JP2013072139A - めっき遮蔽器具及びそれを具備しためっき装置 - Google Patents

めっき遮蔽器具及びそれを具備しためっき装置 Download PDF

Info

Publication number
JP2013072139A
JP2013072139A JP2011252449A JP2011252449A JP2013072139A JP 2013072139 A JP2013072139 A JP 2013072139A JP 2011252449 A JP2011252449 A JP 2011252449A JP 2011252449 A JP2011252449 A JP 2011252449A JP 2013072139 A JP2013072139 A JP 2013072139A
Authority
JP
Japan
Prior art keywords
opening
plating
closing
shielding
gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011252449A
Other languages
English (en)
Japanese (ja)
Inventor
Da Mi Shim
ミ シム、ダ
Jung Wook Seo
ウク セオ、ジュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of JP2013072139A publication Critical patent/JP2013072139A/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2011252449A 2011-09-27 2011-11-18 めっき遮蔽器具及びそれを具備しためっき装置 Pending JP2013072139A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110097581A KR20130033722A (ko) 2011-09-27 2011-09-27 도금 차폐 기구 및 이를 구비한 도금 장치
KR10-2011-0097581 2011-09-27

Publications (1)

Publication Number Publication Date
JP2013072139A true JP2013072139A (ja) 2013-04-22

Family

ID=48436040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011252449A Pending JP2013072139A (ja) 2011-09-27 2011-11-18 めっき遮蔽器具及びそれを具備しためっき装置

Country Status (2)

Country Link
JP (1) JP2013072139A (ko)
KR (1) KR20130033722A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104651912A (zh) * 2015-01-29 2015-05-27 深圳崇达多层线路板有限公司 一种电镀浮架
JP2018119219A (ja) * 2014-12-26 2018-08-02 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
CN109537032A (zh) * 2017-09-22 2019-03-29 株式会社荏原制作所 镀覆装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6538541B2 (ja) * 2015-12-21 2019-07-03 株式会社荏原製作所 レギュレーションプレート、これを備えためっき装置及びめっき方法
KR101900692B1 (ko) * 2016-12-28 2018-09-20 주식회사 필머티리얼즈 미세 금속 마스크 제조 장치
CN117552071B (zh) * 2024-01-11 2024-03-29 宁波惠金理化电子有限公司 一种五金电镀设备及其使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPH11246999A (ja) * 1998-03-03 1999-09-14 Ebara Corp ウエハのメッキ方法及び装置
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633500A (en) * 1979-08-28 1981-04-03 Fujitsu Ltd Averaging apparatus of distribution of plating electric current
JPH11246999A (ja) * 1998-03-03 1999-09-14 Ebara Corp ウエハのメッキ方法及び装置
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018119219A (ja) * 2014-12-26 2018-08-02 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
US11037791B2 (en) 2014-12-26 2021-06-15 Ebara Corporation Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus
CN104651912A (zh) * 2015-01-29 2015-05-27 深圳崇达多层线路板有限公司 一种电镀浮架
CN109537032A (zh) * 2017-09-22 2019-03-29 株式会社荏原制作所 镀覆装置
KR20190034073A (ko) * 2017-09-22 2019-04-01 가부시키가이샤 에바라 세이사꾸쇼 도금 장치
US11332838B2 (en) 2017-09-22 2022-05-17 Ebara Corporation Plating apparatus
TWI779099B (zh) * 2017-09-22 2022-10-01 日商荏原製作所股份有限公司 鍍覆裝置
CN109537032B (zh) * 2017-09-22 2022-11-08 株式会社荏原制作所 镀覆装置
KR102530410B1 (ko) * 2017-09-22 2023-05-09 가부시키가이샤 에바라 세이사꾸쇼 도금 장치

Also Published As

Publication number Publication date
KR20130033722A (ko) 2013-04-04

Similar Documents

Publication Publication Date Title
JP2013072139A (ja) めっき遮蔽器具及びそれを具備しためっき装置
CN103866229B (zh) 用于薄膜气相沉积的掩模组件及其制造方法
KR20170091243A (ko) 마스크 프레임 조립체 및 이를 이용한 디스플레이 장치의 제조방법
TW201625962A (zh) 包括垂直探針之測試頭
US20130014383A1 (en) Manipulator, loader, and positioning structure for production line
US9523647B2 (en) Backlight inspection equipment
JP2017536687A (ja) ハイブリッドアライメント
JP6484136B2 (ja) 接触検査装置
JP2006312231A (ja) 切り換え可能な磁気装置
JP2013191675A (ja) 自動半田付け装置
TWI331221B (en) Probe assembly for inspecting of flat panel display
US7999564B2 (en) Replaceable probe apparatus for probing semiconductor wafer
JP2016025201A (ja) ノズル交換装置
CN109581006A (zh) 探针装置及其矩形探针
JP6304855B2 (ja) 電子部品実装装置
CN208622696U (zh) 一种角度调节装置
JP6137661B2 (ja) 位置決め装置
JP4581641B2 (ja) 平面ステージ
KR200293609Y1 (ko) 스티로폼 가공장치
JP2011018817A (ja) 電子部品の装着ヘッド、電子部品の吸着ノズル及び電子部品装着装置
JP2001264640A (ja) 顕微鏡ステージ
KR101239322B1 (ko) 미리 정해진 패턴으로 기판에 범프를 형성하는 방법 및 이에 사용되는 솔더볼 전사 장치
TWI818038B (zh) 濺鍍裝置
JP6895907B2 (ja) ウエハ裏面検査対応インク打点装置
KR101392172B1 (ko) 광원 정렬 기구

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131025

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131029

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140401