JP2020524276A5 - - Google Patents

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Publication number
JP2020524276A5
JP2020524276A5 JP2019570044A JP2019570044A JP2020524276A5 JP 2020524276 A5 JP2020524276 A5 JP 2020524276A5 JP 2019570044 A JP2019570044 A JP 2019570044A JP 2019570044 A JP2019570044 A JP 2019570044A JP 2020524276 A5 JP2020524276 A5 JP 2020524276A5
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JP
Japan
Prior art keywords
overlay target
imaging
design
optical system
scattering measurement
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JP2019570044A
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English (en)
Japanese (ja)
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JP2020524276A (ja
JP7018970B2 (ja
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Priority claimed from US15/995,731 external-priority patent/US11112369B2/en
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Publication of JP2020524276A publication Critical patent/JP2020524276A/ja
Publication of JP2020524276A5 publication Critical patent/JP2020524276A5/ja
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Publication of JP7018970B2 publication Critical patent/JP7018970B2/ja
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JP2019570044A 2017-06-19 2018-06-14 撮像ベースオーバーレイ及び散乱計測ベースオーバーレイのためのハイブリッドオーバーレイ標的設計 Active JP7018970B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762521782P 2017-06-19 2017-06-19
US62/521,782 2017-06-19
US15/995,731 2018-06-01
US15/995,731 US11112369B2 (en) 2017-06-19 2018-06-01 Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay
PCT/US2018/037430 WO2018236653A1 (en) 2017-06-19 2018-06-14 HYBRID RECOVERY TARGET DESIGN FOR IMAGING-BASED RECOVERY AND DIFFUSIOMETRY-BASED RECOVERY

Publications (3)

Publication Number Publication Date
JP2020524276A JP2020524276A (ja) 2020-08-13
JP2020524276A5 true JP2020524276A5 (https=) 2021-07-26
JP7018970B2 JP7018970B2 (ja) 2022-02-14

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ID=64657997

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019570044A Active JP7018970B2 (ja) 2017-06-19 2018-06-14 撮像ベースオーバーレイ及び散乱計測ベースオーバーレイのためのハイブリッドオーバーレイ標的設計

Country Status (8)

Country Link
US (1) US11112369B2 (https=)
EP (1) EP3635488A4 (https=)
JP (1) JP7018970B2 (https=)
KR (1) KR102353260B1 (https=)
CN (1) CN110770654B (https=)
SG (1) SG11201911992TA (https=)
TW (1) TWI752237B (https=)
WO (1) WO2018236653A1 (https=)

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US11809090B2 (en) * 2020-01-30 2023-11-07 Kla Corporation Composite overlay metrology target
US12100574B2 (en) * 2020-07-01 2024-09-24 Kla Corporation Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures
US11726410B2 (en) * 2021-04-20 2023-08-15 Kla Corporation Multi-resolution overlay metrology targets
US11703767B2 (en) 2021-06-28 2023-07-18 Kla Corporation Overlay mark design for electron beam overlay
US11720031B2 (en) 2021-06-28 2023-08-08 Kla Corporation Overlay design for electron beam and scatterometry overlay measurements
US11862524B2 (en) 2021-06-28 2024-01-02 Kla Corporation Overlay mark design for electron beam overlay
US12044982B2 (en) * 2021-12-02 2024-07-23 Micron Technology, Inc. Apparatuses and methods for diffraction base overlay measurements
US11796925B2 (en) * 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
US12094100B2 (en) * 2022-03-03 2024-09-17 Kla Corporation Measurement of stitching error using split targets
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
US12416867B2 (en) * 2022-09-22 2025-09-16 United Microelectronics Corp. Overlay target and overlay method
US20240110780A1 (en) * 2022-09-30 2024-04-04 Kla Corporation Mosaic overlay targets
KR102844370B1 (ko) * 2022-12-07 2025-08-08 (주) 오로스테크놀로지 업샘플링을 이용한 오버레이 측정 방법 및 장치와, 이를 이용한 반도체 소자의 제조 방법
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio
US20240337952A1 (en) * 2023-04-04 2024-10-10 Kla Corporation System and method for determining overlay measurement of a scanning target

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US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP2002231616A (ja) 2001-02-05 2002-08-16 Nikon Corp 位置計測装置及び方法、露光装置及び方法、並びにデバイス製造方法
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US7193715B2 (en) * 2002-11-14 2007-03-20 Tokyo Electron Limited Measurement of overlay using diffraction gratings when overlay exceeds the grating period
US7230703B2 (en) * 2003-07-17 2007-06-12 Tokyo Electron Limited Apparatus and method for measuring overlay by diffraction gratings
US7065737B2 (en) 2004-03-01 2006-06-20 Advanced Micro Devices, Inc Multi-layer overlay measurement and correction technique for IC manufacturing
US20060109463A1 (en) 2004-11-22 2006-05-25 Asml Netherlands B.V. Latent overlay metrology
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US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry

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