor device
microlens
length
shape
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011223300A
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English (en)
Japanese (ja)
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JP5800662B2 (ja
JP2013084743A (ja
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Publication date
Application filed filed Critical
Priority to JP2011223300A priority Critical patent/JP5800662B2/ja
Priority claimed from JP2011223300A external-priority patent/JP5800662B2/ja
Priority to US13/611,375 priority patent/US9276028B2/en
Publication of JP2013084743A publication Critical patent/JP2013084743A/ja
Publication of JP2013084743A5 publication Critical patent/JP2013084743A5/ja
Application granted granted Critical
Publication of JP5800662B2 publication Critical patent/JP5800662B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011223300A 2011-10-07 2011-10-07 半導体装置及びその製造方法 Expired - Fee Related JP5800662B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011223300A JP5800662B2 (ja) 2011-10-07 2011-10-07 半導体装置及びその製造方法
US13/611,375 US9276028B2 (en) 2011-10-07 2012-09-12 Semiconductor device including pixels, microlenses, and a monitoring structure, and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011223300A JP5800662B2 (ja) 2011-10-07 2011-10-07 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2013084743A JP2013084743A (ja) 2013-05-09
JP2013084743A5 true JP2013084743A5 (https=) 2014-11-20
JP5800662B2 JP5800662B2 (ja) 2015-10-28

Family

ID=48041540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011223300A Expired - Fee Related JP5800662B2 (ja) 2011-10-07 2011-10-07 半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US9276028B2 (https=)
JP (1) JP5800662B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014112002A1 (ja) * 2013-01-15 2017-01-19 オリンパス株式会社 撮像素子、及び撮像装置
US20150064629A1 (en) * 2013-08-27 2015-03-05 Visera Technologies Company Limited Manufacturing method for microlenses
US10249661B2 (en) * 2014-08-22 2019-04-02 Visera Technologies Company Limited Imaging devices with dummy patterns
JP6927098B2 (ja) * 2018-03-13 2021-08-25 日本電信電話株式会社 レンズ集積受光素子及びその検査方法
US20190339422A1 (en) * 2018-05-03 2019-11-07 Visera Technologies Company Limited Method for forming micro-lens array and photomask therefor
TW202243239A (zh) * 2021-01-08 2022-11-01 日商索尼集團公司 顯示裝置及電子機器
WO2025249180A1 (ja) * 2024-05-30 2025-12-04 ソニーセミコンダクタソリューションズ株式会社 表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100628231B1 (ko) * 2004-12-30 2006-09-26 동부일렉트로닉스 주식회사 사각 마이크로렌즈를 갖는 이미지 센서 및 그 제조방법
JP2006253464A (ja) * 2005-03-11 2006-09-21 Fuji Photo Film Co Ltd マイクロレンズの製造方法及びこれを用いて製造した固体撮像素子
JP2006351853A (ja) * 2005-06-16 2006-12-28 Fujifilm Holdings Corp 固体撮像素子およびその製造方法
US8003983B2 (en) * 2006-04-19 2011-08-23 United Microelectronics Corp. Wafer for manufacturing image sensors, test key layout for defects inspection, and methods for manufacturing image sensors and for forming test key
US7612319B2 (en) * 2006-06-09 2009-11-03 Aptina Imaging Corporation Method and apparatus providing a microlens for an image sensor
US20110130508A1 (en) * 2009-07-29 2011-06-02 Alan David Pendley Topside optical adhesive for micro-optical film embedded into paper during the papermaking process

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